5962-9224201MSX概述

Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CERPACK-20

5962-9224201MSX规格参数

参数名称	属性值
零件包装代码	DFP
包装说明	DFP,
针数	20
Reach Compliance Code	unknow
其他特性	WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION
系列	FCT
JESD-609代码	e0
逻辑集成电路类型	BUS TRANSCEIVER
位数	8
功能数量	1
端口数量	2
最高工作温度	125 °C
最低工作温度	-55 °C
输出特性	3-STATE
输出极性	TRUE
封装主体材料	CERAMIC, GLASS-SEALED
封装代码	DFP
封装形式	FLATPACK
传播延迟（tpd）	9.5 ns
认证状态	Not Qualified
筛选级别	MIL-STD-883
座面最大高度	2.3368 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子面层	TIN LEAD
端子形式	FLAT
端子节距	1.27 mm
端子位置	DUAL
宽度	6.9215 mm
Base Number Matches	1

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5962-9224201MSX相似产品对比

	5962-9224201MSX	5962-9224202MSX	5962-9224201MRX	5962-9224202M2X	5962-9224202MRX	5962-9224201M2X
描述	Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CERPACK-20	Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CERPACK-20	Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, 0.300 INCH, CERDIP-20	Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC20	Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, 0.300 INCH, CERDIP-20	Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC20
包装说明	DFP,	DFP,	DIP,	QCCN,	DIP,	QCCN,
Reach Compliance Code	unknow	unknow	unknown	unknown	unknown	unknown
其他特性	WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION	WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION	WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION	WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION	WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION	WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION
系列	FCT	FCT	FCT	FCT	FCT	FCT
逻辑集成电路类型	BUS TRANSCEIVER	BUS TRANSCEIVER	BUS TRANSCEIVER	BUS TRANSCEIVER	BUS TRANSCEIVER	BUS TRANSCEIVER
位数	8	8	8	8	8	8
功能数量	1	1	1	1	1	1
端口数量	2	2	2	2	2	2
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
输出极性	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
封装主体材料	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
封装代码	DFP	DFP	DIP	QCCN	DIP	QCCN
封装形式	FLATPACK	FLATPACK	IN-LINE	CHIP CARRIER	IN-LINE	CHIP CARRIER
传播延迟（tpd）	9.5 ns	6.3 ns	9.5 ns	6.3 ns	6.3 ns	9.5 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.3368 mm	2.3368 mm	5.08 mm	2.54 mm	5.08 mm	2.54 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	NO	YES	NO	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	FLAT	FLAT	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD
端子节距	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	QUAD	DUAL	QUAD
宽度	6.9215 mm	6.9215 mm	7.62 mm	8.89 mm	7.62 mm	8.89 mm
Base Number Matches	1	1	1	1	1	1
零件包装代码	DFP	DFP	DIP	-	DIP	-
针数	20	20	20	-	20	-
JESD-609代码	e0	e0	e0	-	e0	-
筛选级别	MIL-STD-883	MIL-STD-883	MIL-STD-883	-	MIL-STD-883	-
端子面层	TIN LEAD	TIN LEAD	TIN LEAD	-	TIN LEAD	-
长度	-	-	25.3365 mm	8.89 mm	25.3365 mm	8.89 mm

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