High-Voltage High-Current Darlington Array
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Microchip(微芯科技) |
零件包装代码 | DIP |
包装说明 | IN-LINE, R-PDIP-T18 |
针数 | 18 |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
其他特性 | LOGIC LEVEL COMPATIBLE |
最大集电极电流 (IC) | 0.5 A |
集电极-发射极最大电压 | 50 V |
配置 | 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR |
JESD-30 代码 | R-PDIP-T18 |
JESD-609代码 | e0 |
元件数量 | 8 |
端子数量 | 18 |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
极性/信道类型 | NPN |
认证状态 | Not Qualified |
表面贴装 | NO |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子位置 | DUAL |
晶体管应用 | SWITCHING |
晶体管元件材料 | SILICON |
最大关闭时间(toff) | 1000 ns |
最大开启时间(吨) | 1000 ns |
MIC2803BN | MIC2803 | MIC2803BWM | MIC2804 | MIC2804BN | MIC2804BWM | |
---|---|---|---|---|---|---|
描述 | High-Voltage High-Current Darlington Array | High-Voltage High-Current Darlington Array | High-Voltage High-Current Darlington Array | High-Voltage High-Current Darlington Array | High-Voltage High-Current Darlington Array | High-Voltage High-Current Darlington Array |
是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 | 不符合 |
厂商名称 | Microchip(微芯科技) | - | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) |
零件包装代码 | DIP | - | SOIC | - | DIP | SOIC |
包装说明 | IN-LINE, R-PDIP-T18 | - | SMALL OUTLINE, R-PDSO-G18 | - | IN-LINE, R-PDIP-T18 | SMALL OUTLINE, R-PDSO-G18 |
针数 | 18 | - | 18 | - | 18 | 18 |
Reach Compliance Code | unknow | - | unknow | - | unknow | unknow |
ECCN代码 | EAR99 | - | EAR99 | - | EAR99 | EAR99 |
其他特性 | LOGIC LEVEL COMPATIBLE | - | LOGIC LEVEL COMPATIBLE | - | LOGIC LEVEL COMPATIBLE | LOGIC LEVEL COMPATIBLE |
最大集电极电流 (IC) | 0.5 A | - | 0.5 A | - | 0.5 A | 0.5 A |
集电极-发射极最大电压 | 50 V | - | 50 V | - | 50 V | 50 V |
配置 | 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR | - | 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR | - | 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR | 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR |
JESD-30 代码 | R-PDIP-T18 | - | R-PDSO-G18 | - | R-PDIP-T18 | R-PDSO-G18 |
JESD-609代码 | e0 | - | e0 | - | e0 | e0 |
元件数量 | 8 | - | 8 | - | 8 | 8 |
端子数量 | 18 | - | 18 | - | 18 | 18 |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装形状 | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | - | SMALL OUTLINE | - | IN-LINE | SMALL OUTLINE |
极性/信道类型 | NPN | - | NPN | - | NPN | NPN |
认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified |
表面贴装 | NO | - | YES | - | NO | YES |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | - | GULL WING | - | THROUGH-HOLE | GULL WING |
端子位置 | DUAL | - | DUAL | - | DUAL | DUAL |
晶体管应用 | SWITCHING | - | SWITCHING | - | SWITCHING | SWITCHING |
晶体管元件材料 | SILICON | - | SILICON | - | SILICON | SILICON |
最大关闭时间(toff) | 1000 ns | - | 1000 ns | - | 1000 ns | 1000 ns |
最大开启时间(吨) | 1000 ns | - | 1000 ns | - | 1000 ns | 1000 ns |
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