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Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> IBM25PPC440GX-3CC533C

IBM25PPC440GX-3CC533C: 产品描述RISC Microprocessor, 32-Bit, 533MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小2MB，共76页; 制造商IBM; 官网地址http://www.ibm.com

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IBM25PPC440GX-3CC533C概述

RISC Microprocessor, 32-Bit, 533MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552

IBM25PPC440GX-3CC533C规格参数

参数名称	属性值
厂商名称	IBM
零件包装代码	BGA
包装说明	BGA, BGA552,24X24,40
针数	552
Reach Compliance Code	unknown
ECCN代码	3A001.A.3
其他特性	ALSO REQUIRES 3.3V SUPPLY
地址总线宽度	64
位大小	32
边界扫描	YES
最大时钟频率	83.33 MHz
外部数据总线宽度	64
格式	FIXED POINT
集成缓存	YES
JESD-30 代码	S-CBGA-B552
长度	25 mm
低功率模式	YES
端子数量	552
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	BGA
封装等效代码	BGA552,24X24,40
封装形状	SQUARE
封装形式	GRID ARRAY
电源	1.5,2.5,3.3 V
认证状态	Not Qualified
座面最大高度	3.977 mm
速度	533 MHz
最大压摆率	2200 mA
最大供电电压	1.6 V
最小供电电压	1.4 V
标称供电电压	1.5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
宽度	25 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC
Base Number Matches	1

IBM25PPC440GX-3CC533C相似产品对比

	IBM25PPC440GX-3CC533C	IBM25PPC440GX-3FC533C	IBM25PPC440GX-3FB533C	IBM25PPC440GX-3CC800C	IBM25PPC440GX-3CB533C	IBM25PPC440GX-3CA500C	IBM25PPC440GX-3CB667C	IBM25PPC440GX-3CA667C	IBM25PPC440GX-3CC533E	IBM25PPC440GX-3CC667C
描述	RISC Microprocessor, 32-Bit, 533MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552	RISC Microprocessor, 32-Bit, 533MHz, CMOS, PBGA552, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552	RISC Microprocessor, 32-Bit, 533MHz, CMOS, PBGA552, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552	RISC Microprocessor, 32-Bit, 800MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552	RISC Microprocessor, 32-Bit, 533MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552	RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552	RISC Microprocessor, 32-Bit, 667MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552	RISC Microprocessor, 32-Bit, 667MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552	RISC Microprocessor, 32-Bit, 533MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552	RISC Microprocessor, 32-Bit, 667MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552
厂商名称	IBM	IBM	IBM	IBM	IBM	IBM	IBM	IBM	IBM	IBM
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	BGA, BGA552,24X24,40	BGA, BGA552,24X24,40	BGA, BGA552,24X24,40	BGA, BGA552,24X24,40	BGA, BGA552,24X24,40	BGA, BGA552,24X24,40	BGA, BGA552,24X24,40	BGA, BGA552,24X24,40	BGA, BGA552,24X24,40	BGA, BGA552,24X24,40
针数	552	552	552	552	552	552	552	552	552	552
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
其他特性	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY
地址总线宽度	64	64	64	64	64	64	64	64	64	64
位大小	32	32	32	32	32	32	32	32	32	32
边界扫描	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
最大时钟频率	83.33 MHz	83.33 MHz	83.33 MHz	83.33 MHz	83.33 MHz	83.33 MHz	83.33 MHz	83.33 MHz	83.33 MHz	83.33 MHz
外部数据总线宽度	64	64	64	64	64	64	64	64	64	64
格式	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
集成缓存	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-CBGA-B552	S-PBGA-B552	S-PBGA-B552	S-CBGA-B552	S-CBGA-B552	S-CBGA-B552	S-CBGA-B552	S-CBGA-B552	S-CBGA-B552	S-CBGA-B552
长度	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm
低功率模式	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
端子数量	552	552	552	552	552	552	552	552	552	552
封装主体材料	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
封装等效代码	BGA552,24X24,40	BGA552,24X24,40	BGA552,24X24,40	BGA552,24X24,40	BGA552,24X24,40	BGA552,24X24,40	BGA552,24X24,40	BGA552,24X24,40	BGA552,24X24,40	BGA552,24X24,40
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
电源	1.5,2.5,3.3 V	1.5,2.5,3.3 V	1.5,2.5,3.3 V	1.5,2.5,3.3 V	1.5,2.5,3.3 V	1.5,2.5,3.3 V	1.5,2.5,3.3 V	1.5,2.5,3.3 V	1.5,2.5,3.3 V	1.5,2.5,3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	3.977 mm	3.361 mm	3.361 mm	3.977 mm	3.977 mm	3.977 mm	3.977 mm	3.977 mm	3.977 mm	3.977 mm
速度	533 MHz	533 MHz	533 MHz	800 MHz	533 MHz	500 MHz	667 MHz	667 MHz	533 MHz	667 MHz
最大压摆率	2200 mA	2200 mA	2200 mA	2200 mA	2200 mA	2200 mA	2200 mA	2200 mA	2200 mA	2200 mA
最大供电电压	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V
最小供电电压	1.4 V	1.4 V	1.4 V	1.5 V	1.4 V	1.4 V	1.5 V	1.5 V	1.4 V	1.5 V
标称供电电压	1.5 V	1.5 V	1.5 V	1.55 V	1.5 V	1.5 V	1.55 V	1.55 V	1.5 V	1.55 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
宽度	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	1	1	1	1	1	1	1	1	1	1
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	-	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL

IBM25PPC440GX-3CC533C

IBM25PPC440GX-3CC533C概述

IBM25PPC440GX-3CC533C规格参数

IBM25PPC440GX-3CC533C相似产品对比

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