Nibble Mode DRAM, 1MX1, 100ns, CMOS, PDSO20, PLASTIC, SOJ-26/20
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | SAMSUNG(三星) |
| 零件包装代码 | SOJ |
| 包装说明 | SOJ, SOJ20/26,.34 |
| 针数 | 20 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 访问模式 | NIBBLE |
| 最长访问时间 | 100 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O 类型 | SEPARATE |
| JESD-30 代码 | R-PDSO-J20 |
| JESD-609代码 | e0 |
| 长度 | 17.145 mm |
| 内存密度 | 1048576 bi |
| 内存集成电路类型 | NIBBLE MODE DRAM |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 20 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX1 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装等效代码 | SOJ20/26,.34 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 512 |
| 座面最大高度 | 3.68 mm |
| 最大待机电流 | 0.001 A |
| 最大压摆率 | 0.065 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| KM41C1001BJ-10 | KM41C1001BZ-10 | KM41C1001BZ-8 | KM41C1001BJ-8 | KM41C1001BJ-6 | KM41C1001BZ-6 | KM41C1001BJ-7 | KM41C1001BP-10 | KM41C1001BP-6 | KM41C1001BP-7 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Nibble Mode DRAM, 1MX1, 100ns, CMOS, PDSO20, PLASTIC, SOJ-26/20 | Nibble Mode DRAM, 1MX1, 100ns, CMOS, PZIP19, PLASTIC, ZIP-20/19 | Nibble Mode DRAM, 1MX1, 80ns, CMOS, PZIP19, PLASTIC, ZIP-20/19 | Nibble Mode DRAM, 1MX1, 80ns, CMOS, PDSO20, PLASTIC, SOJ-26/20 | Nibble Mode DRAM, 1MX1, 60ns, CMOS, PDSO20, PLASTIC, SOJ-26/20 | Nibble Mode DRAM, 1MX1, 60ns, CMOS, PZIP19, PLASTIC, ZIP-20/19 | Nibble Mode DRAM, 1MX1, 70ns, CMOS, PDSO20, PLASTIC, SOJ-26/20 | Nibble Mode DRAM, 1MX1, 100ns, CMOS, PDIP18, PLASTIC, DIP-18 | Nibble Mode DRAM, 1MX1, 60ns, CMOS, PDIP18, PLASTIC, DIP-18 | Nibble Mode DRAM, 1MX1, 70ns, CMOS, PDIP18, PLASTIC, DIP-18 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
| 零件包装代码 | SOJ | ZIP | ZIP | SOJ | SOJ | ZIP | SOJ | DIP | DIP | DIP |
| 包装说明 | SOJ, SOJ20/26,.34 | ZIP, ZIP20,.1 | ZIP, ZIP20,.1 | SOJ, SOJ20/26,.34 | SOJ, SOJ20/26,.34 | ZIP, ZIP20,.1 | SOJ, SOJ20/26,.34 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 18 | 18 | 18 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE |
| 最长访问时间 | 100 ns | 100 ns | 80 ns | 80 ns | 60 ns | 60 ns | 70 ns | 100 ns | 60 ns | 70 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-PDSO-J20 | R-PZIP-T19 | R-PZIP-T19 | R-PDSO-J20 | R-PDSO-J20 | R-PZIP-T19 | R-PDSO-J20 | R-PDIP-T18 | R-PDIP-T18 | R-PDIP-T18 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 17.145 mm | 26.165 mm | 26.165 mm | 17.145 mm | 17.145 mm | 26.165 mm | 17.145 mm | 22.02 mm | 22.02 mm | 22.02 mm |
| 内存密度 | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 19 | 19 | 20 | 20 | 19 | 20 | 18 | 18 | 18 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | ZIP | ZIP | SOJ | SOJ | ZIP | SOJ | DIP | DIP | DIP |
| 封装等效代码 | SOJ20/26,.34 | ZIP20,.1 | ZIP20,.1 | SOJ20/26,.34 | SOJ20/26,.34 | ZIP20,.1 | SOJ20/26,.34 | DIP18,.3 | DIP18,.3 | DIP18,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| 座面最大高度 | 3.68 mm | 10.16 mm | 10.16 mm | 3.68 mm | 3.68 mm | 10.16 mm | 3.68 mm | 4.65 mm | 4.65 mm | 4.65 mm |
| 最大待机电流 | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
| 最大压摆率 | 0.065 mA | 0.065 mA | 0.075 mA | 0.075 mA | 0.095 mA | 0.095 mA | 0.085 mA | 0.065 mA | 0.095 mA | 0.085 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES | NO | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | ZIG-ZAG | ZIG-ZAG | DUAL | DUAL | ZIG-ZAG | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 2.96 mm | 2.96 mm | 7.62 mm | 7.62 mm | 2.96 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
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