MAX4649EKA
Rev. A
RELIABILITY REPORT
FOR
MAX4649EKA
PLASTIC ENCAPSULATED DEVICES
August 20, 2002
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Bryan J. Preeshl
Quality Assurance
Executive Director
Conclusion
The MAX4649 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
IV. .......Die Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
......Attachments
I. Device Description
A. General
The MAX4649 is a dual-supply, single-pole/double-throw (SPDT) analog switch. On-resistance is 45 max and flat (7
max) over the specified signal range. The MAX4649 can handle Rail-to-Rail
®
analog signals, and conducts analog or
digital signals equally well in either direction. This switch operates from a single +9V to +36V supply, or from ±4.5V
to ±20V dual supplies. The primary application areas are in the switching and routing of signals in
telecommunications and test equipment.
The MAX4649 features a switch transition time of 130ns max at +25°C, and a guaranteed break-before-make
switching time of 5ns. Off-leakage current is only 2nA max at +25°C.
The MAX4649 is available in a tiny 8-pin SOT23 package.
B. Absolute Maximum Ratings
Item
V+
V-
V+ to V-
All Other Pins (Note 1)
Continuous Current into any Terminal
Continuous Current (COM, NO, NC)
Peak Current (COM, NO, NC) (pulsed at 1ms, 10% duty cycle)
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Lead Temperature (soldering, 10s)
Continuous Power Dissipation (TA = +70°C)
8-Pin SOT23
Derates above +70°C
8-Pin SOT23
Rating
-0.3V to +44.0V
-44.0V to +0.3V
-0.3V to +44.0V
(V- - 0.3V) to (V+ + 0.3V)
±10mA
±30mA
±60mA
-40°C to +85°C
-65°C to +150°C
+150°C
+300°C
714mW
8.9mW/°C
Note 1: Signals on NO, NC, COM, or IN exceeding V+ or V- are clamped by internal diodes. Limit forward-diode
current to maximum current rating.
II. Manufacturing Information
A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
Octal 8-Bit Serial DAC with Output Buffer
SG5 (Standard 5 micron silicon gate CMOS)
33
Oregon, USA
Malaysia
January, 2001
III. Packaging Information
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
8-Pin SOT23
Copper
Solder Plate
Silver-filled Epoxy
Gold (1.0 mil dia.)
Epoxy with silica filler
Buildsheet # 05-1201-0218
Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-A112: Level 1
IV. Die Information
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
57 x 43 mils
SiN/SiO (nitride/oxide)
Aluminum/Si (Si = 1%)
None
5 microns (as drawn)
5 microns (as drawn)
5 mil. Sq.
SiO
2
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts: : Jim Pedicord (Reliability Lab Manager)
Bryan Preeshl (Executive Director)
Kenneth Huening (Vice President)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 100 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in
Table 1.
Using these results, the Failure Rate
(λ) is calculated as follows:
λ
=
1
=
MTTF
1.83
(Chi square value for MTTF upper limit)
192 x 4389 x 80 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ
= 13.57 x 10
-9
λ
= 13.57 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability monitor program. I addition to
n
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-5703) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1I).
B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85°C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing
The AH58 die type has been found to have all pins able to withstand a transient pulse of
±
400V, per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of
±100mA
and/or
±20V.
Table 1
Reliability Evaluation Test Results
MAX4649EKA
TEST ITEM
TEST CONDITION
FAILURE
IDENTIFICATION
PACKAGE
SAMPLE
SIZE
NUMBER OF
FAILURES
Static Life Test
(Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Moisture Testing
(Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 96hrs.
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
80
0
DC Parameters
& functionality
SOT
77
0
85/85
DC Parameters
& functionality
77
0
Mechanical Stress
(Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
DC Parameters
77
0
Note 1: Life Test Data may represent plastic D.I.P. qualification lots.
Note 2: Generic Package/Process data
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