19-6053; Rev 0; 11/11
MAX16126/MAX16127
Load-Dump/Reverse-Voltage Protection Circuits
General Description
The MAX16126/MAX16127 load-dump/reverse-voltage
protection circuits protect power supplies from dam-
aging input voltage conditions, including overvoltage,
reverse-voltage, and high-voltage transient pulses. Using
a built-in charge pump, the devices control two exter-
nal back-to-back n-channel MOSFETs that turn off and
isolate downstream power supplies during damaging
input conditions, such as an automotive load-dump pulse
or a reverse-battery condition. Operation is guaranteed
down to 3V to ensure proper operation during automo-
tive cold-crank conditions. These devices feature a flag
output (FLAG) that asserts during fault conditions.
For reverse-voltage protection, external back-to-back
MOSFETs outperform the traditional reverse-battery
diode, minimizing the voltage drop and power dissipa-
tion during normal operation.
The MAX16126/MAX16127 use external resistors to
adjust the overvoltage and undervoltage comparator
thresholds for maximum flexibility.
The MAX16127 provides limiter-mode fault manage-
ment for overvoltage and thermal shutdown conditions;
whereas the MAX16126 provides switch-mode fault
management for overvoltage and thermal shutdown con-
ditions. In the limiter mode, the output voltage is limited
and
FLAG
is asserted low during a fault. In the switch
mode, the external MOSFETs are switched off and
FLAG
is asserted low after a fault. The switch mode is available
in four options: latch mode, 1 autoretry mode, 3 autoretry
mode, and always autoretry mode.
The MAX16126/MAX16127 are available in 12-pin TQFN
packages. These devices operate over the automotive
temperature range (-40NC to +125NC).
Benefits and Features
S
Operates Down to +3V, Riding Out Cold-Crank
Conditions
S
-30V to +90V Wide Input Voltage Protection Range
S
Minimal Operating Voltage Drop Reverse-Voltage
Protection
S
Fast Gate Shutoff During Fault Conditions with
Complete Load Isolation
S
Adjustable Undervoltage/Overvoltage Thresholds
S
Thermal Shutdown Protection
S
Low Supply Current and Low Shutdown Current
S
Charge-Pump Circuit Enhances External
n-Channel MOSFETs
S
FLAG
Output Identifies Fault Condition
S
Automotive Qualified
S
-40NC to +125NC Operating Temperature Range
S
Available in 3mm x 3mm, 12-Pin TQFN Package
Ordering Information
appears at end of data sheet.
For related parts and recommended products to use with this part,
refer to
www.maxim-ic.com/MAX16126.related.
Applications
Automotive
Industrial
Avionics
Telecom/Server/Networking
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Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
MAX16126/MAX16127
Load-Dump/Reverse-Voltage Protection Circuits
ABSOLUTE MAXIMUM RATINGS
(All pins referenced to GND.)
IN ............................................................................-30V to +90V
SHDN
............................................-0.3V to max (0V, V
IN
+ 0.3V)
TERM ............................................-0.3V to max (0V, V
IN
+ 0.3V)
SRC, GATE .............................................................-30V to +45V
SRC to GATE ..........................................................-30V to +30V
OUT .......................................................................-0.3V to +45V
FLAG
.....................................................................-0.3V to +45V
OVSET, UVSET ........................................................-0.3V to +6V
Continuous Sink/Source (all pins) .................................
Q100mA
Continuous Power Dissipation (T
A
= +70NC) (multilayer board)
TQFN (derate 14.7mW/NC above +70NC)...............1176.5mW
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -60NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
)
..........68NC/W
Junction-to-Case Thermal Resistance (B
JC
)
...............11NC/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
IN
= 12V, C
GATE-SOURCE
= 1nF, T
A
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC.) (Note 2)
PARAMETER
Input Voltage Range
Input Supply Current
SRC Input Current
IN Undervoltage Lockout
OVSET/UVSET Input Current
OVSET/UVSET Threshold (Rising)
OVSET/UVSET Threshold Hysteresis
POK Threshold Rising
POK Threshold Falling
TERM On-Resistance
Startup Response Time
Autoretry Timeout
GATE Rise Time
OVSET to GATE Propagation Delay
UVSET to GATE Propagation Delay
SYMBOL
V
IN
I
IN
I
SRC
V
UVLO
I
UVSET/OVSET
V
TH
V
TH-HYS
V
POK+
V
POK-
R
TERM
t
START
t
RETRY
t
RISE
t
OVG
t
UVG
V
GATE
rising (GND to V
SRC
+ 6V)
V
OVSET
rising (V
TH
- 100mV to
V
TH
+ 100mV)
V
UVSET
rising (V
TH
- 100mV to
V
TH
+100mV)
20
(Note 3)
V
IN
rising
1.2
1.225
5
0.9 x V
IN
0.87 x V
IN
0.7
150
150
1
0.55
1.2
V
IN
rising
CONDITIONS
Operating range
Protection range
SHDN
= high
SHDN
= low
MIN
3
-30
224
34
75
TYP
MAX
24
+90
320
50
110
2.8
500
1.25
UNITS
V
FA
FA
V
nA
V
%
V
V
kI
Fs
ms
ms
Fs
Fs
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Maxim Integrated Products
2
MAX16126/MAX16127
Load-Dump/Reverse-Voltage Protection Circuits
ELECTRICAL CHARACTERISTICS (continued)
(V
IN
= 12V, C
GATE-SOURCE
= 1nF, T
A
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC.) (Note 2)
PARAMETER
OVSET to
FLAG
Propagation Delay
SYMBOL
t
OV
CONDITIONS
V
OVSET
rising (V
TH
- 100mV to
V
TH
+ 100mV)
V
IN
= V
SRC
= V
OUT
= 3V,
I
GATE
= -1FA
V
IN
= V
SRC
= V
OUT
= 12V,
I
GATE
= -1FA
V
GATE
= 12V
V
IN
= V
GATE
= V
SRC
= 12V
4.3
6.25
8.8
155
+145
15
1.4
0.4
6
0.8
FLAG
sinking 1mA
V
FLAG
= 12V
1.2
0.4
0.5
MIN
TYP
0.3
4.7
7
6
V
8
mA
FA
NC
NC
V
V
Fs
FA
V
FA
MAX
UNITS
Fs
GATE Output Voltage High Above
V
SRC
GATE Pulldown Current
GATE Charge-Pump Current
Thermal Shutdown
Thermal Shutdown Hysteresis
SHDN
Logic-High Input Voltage
SHDN
Logic-Low Input Voltage
SHDN
Input Pulse Width
SHDN
Input Pulldown Current
FLAG
Output Voltage Low
FLAG
Leakage Current
V
OHGATE
I
PD
I
GATE
T
+
δT
V
IH
V
IL
t
PW
I
SPD
V
OL
I
IL
Note 2:
All parameters are production tested at T
A
= +25NC. Limits over the operating temperature range are guaranteed by
design.
Note 3:
The MAX16126/MAX16127 power up with the external MOSFETs in off mode (V
GATE
= V
SRC
). The external MOSFETs turn
on t
START
after the IC is powered up and all input conditions are valid.
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Maxim Integrated Products
3
MAX16126/MAX16127
Load-Dump/Reverse-Voltage Protection Circuits
Typical Operating Characteristics
(V
IN
= 12V, T
A
= +25NC, unless otherwise noted.)
SUPPLY CURRENT vs. SUPPLY VOLTAGE
MAX16126 toc01
SUPPLY CURRENT vs. TEMPERATURE
MAX16126 toc02
300
SHDN = HIGH
GATE ENHANCED
250
SUPPLY CURRENT (µA)
200
150
100
50
0
10
20
SUPPLY VOLTAGE (V)
30
310
290
SUPPLY CURRENT (µA)
270
250
230
210
190
170
150
SHDN = HIGH
GATE ENHANCED
SHUTDOWN SUPPLY CURRENT
vs. SUPPLY VOLTAGE
90
SUPPLY CURRENT (µA)
80
70
60
50
40
30
20
SHDN = LOW
MAX16126 toc03
100
40
-40 -20
0
20
40
60
80
100 120
10
0
6
12
18
24
30
SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
SHUTDOWN SUPPLY CURRENT
vs. TEMPERATURE
MAX16126 toc04
SHDN PULLDOWN CURRENT
vs. TEMPERATURE
0.9
SHDN PULLDOWN CURRENT (µA)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
MAX16126 toc05
GATE TO SOURCE VOLTAGE
vs. SUPPLY VOLTAGE
9
8
(V
GATE
- V
SRC
) (V)
MAX16126 toc06
50
45
SUPPLY CURRENT (µA)
40
35
30
25
20
15
10
SHDN = LOW
1.0
10
7
6
5
4
3
2
3
6
9
12
15
18
SUPPLY VOLTAGE (V)
21
24
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
GATE-TO-SOURCE VOLTAGE
vs. TEMPERATURE
MAX16126 toc07
GATE PULLDOWN CURRENT
vs. TEMPERATURE
MAX16126 toc08
GATE PULLUP CURRENT
vs. SUPPLY VOLTAGE
165
GATE PULLUP CURRENT (µA)
160
155
150
145
140
135
V
IN
= V
GATE
= V
SRC
GATE ENHANCED
0
5
10
15
20
25
30
MAX16126 toc09
8.0
7.5
7.0
(V
GATE
- V
SRC
) (V)
6.5
6.0
5.5
5.0
4.5
4.0
GATE ENHANCED
V
IN
= V
SRC
= V
OUT
20
GATE PULLDOWN CURRENT (mA)
17
14
11
8
5
V
GATE
= 12V
V
SRC
= GND
170
130
-40 -25 -10 5 20 35 50 65 80 95 110 125
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
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Maxim Integrated Products
4
MAX16126/MAX16127
Load-Dump/Reverse-Voltage Protection Circuits
Typical Operating Characteristics (continued)
(V
IN
= 12V, T
A
= +25NC, unless otherwise noted.)
OVSET THRESHOLD vs. TEMPERATURE
MAX16126 toc10a
UVSET THRESHOLD vs. TEMPERATURE
MAX16126 toc10b
1.5
RISING
1.3
OVSET THRESHOLD (V)
1.1
FALLING
0.9
0.7
0.5
1.5
RISING
1.3
UVSET THRESHOLD (V)
1.1
FALLING
0.9
0.7
0.5
FLAG OUTPUT LOW VOLTAGE
vs. CURRENT
MAX16126 toc11
0.5
0.4
FLAG VOLTAGE (V)
0.3
0.2
0.1
0
0
0.5
1.0
FLAG CURRENT (mA)
1.5
-40 -25 -10 5 20 35 50 65 80 95 110 125
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
TEMPERATURE (°C)
2.0
OVERVOLTAGE FAULT TO GATE
PROPAGATION DELAY vs. TEMPERATURE
V
OVSET
PULSED FROM
(V
TH
- 100mV) TO (V
TH
+ 100mV)
PROPAGATION DELAY (µs)
0.75
MAX16126 toc12
REVERSE CURRENT
vs. REVERSE VOLTAGE
MAX16126 toc13
1.00
30
25
REVERSE CURRENT (µA)
20
15
10
5
0.50
0.25
0
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
0
0
5
10
15
20
25
30
REVERSE VOLTAGE (V)
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Maxim Integrated Products
5
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