Ball Grid Array
(BGA) Sockets
5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com
Standard Socket (S)
• Mates with Standard Adapter (A)
Now Available In
0.75mm Pitch
•
Socket size:
same size as BGA device body
• Use with SMT Adapter for LGA and
reworked BGA device socketing (see pg. 7)
(Bottom view shown)
Extraction Socket (SB)
• Mates with Extraction Slot Adapter (AX)
•
Socket size:
BGA device body + .079/(2.0)
• Protects valuable PCB during device/Adapter
extraction – tool never touches PCB
• Available in 1.0, 1.27 and 1.5mm pitch only
(Bottom view shown)
Socket Features
• Advanced
®
exclusive eutectic solder
ball terminals offer superior SMT
processing.
• Uses same footprint as BGA device.
• Proven long-term performance in
vigorous temperature cycling applica-
tions – solder ball terminal absorbs
TCE mismatch.
• Closed bottom socket terminal for
100% anti-wicking of solder.
• Gold contacts allow gold/gold intercon-
nections to male Adapter pins.
• Low insertion force socket with multi-
fingered high reliability Beryllium
Copper contacts.
• Coplanarity consistently under .006 in.
(0.152mm) industry standard.
• In-house Tape and Reel packaging
available.
Guide Post Socket (SG)
• Integral molded corners allow accurate positioning
of device/Adapter assembly in blind-mating
applications
• Mates with Extraction Slot Adapter (AX)
•
Socket size:
BGA device body + .276/(7.00)
1.27 & 1.5mm Pitch Terminals
Type -636
Solder Ball
1.0mm Pitch Terminals
Type -716
Solder Ball
Type -673
Thru-Hole
.117
(2.97)
Type -717
Thru-Hole
STANDARD
.117
(2.97)
.105
(2.67)
.090
(2.29)
.105
(2.67)
.090
(2.29)
.095
(2.41)
.128
(3.25)
.024/(0.61) Dia.
.125
(3.18)
.015 Dia.
(0.38)
.030/(0.76) Dia.
PATENTED
.018 Dia.
(0.46)
PATENTED
0.80mm Pitch Terminals
Type -702
Solder Ball
0.75mm Pitch Terminal
Type -758
Solder Ball
Specifications
Terminals:
Brass; Copper Alloy (C36000),
ASTM-B-16
Contacts:
Beryllium Copper; Copper Alloy
(C17200), ASTM-B-194
Plating:
G – Gold over Nickel
Body Material:
M – Molded PPS (High Temp.
Glass Filled Thermoplastic), U.L.
Rated 94V-O, -60°Cto 260°C (-76°F
to 500°F)
F – FR-4 Glass Epoxy, U.L. Rated
94V-0
Solder Ball:
Eutectic, 63Sn/37Pb, 183°C (361°F)
Type -731
Thru-Hole
.125
(3.18)
.125
(3.18)
.125
(3.18)
.020/(0.51) Dia.
.080
(2.03)
.011 Dia.
(0.28)
.018/(0.46) Dia.
PATENTED
PATENTED
How To Order – BGA Sockets
1
Footprint Dash#
If Applicable*
Body Type
M - Molded PPS (1.27 & 1.5mm pitch)
F - FR-4 (0.75, 0.80 & 1.0mm pitch)
M
G
S
XXXX - 636 G
G
Contact Plating
G - Gold
Pitch
Number of Positions
B = .059/(1.5mm)
G = .050/(1.27mm)
*See BGA Footprint Booklet
Model Type
H = .039/(1.0mm)
or web site
J = .0315/(0.80mm)
S
= Standard Socket
K = .0295/(0.75mm)
SB
= Extraction Socket [1.5, 1.27, and 1.0mm Pitch only]
SG
= Guide Post Socket [1.5 and 1.27mm Pitch only]
Terminal Plating
G - Gold
Terminal Type
See options
REV. 4/01
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown:
inch/(mm).
3
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