1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, @ +25°C
2. Irms: DC current for an approximate DT of 40°C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components
will affect the temperature rise. It is recommended that the temperature of the part not exceed 155°C
under worst case operating conditions verified in the end application.
3. Peak current for approximately 15% rolloff @+20°C
4. Peak current for approximately 30% rolloff @+20°C
5. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at operating
frequency necessary to generate additional core loss which contributes to the 40°C temperature rise.
De-rating of the I
rms
is required to prevent excessive temperature rise. The 100% V-us rating is
equivalent to a ripple current Ip-p of 20% of Isat (30% rolloff option).
6. Part number definition: HC8LP-XXX-R
HC8LP = Product code and size
XXX = Inductance value in uH. R = Decimal point. If no R is present then last character equals
number of zeros
-R suffix indicates RoHS compliant
Dimensions–mm
TOP VIEW
SIDE VIEW
2.70 ± 0 . 55
(2 x)
RECOMMENDED PAD LAYOUT
3.5 typ
2plcs
3.0 typ
2plcs
10.9
Max
HC8LP-XXX
wwll yy R
10.4
Max
4.0 typ
10.4
Max
FRONT VIEW
C
L
FRONT VIEW
Dimesional Table
PN
R15
R39
R75
1R2
1R9
thru
470
A
ref
mm
2.1
2.1
2.1
2.1
2.7
B
max
mm
3.5
3.5
3.5
3.3
3.5
SCHEMATIC
1
B
Max
3.95
2 plcs
ref
A ref
2
Part marking: HC8LP= (Product code and size)-xxx=(inductance value in uH, R= decimal point. If no R is present then last character equals
number of zeros. wwlyly=date code, R=revision level
Tolerances are ±0.2 millimeters unless stated otherwise
All soldering surfaces to be coplanar within 0.1 millimeters
Do not route traces or vias underneath the inductor
2
www.eaton.com/elx
HC8LP
Low profile, high current power inductors
Packaging information–mm
Supplied in tape and reel packaging, 800 parts per reel
4.0
1.5 dia
+0.1/-0.0
2.0
1.5 dia
min
Technical Data
4126
Effective October 2015
A
1.75
A o=10.4 mm
Bo=11.2 mm
K o=4.3 mm
11.5
11.2
Bo
HC8LP-XXX
wwlly y R
24.0
+/-0.3
Ko
SECTION A-A
Ao
16.0
A
User direction of feed
Core loss
Irms DERATING WITH CORE LOSS
% Applied Volt-u Seconds
92
10
30
50
70
90
110
130
150
170
190
% of Irms specified from
zero ripple application
(Maximum)
93
94
95
96
97
98
99
100kHz
200kHz
300kHz
400kHz
500kHz
100
Rolloff
100
90
80
70
60
50
40
30
20
10
0
OCL vs Isat
% of OCL
0
10
20
30
40
50
60
70
80
90
% of Isat
100
110
120
130
140
150
160
170
180
190
200
210
220
www.eaton.com/elx
3
Technical Data
4126
Effective October 2015
HC8LP
Low profile, high current power inductors
Solder reflow profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
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