HLMP-LG65-xxxxx
Precision Optical Performance Red
New 4mm Standard Oval LEDs
Data Sheet
Description
This Precision Optical Performance Oval LED is specifically
designed for full color/video and passenger information
signs. The oval shaped radiation pattern and high lumi-
nous intensity ensure that these devices are excellent
for wide field of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
The package epoxy contains both UV-A and UV-B inhibi-
tors to reduce the effects of long term exposure to direct
sunlight.
Features
x
Well defined spatial radiation pattern
x
High brightness material
x
Superior resistance to moisture
x
Standoff Package
x
Red Tinted Diffused
x
Typical viewing angle 50° x100°
Applications
x
Full color signs
Package Dimensions
7.26±0.20
0.286±0.008
21.0 MIN.
0.827
1.25±0.20
0.049±0.008
3.80±0.20
0.1496±0.008
CATHODE LEAD
NOTE 1
1.0 MIN.
0.039
3.00±0.20
0.118±0.008
10.00±0.50
0.394±0.020
0.80 MAX. EPOXY MENISCUS
0.031
Notes:
All dimensions in millimeters (inches).
Tolerance is ± 0.20mm unless other specified
2.54±0.30
0.100±0.012
+0.10
0.45 - 0.04
0.018 +0.004
- 0.002
Device Selection Guide
Part Number
HLMP-LG65-TX0DD
Color and Dominant Wavelength
λd (nm) Typ
Red 626
Luminous Intensity Iv
(mcd) at 20 mA-Min
[1]
800
Luminous Intensity Iv
(mcd) at 20 mA-Max
[1]
1990
Tolerance for each intensity limit is ± 15%.
Note:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
Absolute Maximum Ratings
T
J
= 25°C
Parameter
DC Forward Current
[2]
Peak Forward Current
Power Dissipation
Reverse Voltage
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Red
50
100
[3]
130
5
130
-40 to +100
-40 to +100
Unit
mA
mA
mW
V
°C
°C
°C
Notes:
2. Derate linearly as shown in Figure 4.
3. Duty Factor 30%, frequency 1KHz.
Electrical / Optical Characteristics
T
J
= 25°C
Parameter
Forward Voltage
Reverse Voltage
Dominant Wavelength
[4]
Peak Wavelength
Thermal Resistance
Luminous Efficacy
[5]
Symbol
V
F
V
R
λ
d
λ
PEAK
Rθ
J-PIN
η
V
Min.
1.8
5
618
Typ.
2.1
Max.
2.4
Units
V
V
Test Conditions
I
F
= 20 mA
I
R
= 100 μA
I
F
= 20 mA
Peak of Wavelength of Spectral Distribution
at I
F
= 20 mA
LED Junction-to-Anode lead
Emitted Luminous Power/Emitted Radiant Power
626
634
240
150
630
nm
nm
°C/W
lm/W
Notes:
4. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp
5. The radiant intensity, I
e
in watts per steradian, may be found from the equation I
e
= I
V
/K
V
where I
V
is the luminous intensity in candelas and
K
V
is
the luminous efficacy in lumens/watt.
2
Precautions:
Lead Forming:
x
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
x
For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
x
If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 260°C and the solder
contact time does not exceeding 5sec. Over-stressing the LED during
soldering process might cause premature failure to the LED due to
delamination.
Avago Technologies LED Configuration
Soldering and Handling:
x
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
x
LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
1.59mm
ANDOE
AlInGaP Device
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
x
Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
x
At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
x
If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
x
Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
x
ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
x
Recommended soldering condition:
Wave
Soldering
[1, 2]
Pre-heat temperature
Preheat time
Peak temperature
Dwell time
105°C Max.
60 sec Max
260°C Max.
5 sec Max.
Manual Solder
Dipping
-
-
260°C Max.
5 sec Max
Diagonal
0.636 mm
(0.025 inch)
0.707 mm
(0.028 inch)
Plated through
hole diameter
0.98 to 1.08 mm
(0.039 to 0.043 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
x
Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
5
x
Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about
soldering and handling of high brightness TH LED lamps.
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