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CX-2V-02170.000KHZ(B/C)

产品描述Parallel - Fundamental Quartz Crystal, 0.17MHz Nom, HERMETIC SEALED, MINIATURE, CERAMIC PACKAGE-2
产品类别无源元件    晶体/谐振器   
文件大小120KB,共2页
制造商STATEK CORPORATION
官网地址http://www.statek.com/
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CX-2V-02170.000KHZ(B/C)概述

Parallel - Fundamental Quartz Crystal, 0.17MHz Nom, HERMETIC SEALED, MINIATURE, CERAMIC PACKAGE-2

CX-2V-02170.000KHZ(B/C)规格参数

参数名称属性值
Objectid1308661284
包装说明HERMETIC SEALED, MINIATURE, CERAMIC PACKAGE-2
Reach Compliance Codecompliant
其他特性TRAY PACK
老化5 PPM/FIRST YEAR
晶体/谐振器类型PARALLEL - FUNDAMENTAL
驱动电平1 µW
频率稳定性0.0071%
频率容差200 ppm
负载电容5 pF
制造商序列号CX-2V
安装特点THROUGH HOLE MOUNT
标称工作频率0.17 MHz
最高工作温度70 °C
最低工作温度-10 °C
物理尺寸L2.41XB2.39XH6.6 (mm)/L0.095XB0.094XH0.26 (inch)
表面贴装NO

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CX-2V CRYSTAL
16 kHz to 600 kHz
TM
Miniature Quartz Crystal for Pierce Oscillators
DESCRIPTION
The CX-2V quartz crystal is a high quality tuning fork
resonator for use in Pierce (single inverter) oscillators. The
CX-2V is hermetically sealed in a rugged, miniature ceramic
package, one-fourth the size of an eight-pin mini-DIP. The
CX-2V crystal is manufactured using the STATEK-developed
photolithographic process, and was designed utilizing the
experience acquired by producing millions of crystals for
industrial, commercial, military and medical applications.
FEATURES
actual size
Miniature tuning fork design
High shock resistance
Designed for low power applications
Compatible with hybrid or PC board packaging
Low aging
Full military testing available
Ideal for battery operated applications
Designed and manufactured in the USA
PACKAGE HANDLING
PACKAGE DIMENSIONS
-02 End Lead
.094
(2.39)
-03 Side Lead
.260
(6.60)
.094
(2.39)
The CX crystal is hermetically sealed in a ceramic package.
Normal handling and soldering precautions for small, low
thermal mass parts are adequate when installing or testing CX
crystals. CX crystals may be wave soldered, with proper
precaution taken to avoid desoldering the leads. A slow
machine rate or too high a pre-heat temperature or solder bath
temperature can damage the crystals.
Lead to package
solder interface temperature should not exceed 175
o
C,
glass lid to package seal rim temperature should not
exceed 210
o
C.
If the seal rim reaches temperatures above the
maximum specified, the package may lose its hermeticity. Loss
of hermeticity results in a frequency decrease and motional
resistance increase.
EQUIVALENT CIRCUIT
1
2
1
2
3
.260
(6.60)
.210
(5.33)
3
.205
(5.21)
.200
(5.08)
A
A
.050(1.27)
-04 Side Lead
INCHES (mm)
.094
(2.39)
Notes:
1.Terminal 1 is electrically connected
internally to terminal 3.
2.Lead dimensions
Width: .013” (.33mm) Typical
Thickness: .007” (.18mm) Typical
3.A = Glass Lid .080 (2.03) max.
Ceramic Lid .095 (2.41) max.
.260
(6.60)
3
1
2
C
0
1
L
1
C
1
R
1
2
.210
(5.33)
.100
(2.54)
A
10138 - Rev A
R
1
Motional Resistance L
1
Motional Inductance
C
1
Motional Capacitance C
0
Shunt Capacitance
STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com

 
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