LVD SCSI Terminator
Technical
Data Sheet
RoHS Compliant Parts Available
Description
This LVD SCSI termination network is designed for high
performance active termination of SCSI networks compliant
to SPI-2 (Ultra2), SPI-3 (Ultra3) and beyond.
Designed with a ceramic substrate and a ball grid array
interconnect, this device virtually eliminates channel
capacitance and lead inductance, the primary cause of
reduced system performance.
BGA packaging has been proven to reduce rework and
improve reliability.
Features
•
•
•
•
•
•
•
9 Line LVD Termination Network
Ultra2 and Ultra3 Compliant
Low Channel Capacitance Less than 0.25pF
BGA package reliability
±1%
Resistor Tolerance
Low Channel Cross Talk
RoHS Compliant Designs Available
•
Compatible with both lead and lead-free
manufacturing processes
Style E
4
3
Schematic Diagram
R1
R2
Electrical Specifications
Resistor Tolerance:
TCR
Operating Temperature Range
Maximum Resistor Power:
Maximum Package Power:
Process Requirements:
Maximum Re-flow Temperature
±
1.0%
±
200ppm/°C
-55°C to +125°C
0.05 Watts at 70°C
1.0 Watts at 70°C
Per IPC/JEDEC J-STD-020C
2
R1
1
A
B
C
D
E
F
G
H
J
LVD SCSI Active Termination Circuit
1.3
V
DIFSENS
2.7
V
to 5.25
V
TERMPWR
2
4.7µF
UCC561
4
3
4.7µF
0.75
V
7
6
4.7µF
1.75
V
R1
R2
R1
RT1300B6
RT1300B6
RT1300B6
LVD SCSI Bus
Ordering Information
Standard
Part No.
R1
Ω
R2
Ω
Lines
Pitch
(mm)
RoHS
Part No.
Packaging Information
Suffix
Tape Width
Carrier Pitch
Reel Diameter
Parts/Reel
Part Number Coding
7 inch reel, Add TR7 to part
number, example RT2300B6TR7
13 inch reel, Add TR13 to part
number, example RT2300B6TR13
(Bulk packaging is not available)
TR7
24 mm
8 mm
7 inch
1,000
TR13
24mm
8 mm
13 inch
4,000
RT1300B6*
475
121
9
1.27
RT2300B6*
*Indicates available Top Probe-able part numbers.
Refer to the following link for detailed Top Side Probe-able
information:
www.ctscorp.com/components/clearone/TopProveClearOne.pdf
Direction of Fee d
CTS Electronic Components
www.ctscorp.com
© 2006 CTS Corporation. All rights reserved. Information subject to change.
Page 1
LVD SCSI Terminator
March 06
Recommended Land Pattern
Outline of Substrate
PCB Pad Diameter
1.27 mm Pitch (B6) = 0.64mm/.025 inch
Solder Mask Dia = Pad
Diameter +.15mm (.006 inch)
For .006" Thick Solder Paste Stencil, Aperture Opening
Should be Equal to the PCB Pad Diameter.
Refer to
www.ctscorp.com/components/clearone.asp
for
additional PCB design information
Mechanical Diagram
L
H
W
RT_300B6
CTS YRWK
P (Pitch)
A1 Identifier
K
P (Pitch)
D
1.27mm Pitch
RT1300B6
RT2300B6
mm
Inch
L
11.43±0.15
.450±.006
W
5.08±0.15
.200±.006
H
1.32±0.15
.052±.006
P
1.27±0.25
.050±.010
D
0.76±0.05
.030±.002
K
0.64±0.25
.025±.010
Complete ClearONE Product, Processing, and Application Information can be found at the following link:
http://www.ctscorp.com/components/clearone.asp
CTS Electronic Components
www.ctscorp.com
© 2006 CTS Corporation. All rights reserved. Information subject to change.
Page 2
LVD SCSI Terminator
March 06
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