0.5 mm LGA/BGA Sockets
DESCRIPTION
Tyco Electronics’ polymer interconnect
technology optimizes socketing of
0.5 mm pitch LGA or BGA devices.
This highly conductive polymer contact
provides electrically transparent signal
transfer.
APPLICATIONS
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Silicon validation
Customer reference designs
System test and bring up
Wafer test
KEY FEATURES
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Solderless contact polymer contact allows for easy socket replacement
Light compression load of 25 grams/contact limits stress on the substrate
Flexible manufacturing process allows for asymmetrical contact patterns
Standard array sizes available up to 40 x 40 contacts (1600 I/O)
Compact design minimizes real estate required
BGA sockets accommodate multiple ball sizes
RoHs complaint
FOR MORE INFORMATION
Technical Support
Internet:
http://www.tycoelectronics.com
USA: 1-800-522-6752
Canada: 1-905-470-4425
UK: 44-141-810-8967
Japan: 81-44-844-8013
Jeff Mason, Business Development Manager
Phone: 1-508-699-9818
Fax:
1-508-695-8111
E-mail:
jeff_mason@tycoelectronics.com
Allison Bobrowski, Sr. Product Specialist
Phone: 1-508-699-9851
Fax: 1-508-695-8111
E-mail:
allison_bobrowski@tycoelectronics.com
0.5mm LGA/BGA Sockets
PRODUCT CHARACTERISTICS
Page 2
The innovative polymer material system provides a highly conductive interconnect. This
proprietary material consists of a high temperature polymer compound that has been
embedded with metallized particles. The material is formed into contacts. The contacts are
held in place by a thin polyimide substrate. When mechanically compressed, the contacts’
electrical characteristics are optimized.
LGA Contact Compressed
LOAD
LGA Package
Polyimide
Substrate
PC Board
LGA Pad
Contact
Bolster Plate
Close up of LGA corner
frame and contacts
The unique design of the BGA socket uses an anti-overstress feature which protects the
contact and also provides a “well” for the ball to rest in. This “well” acts as an alignment
feature which centers the BGA ball to the MPI column. Corner frames provide for gross
alignment of the package to the socket.
Contact to Solder Ball Interface
Well
Anti-overstress
Stop
Polyimide
Substrate
LOAD
BGA Package
BGA Ball
Contact
Close up of BGA corner
frame and contacts
The Matrix series sockets are available as fully arrayed sockets up to 40 x 40 contacts,
1600 I/O. Consult Tyco Electronics for custom socket and hardware solutions.
0.5mm LGA/BGA Sockets
PRODUCT CHARACTERISTICS
Page 3
All sockets are compression mount and require a hardware system to generate the
necessary forces. Tyco Electronics offers a complete hardware solution for each socket
size. Below is a typical socket and hardware stack-up. The spring plate assembly
provides a universal compression load and the bolster plate eliminates PCB bow.
Spring plate
assembly
Top support
plate
Socket
PC Board
Bolster plate
Hardware shown assembled
Package
Each hardware kit contains enough hardware for one socket - a spring plate, a top plate,
and a bolster plate with insulator.
0.5mm LGA/BGA Sockets
PRODUCT DIMENSIONS
Page 4
Note: All part numbers are RoHS compliant.
0.5mm LGA/BGA Sockets
PRODUCT DIMENSIONS
Page 5
Note: All part numbers are RoHS compliant.
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