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Q67100-Q2188: 产品描述3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module; 文件大小95KB，共17页; 制造商SIEMENS; 官网地址http://www.infineon.com/

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Q67100-Q2188概述

3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module

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3.3V 8M

64-Bit EDO-DRAM Module

3.3V 8M x 72-Bit EDO-DRAM Module

168pin unbuffered DIMM Module

with serial presence detect

HYM64V8005GU-50/-60

HYM64V8045GU-50/-60

HYM72V8005GU-50/-60

HYM72V8045GU-50/-60

•

168 Pin JEDEC Standard, Unbuffered 8 Byte Dual In-Line Memory Module

for PC main memory applications

1 bank 8M x 64, 8M x 72 in 4k and 8k refresh organisation

Optimized for byte-write non-parity or ECC applications

Extended Data Out (EDO)

Performance:

-50

tRAC

tCAC

tAA

tRC

tHPC

RAS Access Time

CAS Access Time

Access Time from Address

Cycle Time

EDO Mode Cycle Time

50 ns

13 ns

25 ns

84 ns

20 ns

-60

60 ns

15 ns

30 ns

104 ns

25 ns

•

Single +3.3 V

0.3 V Power Supply

CAS-before-RAS refresh, RAS-only-refresh

Decoupling capacitors mounted on substrate

All inputs, outputs and clocks are fully LV-TTL compatible

Serial presence detects (optional)

Utilizes 8M

8 -DRAMs in TSOPII packages

4096 refresh cycles / 64 ms with 12 / 11 addressing (Row / Column) for HYM64/72V8005GU

8192 refresh cycles / 128 ms with 13 / 10 addressing (Row / Column) for HYM64/72V8045GU

Gold contact pad

Card Size: 133,35mm x 25,40 mm x 4,00 mm

This DRAM product module family is intended to be fully pin and architecture compatible

with the 168pin unbuffered SDRAM DIMM module family

Semiconductor Group

2.97

Q67100-Q2188相似产品对比

	Q67100-Q2188	Q67100-Q2189	HYM64V8005GU-50	HYM64V8005GU-60	HYM64V8045GU-50	HYM64V8045GU-60	HYM72V8005GU-50	HYM72V8005GU-60	HYM72V8045GU-50	HYM72V8045GU-60
描述	3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module	3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module	3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module	3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module	3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module	3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module	3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module	3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module	3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module	3.3V 8M x 64-Bit EDO-DRAM Module 3.3V 8M x 72-Bit EDO-DRAM Module
厂商名称	-	-	SIEMENS	SIEMENS	SIEMENS	SIEMENS	SIEMENS	SIEMENS	SIEMENS	SIEMENS
零件包装代码	-	-	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
针数	-	-	168	168	168	168	168	168	168	168
Reach Compliance Code	-	-	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow
ECCN代码	-	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
访问模式	-	-	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO
最长访问时间	-	-	50 ns	60 ns	50 ns	60 ns	50 ns	60 ns	50 ns	60 ns
其他特性	-	-	RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH
JESD-30 代码	-	-	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168
内存密度	-	-	536870912 bi	536870912 bi	536870912 bi	536870912 bi	603979776 bi	603979776 bi	603979776 bi	603979776 bi
内存集成电路类型	-	-	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE
内存宽度	-	-	64	64	64	64	72	72	72	72
功能数量	-	-	1	1	1	1	1	1	1	1
端口数量	-	-	1	1	1	1	1	1	1	1
端子数量	-	-	168	168	168	168	168	168	168	168
字数	-	-	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words
字数代码	-	-	8000000	8000000	8000000	8000000	8000000	8000000	8000000	8000000
工作模式	-	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	-	-	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	-	-	8MX64	8MX64	8MX64	8MX64	8MX72	8MX72	8MX72	8MX72
输出特性	-	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	-	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装形状	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	-	-	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
认证状态	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
刷新周期	-	-	4096	4096	8192	8192	4096	4096	8192	8192
最大供电电压 (Vsup)	-	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	-	-	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
标称供电电压 (Vsup)	-	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	-	-	NO	NO	NO	NO	NO	NO	NO	NO
技术	-	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	-	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	-	-	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
端子位置	-	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

Q67100-Q2188

Q67100-Q2188概述

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