S-29L221ADFE-TF概述

EEPROM, 128X16, Serial, CMOS, PDSO8

S-29L221ADFE-TF规格参数

参数名称	属性值
厂商名称	ABLIC
包装说明	SOP, SOP8,.25
Reach Compliance Code	unknow
数据保留时间-最小值	10
耐久性	100000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G8
内存密度	2048 bi
内存集成电路类型	EEPROM
内存宽度	16
端子数量	8
字数	128 words
字数代码	128
最高工作温度	85 °C
最低工作温度	-40 °C
组织	128X16
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP8,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	SERIAL
电源	2/5 V
认证状态	Not Qualified
串行总线类型	MICROWIRE
最大待机电流	4e-7 A
最大压摆率	0.002 mA
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
写保护	HARDWARE/SOFTWARE
Base Number Matches	1

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Contents

Features .............................................................. 1

Pin Assignment ................................................... 1

Pin Functions....................................................... 1

Block Diagram ..................................................... 2

Instruction Set ..................................................... 2

Absolute Maximum Ratings ................................. 2

Recommended Operating Conditions.................. 3

Pin Capacitance .................................................. 3

Endurance ........................................................... 3

DC Electrical Characteristics ............................... 4

AC Electrical Characteristics ............................... 5

Operation............................................................. 6

Receiving a Start-Bit............................................ 11

Three-wire Interface (DI-DO direct connection) ... 11

Memory Protection .............................................. 11

Ordering Information ........................................... 12

Characteristics..................................................... 13

Dimensions.......................................................... 18

S-29L221ADFE-TF相似产品对比

	S-29L221ADFE-TF	S-29L131AFSG	S-29L131ADFEG	S-29L131ADFE-TF	S-29L221AFSG	S-29L221ADFEG	S-29L331ADFE-TF	S-29L331AFSG	S-29L331ADFEG
描述	EEPROM, 128X16, Serial, CMOS, PDSO8	EEPROM, 64X16, Serial, CMOS, PDSO8, SSOP-8	EEPROM, 64X16, Serial, CMOS, PDSO8, SOP-8	EEPROM, 64X16, Serial, CMOS, PDSO8	EEPROM, 128X16, Serial, CMOS, PDSO8, SSOP-8	EEPROM, 128X16, Serial, CMOS, PDSO8, SOP-8	EEPROM, 256X16, Serial, CMOS, PDSO8	EEPROM, 256X16, Serial, CMOS, PDSO8, SSOP-8	EEPROM, 256X16, Serial, CMOS, PDSO8, SOP-8
包装说明	SOP, SOP8,.25	LSSOP,	LSOP,	SOP, SOP8,.25	LSSOP,	LSOP,	SOP, SOP8,.25	LSSOP,	LSOP,
Reach Compliance Code	unknow	compli	compli	unknow	compli	compli	unknown	compliant	compliant
数据保留时间-最小值	10	10	10	10	10	10	10	10	10
JESD-30 代码	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
内存密度	2048 bi	1024 bi	1024 bi	1024 bi	2048 bi	2048 bi	4096 bit	4096 bit	4096 bit
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
内存宽度	16	16	16	16	16	16	16	16	16
端子数量	8	8	8	8	8	8	8	8	8
字数	128 words	64 words	64 words	64 words	128 words	128 words	256 words	256 words	256 words
字数代码	128	64	64	64	128	128	256	256	256
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	128X16	64X16	64X16	64X16	128X16	128X16	256X16	256X16	256X16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	LSSOP	LSOP	SOP	LSSOP	LSOP	SOP	LSSOP	LSOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE	SMALL OUTLINE	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE	SMALL OUTLINE	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
串行总线类型	MICROWIRE	3-WIRE	3-WIRE	MICROWIRE	3-WIRE	3-WIRE	MICROWIRE	3-WIRE	3-WIRE
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	0.65 mm	1.27 mm	1.27 mm	0.65 mm	1.27 mm	1.27 mm	0.65 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1	1	1
厂商名称	ABLIC	-	-	-	ABLIC	ABLIC	ABLIC	ABLIC	ABLIC
是否Rohs认证	-	符合	符合	-	符合	符合	-	符合	符合
零件包装代码	-	SOIC	SOIC	-	SOIC	SOIC	-	SOIC	SOIC
针数	-	8	8	-	8	8	-	8	8
ECCN代码	-	EAR99	EAR99	-	EAR99	EAR99	-	EAR99	EAR99
其他特性	-	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	-	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	-	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS
最大时钟频率 (fCLK)	-	2 MHz	2 MHz	-	2 MHz	2 MHz	-	2 MHz	2 MHz
JESD-609代码	-	e2	e2	-	e2	e2	-	e2	e2
长度	-	4.4 mm	5.2 mm	-	4.4 mm	5.2 mm	-	4.4 mm	5.2 mm
功能数量	-	1	1	-	1	1	-	1	1
工作模式	-	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS
峰值回流温度（摄氏度）	-	260	260	-	260	260	-	260	260
座面最大高度	-	1.3 mm	1.7 mm	-	1.3 mm	1.7 mm	-	1.3 mm	1.7 mm
最大供电电压 (Vsup)	-	5.5 V	5.5 V	-	5.5 V	5.5 V	-	5.5 V	5.5 V
最小供电电压 (Vsup)	-	1.8 V	1.8 V	-	1.8 V	1.8 V	-	1.8 V	1.8 V
标称供电电压 (Vsup)	-	2.7 V	2.7 V	-	2.7 V	2.7 V	-	2.7 V	2.7 V
端子面层	-	Tin/Silver (Sn/Ag)	Tin/Silver (Sn/Ag)	-	Tin/Silver (Sn/Ag)	Tin/Silver (Sn/Ag)	-	Tin/Silver (Sn/Ag)	Tin/Silver (Sn/Ag)
处于峰值回流温度下的最长时间	-	10	10	-	10	10	-	10	10
宽度	-	3.1 mm	4.4 mm	-	3.1 mm	4.4 mm	-	3.1 mm	4.4 mm
最长写入周期时间 (tWC)	-	10 ms	10 ms	-	10 ms	10 ms	-	10 ms	10 ms

S-29L221ADFE-TF

S-29L221ADFE-TF概述

S-29L221ADFE-TF规格参数

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S-29L221ADFE-TF相似产品对比

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