inverters 8circ 9.5 ns 6.5 V
| 参数名称 | 属性值 |
| Source Url Status Check Date | 2013-06-14 00:00:00 |
| Brand Name | NXP Semiconduc |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SON |
| 包装说明 | 1.35 X 1 MM, 0.35 MM HEIGHT, 0.35 MM PITCH, SOT-1203, SON-8 |
| 针数 | 8 |
| 制造商包装代码 | SOT1203 |
| Reach Compliance Code | compli |

| 74LVC3G04GS,115 | 74LVC3G04DC,125 | 74LVC3G04GN,115 | 74LVC3G04GD,125 | 74LVC3G04GM,125 | 74LVC3G04GF,115 | 74LVC3G04DP,125 | |
|---|---|---|---|---|---|---|---|
| 描述 | inverters 8circ 9.5 ns 6.5 V | inverters 3.3V triple inverter | inverters triple inverter | inverters inverter 3-element cmos 8-pin | inverters 3.3V triple inverter | inverters triple inverter | inverters 3.3V triple inverter |
| Brand Name | NXP Semiconduc | NXP Semiconductor | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconductor |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SON | SSOP | SON | SON | QFN | SON | TSSOP |
| 包装说明 | 1.35 X 1 MM, 0.35 MM HEIGHT, 0.35 MM PITCH, SOT-1203, SON-8 | VSSOP, TSSOP8,.12,20 | 1.20 X 1 MM, 0.35 MM HEIGHT, SOT-1116, SON-8 | 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8 | VBCC, LCC8,.06SQ,20 | 1.35 X 1 MM, 0.50 MM HEIGHT, MO-252, SOT-1089, SON-8 | 3 MM, PLASTIC, SOT505-2, TSSOP-8 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 制造商包装代码 | SOT1203 | SOT765-1 | SOT1116 | SOT996-2 | SOT902-2 | SOT1089 | SOT505-2 |
| Reach Compliance Code | compli | compliant | compli | compli | compli | compli | compliant |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | - |
| 系列 | - | LVC/LCX/Z | - | LVC/LCX/Z | LVC/LCX/Z | - | LVC/LCX/Z |
| JESD-30 代码 | - | R-PDSO-G8 | - | R-PDSO-N8 | S-PBCC-B8 | - | S-PDSO-G8 |
| JESD-609代码 | - | e4 | - | e4 | e4 | - | e4 |
| 长度 | - | 2.3 mm | - | 3 mm | 1.6 mm | - | 3 mm |
| 负载电容(CL) | - | 50 pF | - | 50 pF | 50 pF | - | 50 pF |
| 逻辑集成电路类型 | - | INVERTER | - | INVERTER | INVERTER | - | INVERTER |
| 最大I(ol) | - | 0.024 A | - | 0.024 A | 0.024 A | - | 0.024 A |
| 湿度敏感等级 | - | 1 | - | 1 | 1 | - | 1 |
| 功能数量 | - | 3 | - | 3 | 3 | - | 3 |
| 输入次数 | - | 1 | - | 1 | 1 | - | 1 |
| 端子数量 | - | 8 | - | 8 | 8 | - | 8 |
| 最高工作温度 | - | 125 °C | - | 125 °C | 125 °C | - | 125 °C |
| 最低工作温度 | - | -40 °C | - | -40 °C | -40 °C | - | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | - | VSSOP | - | VSON | VBCC | - | TSSOP |
| 封装等效代码 | - | TSSOP8,.12,20 | - | SOLCC8,.11,20 | LCC8,.06SQ,20 | - | TSSOP8,.16 |
| 封装形状 | - | RECTANGULAR | - | RECTANGULAR | SQUARE | - | SQUARE |
| 封装形式 | - | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | - | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL | - | TAPE AND REEL |
| 峰值回流温度(摄氏度) | - | 260 | - | 260 | 260 | - | 260 |
| 电源 | - | 3.3 V | - | 3.3 V | 3.3 V | - | 3.3 V |
| 传播延迟(tpd) | - | 9.5 ns | - | 9.5 ns | 9.5 ns | - | 9.5 ns |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
| 施密特触发器 | - | NO | - | NO | NO | - | NO |
| 座面最大高度 | - | 1 mm | - | 0.5 mm | 0.5 mm | - | 1.1 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | - | 1.65 V | - | 1.65 V | 1.65 V | - | 1.65 V |
| 标称供电电压 (Vsup) | - | 1.8 V | - | 1.8 V | 1.8 V | - | 1.8 V |
| 表面贴装 | - | YES | - | YES | YES | - | YES |
| 技术 | - | CMOS | - | CMOS | CMOS | - | CMOS |
| 温度等级 | - | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | - | NICKEL PALLADIUM GOLD |
| 端子形式 | - | GULL WING | - | NO LEAD | BUTT | - | GULL WING |
| 端子节距 | - | 0.5 mm | - | 0.5 mm | 0.5 mm | - | 0.65 mm |
| 端子位置 | - | DUAL | - | DUAL | BOTTOM | - | DUAL |
| 处于峰值回流温度下的最长时间 | - | 30 | - | 30 | 30 | - | 30 |
| 宽度 | - | 2 mm | - | 2 mm | 1.6 mm | - | 3 mm |
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