supervisory circuits 3.3V econoreset w/ active high output
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | TO-92 |
| 包装说明 | 0.185 INCH, ROHS COMPLIANT, TO-92, 3 PIN |
| 针数 | 3 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | O-XBCY-T3 |
| JESD-609代码 | e3 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 3 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | TO-92 |
| 封装等效代码 | SIP3,.1,50 |
| 封装形状 | ROUND |
| 封装形式 | CYLINDRICAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.2/5.5 V |
| 认证状态 | Not Qualified |
| 最大供电电流 (Isup) | 0.035 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.2 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 1.27 mm |
| 端子位置 | BOTTOM |
| 阈值电压标称 | +2.55V |
| 处于峰值回流温度下的最长时间 | 30 |
| DS1817-20+ | DS1817-5/T&R | DS1817R-10/T&R | DS1817-20+T&R | DS1817-10+T&R | DS1817-5+ | DS18B20-PAR+T&R; | |
|---|---|---|---|---|---|---|---|
| 描述 | supervisory circuits 3.3V econoreset w/ active high output | supervisory circuits 3.3V econoreset w/ active high output | supervisory circuits 3.3V econoreset w/ active high output | supervisory circuits 3.3V econoreset w/ active high output | supervisory circuits 3.3V econoreset w/ active high output | supervisory circuits 3.3V econoreset w/ active high output | SENSOR TEMPERATURE 1-WIRE TO92-3 |
| 是否无铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | - |
| 零件包装代码 | TO-92 | TO-92 | SOT-23 | TO-92 | TO-92 | TO-92 | - |
| 包装说明 | 0.185 INCH, ROHS COMPLIANT, TO-92, 3 PIN | 0.185 INCH, TO-92, 3 PIN | 0.50 INCH, SOT-23, 3 PIN | 0.185 INCH, ROHS COMPLIANT, TO-92, 3 PIN | 0.185 INCH, ROHS COMPLIANT, TO-92, 3 PIN | TO-92, SIP3,.1,50 | - |
| 针数 | 3 | 3 | 3 | 3 | 3 | 3 | - |
| Reach Compliance Code | compli | _compli | _compli | compli | compli | compli | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 可调阈值 | NO | NO | NO | NO | NO | NO | - |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - |
| JESD-30 代码 | O-XBCY-T3 | O-XBCY-T3 | R-PDSO-G3 | O-XBCY-T3 | O-XBCY-T3 | O-XBCY-T3 | - |
| JESD-609代码 | e3 | e0 | e0 | e3 | e3 | e3 | - |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 3 | 3 | 3 | 3 | 3 | 3 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - |
| 封装代码 | TO-92 | TO-92 | TSSOP | TO-92 | TO-92 | TO-92 | - |
| 封装等效代码 | SIP3,.1,50 | SIP3,.1,50 | TO-236 | SIP3,.1,50 | SIP3,.1,50 | SIP3,.1,50 | - |
| 封装形状 | ROUND | ROUND | RECTANGULAR | ROUND | ROUND | ROUND | - |
| 封装形式 | CYLINDRICAL | CYLINDRICAL | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | - |
| 峰值回流温度（摄氏度） | 260 | 240 | 240 | 260 | 260 | 260 | - |
| 电源 | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 最大供电电流 (Isup) | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | - |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
| 表面贴装 | NO | NO | YES | NO | NO | NO | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | 1.27 mm | 1.27 mm | 0.95 mm | 1.27 mm | 1.27 mm | 1.27 mm | - |
| 端子位置 | BOTTOM | BOTTOM | DUAL | BOTTOM | BOTTOM | BOTTOM | - |
| 阈值电压标称 | +2.55V | +3.06V | +2.88V | +2.55V | +2.88V | +3.06V | - |
| 处于峰值回流温度下的最长时间 | 30 | 20 | 20 | 30 | 30 | 30 | - |
PCB设计
stm32/stm8
模拟与混合信号
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