translation - voltage levels 1.2-5.5V .1ua 35mbps 8ch
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, TSSOP20,.25 |
| 针数 | 20 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 接口集成电路类型 | INTERFACE CIRCUIT |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e3 |
| 长度 | 6.5 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 8 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP20,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.8/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 1.2 V |
| 电源电压1-最大 | 5.5 V |
| 电源电压1-分钟 | 1.65 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 4.4 mm |
| MAX3012EUP+ | MAX3001EEUP+ | MAX3000EEUP+ | MAX3002ETP+ | MAX3000EEUP+T | MAX3008EUP+T | MAX3001EAUP+ | MAX3002ETP+T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | translation - voltage levels 1.2-5.5V .1ua 35mbps 8ch | translation - voltage levels 1.2-5.5V .1ua 35mbps 8ch | translation - voltage levels 1.2-5.5V .1ua 35mbps 8ch | translation - voltage levels 1.2-5.5V .1ua 35mbps 8ch | translation - voltage levels 1.2-5.5V .1ua 35mbps 8ch | translation - voltage levels max3008eup+T | translation - voltage levels 1.2-5.5V .1ua 35mbps 8ch | translation - voltage levels 1.2-5.5V .1ua 35mbps 8ch |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | QCCN, LCC20,.20SQ,25 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | HVQCCN, |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compliant |
| Factory Lead Time | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 12 weeks | 6 weeks | 4 weeks |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | S-PQCC-N20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | S-XQCC-N20 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | TSSOP | TSSOP | TSSOP | QCCN | TSSOP | TSSOP | TSSOP | HVQCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.635 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | TSSOP | TSSOP | TSSOP | - | TSSOP | TSSOP | TSSOP | - |
| 针数 | 20 | 20 | 20 | - | 20 | 20 | 20 | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 | - | EAR99 | - |
| 接口集成电路类型 | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | - | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
| 长度 | 6.5 mm | 6.5 mm | 6.5 mm | - | 6.5 mm | 6.5 mm | 6.5 mm | 5 mm |
| 功能数量 | 8 | 8 | 8 | - | 8 | 8 | 8 | 1 |
| 封装等效代码 | TSSOP20,.25 | TSSOP20,.25 | TSSOP20,.25 | LCC20,.20SQ,25 | TSSOP20,.25 | TSSOP20,.25 | TSSOP20,.25 | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | - | 260 | 260 | 260 | - |
| 电源 | 1.8/5 V | 1.8/5 V | 1.8/5 V | 1.8/5 V | 1.8/5 V | 1.8/5 V | 1.8/5 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | - | 1.1 mm | 1.1 mm | 1.1 mm | 0.8 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 1.2 V | 1.2 V | 1.2 V | - | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 电源电压1-最大 | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 电源电压1-分钟 | 1.65 V | 1.65 V | 1.65 V | - | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | - | 30 | 40 | 30 | - |
| 宽度 | 4.4 mm | 4.4 mm | 4.4 mm | - | 4.4 mm | 4.4 mm | 4.4 mm | 5 mm |
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