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74AHC132PW,112

产品描述logic gates quad 2-input nand
产品类别逻辑    逻辑   
文件大小112KB,共18页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74AHC132PW,112概述

logic gates quad 2-input nand

74AHC132PW,112规格参数

参数名称属性值
Brand NameNXP Semiconduc
是否Rohs认证符合
零件包装代码TSSOP
包装说明TSSOP, TSSOP14,.25
针数14
制造商包装代码SOT402-1
Reach Compliance Codecompli
系列AHC/VHC/H/U/V
JESD-30 代码R-PDSO-G14
JESD-609代码e4
长度5 mm
负载电容(CL)50 pF
逻辑集成电路类型NAND GATE
最大I(ol)0.008 A
湿度敏感等级1
功能数量4
输入次数2
端子数量14
最高工作温度125 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP14,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法TUBE
峰值回流温度(摄氏度)260
电源2/5.5 V
Prop。Delay @ Nom-Su12.5 ns
传播延迟(tpd)19.5 ns
认证状态Not Qualified
施密特触发器YES
座面最大高度1.1 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度4.4 mm
Base Number Matches1

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74AHC132; 74AHCT132
Quad 2-input NAND Schmitt trigger
Rev. 06 — 4 May 2009
Product data sheet
1. General description
The 74AHC132; 74AHCT132 is a high-speed Si-gate CMOS device and is pin compatible
with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard
No. 7-A.
The 74AHC132; 74AHCT132 contains four 2-input NAND gates which accept standard
input signals. They are capable of transforming slowly changing input signals into sharply
defined, jitter free output signals. The gate switches at different points for positive-going
and negative-going signals. The difference between the positive voltage V
T+
and the
negative V
T−
is defined as the hysteresis voltage V
H
.
2. Features
I
Balanced propagation delays
I
Inputs accept voltages higher than V
CC
I
Input levels:
N
For 74AHC132: CMOS level
N
For 74AHCT132: TTL level
I
ESD protection:
N
HBM EIA/JESD22-A114E exceeds 2000 V
N
MM EIA/JESD22-A115-A exceeds 200 V
N
CDM EIA/JESD22-C101C exceeds 1000 V
I
Multiple package options
I
Specified from
−40 °C
to +85
°C
and from
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74AHC132
74AHC132D
74AHC132PW
74AHC132BQ
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
SO14
TSSOP14
plastic small outline package; 14 leads;
body width 3.9 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
SOT108-1
SOT402-1
SOT762-1
Description
Version
Type number
DHVQFN14 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5
×
3
×
0.85 mm

74AHC132PW,112相似产品对比

74AHC132PW,112 74AHCT132PW,118 74AHC132BQ,115 74AHCT132BQ,115 74AHCT132PW,112 74AHC132PW,118
描述 logic gates quad 2-input nand logic gates quad 2-input nand logic gates quad 2-input nand logic gates quad 2-input nand logic gates quad 2-input nand logic gates quad 2-input nand
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc
是否Rohs认证 符合 符合 符合 符合 符合 符合
零件包装代码 TSSOP TSSOP QFN QFN TSSOP TSSOP
包装说明 TSSOP, TSSOP14,.25 TSSOP, TSSOP14,.25 HVQCCN, LCC14,.1X.12,20 HVQCCN, LCC14,.1X.12,20 TSSOP, TSSOP14,.25 TSSOP, TSSOP14,.25
针数 14 14 14 14 14 14
制造商包装代码 SOT402-1 SOT402-1 SOT762-1 SOT762-1 SOT402-1 SOT402-1
Reach Compliance Code compli compli compli compli compli compli
系列 AHC/VHC/H/U/V AHCT/VHCT/VT AHC/VHC/H/U/V AHCT/VHCT/VT AHCT/VHCT/VT AHC/VHC/H/U/V
JESD-30 代码 R-PDSO-G14 R-PDSO-G14 R-PQCC-N14 R-PQCC-N14 R-PDSO-G14 R-PDSO-G14
JESD-609代码 e4 e4 e4 e4 e4 e4
长度 5 mm 5 mm 3 mm 3 mm 5 mm 5 mm
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
最大I(ol) 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A
湿度敏感等级 1 1 1 1 1 1
功能数量 4 4 4 4 4 4
输入次数 2 2 2 2 2 2
端子数量 14 14 14 14 14 14
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP TSSOP HVQCCN HVQCCN TSSOP TSSOP
封装等效代码 TSSOP14,.25 TSSOP14,.25 LCC14,.1X.12,20 LCC14,.1X.12,20 TSSOP14,.25 TSSOP14,.25
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法 TUBE TAPE AND REEL TAPE AND REEL TAPE AND REEL TUBE TAPE AND REEL
峰值回流温度(摄氏度) 260 260 260 260 260 260
电源 2/5.5 V 5 V 2/5.5 V 5 V 5 V 2/5.5 V
Prop。Delay @ Nom-Su 12.5 ns 10 ns 12.5 ns 10 ns 10 ns 12.5 ns
传播延迟(tpd) 19.5 ns 10 ns 19.5 ns 10 ns 10 ns 19.5 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
施密特触发器 YES YES YES YES YES YES
座面最大高度 1.1 mm 1.1 mm 1 mm 1 mm 1.1 mm 1.1 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2 V 4.5 V 2 V 4.5 V 4.5 V 2 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
端子形式 GULL WING GULL WING NO LEAD NO LEAD GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.5 mm 0.5 mm 0.65 mm 0.65 mm
端子位置 DUAL DUAL QUAD QUAD DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 4.4 mm 4.4 mm 2.5 mm 2.5 mm 4.4 mm 4.4 mm
Base Number Matches 1 1 1 1 1 1

 
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