FAN3213 / FAN3214 — Dual-4A, High-Speed, Low-Side Gate Drivers
November 2013
FAN3213 / FAN3214
Dual-4 A, High-Speed, Low-Side Gate Drivers
Features
Industry-Standard Pin Out
4.5 to 18 V Operating Range
5 A Peak Sink/Source at V
DD
= 12 V
4.3 A Sink / 2.8 A Source at V
OUT
= 6 V
TTL Input Thresholds
Two Versions of Dual Independent Drivers:
Description
The FAN3213 and FAN3214 dual 4 A gate drivers are
designed to drive N-channel enhancement-mode
MOSFETs in low-side switching applications by
providing high peak current pulses during the short
switching intervals. They are both available with TTL
input thresholds. Internal circuitry provides an under-
voltage lockout function by holding the output LOW until
the supply voltage is within the operating range. In
addition, the drivers feature matched internal
propagation delays between A and B channels for
applications requiring dual gate drives with critical
timing, such as synchronous rectifiers. This also
enables connecting two drivers in parallel to effectively
double the current capability driving a single MOSFET.
The FAN3213/14 drivers incorporate MillerDrive™
architecture for the final output stage. This bipolar-
MOSFET combination provides high current during the
Miller plateau stage of the MOSFET turn-on / turn-off
process to minimize switching loss, while providing rail-
to-rail voltage swing and reverse current capability.
The FAN3213 offers two inverting drivers and the
FAN3214 offers two non-inverting drivers. Both are
offered in a standard 8-pin SOIC package.
-
-
Dual Inverting (FAN3213)
Dual Non-Inverting (FAN3214)
Internal Resistors Turn Driver Off If No Inputs
MillerDrive™ Technology
12 ns / 9 ns Typical Rise/Fall Times with 2.2 nF
Load
Typical Propagation Delay Under 20 ns Matched
within 1 ns to the Other Channel
Double Current Capability by Paralleling Channels
Standard SOIC-8 Package
Rated from –40°C to +125°C Ambient
Automotive Qualified to AEC-Q100 (F085 Version)
Applications
Switch-Mode Power Supplies
High-Efficiency MOSFET Switching
Synchronous Rectifier Circuits
DC-to-DC Converters
Motor Control
Automotive-Qualified Systems (F085 version)
Related Resources
AN-6069 — Application Review and Comparative
Evaluation of Low-Side Gate Drivers
FAN3213
Figure 1. Pin Configurations
© 2008 Fairchild Semiconductor Corporation
FAN3213 / FAN3214 • Rev. 1.0.5
FAN3214
www.fairchildsemi.com
FAN3213 / FAN3214 — Dual-4A, High-Speed, Low-Side Gate Drivers
Ordering Information
Part Number
FAN3213TMX
FAN3214TMX
FAN3213TMX_F085
(1)
FAN3214TMX_F085
(1)
Note:
1. Qualified to AEC-Q100
Logic
Dual Inverting Channels
Dual Non-Inverting Channels
Dual Inverting Channels
Dual Non-Inverting Channels
Input
Threshold
Package
Packing
Method
Quantity
per Reel
TTL
SOIC-8
Tape & Reel
2,500
Package Outlines
Figure 2. SOIC-8 (Top View)
Thermal Characteristics
(2)
Package
8-Pin Small Outline Integrated Circuit (SOIC)
Θ
JL
(3)
38
Θ
JT
(4)
29
Θ
JA(5)
87
Ψ
JB
(6)
41
Ψ
JT
(7)
2.3
Unit
°C/W
Notes:
2. Estimates derived from thermal simulation; actual values depend on the application.
3. Theta_JL (Θ
JL
): Thermal resistance between the semiconductor junction and the bottom surface of all the leads
(including any thermal pad) that are typically soldered to a PCB.
4. Theta_JT (Θ
JT
): Thermal resistance between the semiconductor junction and the top surface of the package,
assuming it is held at a uniform temperature by a top-side heatsink.
5. Theta_JA (Θ
JA
): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking,
and airflow. The value given is for natural convection with no heatsink, using a 2S2P board, as specified in
JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate.
6. Psi_JB (Ψ
JB
): Thermal characterization parameter providing correlation between semiconductor junction
temperature and an application circuit board reference point for the thermal environment defined in Note 5. For
the SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6.
7. Psi_JT (Ψ
JT
): Thermal characterization parameter providing correlation between the semiconductor junction
temperature and the center of the top of the package for the thermal environment defined in Note 5.
© 2008 Fairchild Semiconductor Corporation
FAN3213 / FAN3214 • Rev. 1.0.5
www.fairchildsemi.com
2
FAN3213 / FAN3214 — Dual-4A, High-Speed, Low-Side Gate Drivers
Pin Configurations
FAN3213
FAN3214
Figure 3. Pin Configurations (Repeated)
Pin Definitions
Pin
1
2
3
4
5
(FAN3213)
5
(FAN3214)
6
7
(FAN3213)
7
(FAN3214)
8
Name
NC
INA
GND
INB
Pin Description
No Connect.
This pin can be grounded or left floating.
Input to Channel A.
Ground.
Common ground reference for input and output circuits.
Input to Channel B.
Gate Drive Output B
(inverted from the input): Held LOW unless required input is
present and V
DD
is above UVLO threshold.
Gate Drive Output B:
Held LOW unless required input(s) are present and V
DD
is above
UVLO threshold.
Supply Voltage.
Provides power to the IC.
Gate Drive Output A
(inverted from the input): Held LOW unless required input is
present and V
DD
is above UVLO threshold.
Gate Drive Output A:
Held LOW unless required input(s) are present and V
DD
is above
UVLO threshold.
No Connect.
This pin can be grounded or left floating.
OUTB
OUTB
VDD
OUTA
OUTA
NC
Output Logic
FAN3213 (x=A or B)
INx
0
1
(9)
FAN3214 (x=A or B)
INx
0
(9)
1
0
(9)
1
OUTx
0
0
0
1
OUTx
0
0
1
0
0
1
(9)
Note:
9. Default input signal if no external connection is made.
© 2008 Fairchild Semiconductor Corporation
FAN3213 / FAN3214 • Rev. 1.0.5
www.fairchildsemi.com
3
FAN3213 / FAN3214 — Dual-4A, High-Speed, Low-Side Gate Drivers
Block Diagrams
Figure 4. FAN3213 Block Diagram
Figure 5. FAN3214 Block Diagram
© 2008 Fairchild Semiconductor Corporation
FAN3213 / FAN3214 • Rev. 1.0.5
www.fairchildsemi.com
4
FAN3213 / FAN3214 — Dual-4A, High-Speed, Low-Side Gate Drivers
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
V
DD
V
IN
V
OUT
T
L
T
J
T
STG
VDD to PGND
INA and INB to GND
OUTA and OUTB to GND
Parameter
Min.
-0.3
Max.
20.0
Unit
V
V
V
ºC
ºC
ºC
GND - 0.3 V
DD
+ 0.3
GND - 0.3 V
DD
+ 0.3
+260
-55
-65
+150
+150
Lead Soldering Temperature (10 Seconds)
Junction Temperature
Storage Temperature
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
V
DD
V
IN
T
A
Supply Voltage Range
Input Voltage INA and INB
Parameter
Min.
4.5
0
-40
Max.
18.0
V
DD
+125
Unit
V
V
ºC
Operating Ambient Temperature
© 2008 Fairchild Semiconductor Corporation
FAN3213 / FAN3214 • Rev. 1.0.5
www.fairchildsemi.com
5
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