FX-402
Low Jitter Frequency Translator
Previous Part Number FX-427
FX-402
Description
The FX-402 is a precision quartz-based frequency translator used to translate 1 to 4 selected input clocks as low as 8 kHz to an
integer multiple as high as 850 MHz. The FX-402’s superior jitter performance is achieved through the filtering action of the on-
board voltage-controlled SAW oscillator (VCSO) and integrated loop filter. Two low-jitter outputs are provided. Monitoring and
control functionality are also standard features.
Features
•
•
•
•
•
•
•
•
•
Quartz-based PLL for Ultra-Low Jitter
Frequency Translation up to 850 MHz
Accepts 4 externally-muxed clock inputs
LVCMOS/LVDS/LVPECL Inputs Compatible
Differential LVPECL Outputs
Lock Detect
Output Disable
20.3 x 13.7 x 5.1 mm surface mount package
Compliant to EC RoHS Directive
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•
•
•
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Applications
Wireless Infrastructure
802.16 BTS
10 Gigabit FC
10GbE LAN / WAN
OADM and IP Routers
Test Equipment
Block Diagram
VCC
(14)
FIN
1
FIN
2
FIN
3
FIN
4
FIN
(13)
LD
(7)
Phase
Detector
& LD
VMON
(5)
Loop Filter
VCSO
(8)
FOUT
1
(9)
CFOUT
1
÷
μ Controller
SEL0 (1)
SEL1 (2)
÷
÷
(10)
FOUT
2
(11)
CFOUT
2
GND
(3, 12)
OD
(6)
Figure 1. Functional block diagram
Page 1 of 8
Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com
Rev: 8/13/2009
Performance Specifications
Table 1. Electrical Performance
Parameter
Frequency
1, 2, 3
Input Frequency
Capture Range
Output Frequency - Primary
Output Frequency - Secondary
Supply
Voltage
2, 3
Current (No Load)
3
Input Signal
LVCMOS
LVDS
2, 3, 7
LVPECL
Differential Output (Options F and P)
2, 3, 4, 5
Common Mode Output Voltage
DC Output High Voltage
DC Output Low Voltage
Peak to Peak Output Voltage
Rise TIme
Fall Time
Symmetry
SSB Phase Noise, Fout = 155.52/622.08
5, 6
10Hz Offset
100Hz Offset
1kHz Offset
10kHz Offset
100kHz Offfset
1 MHz Offset
10 MHz Offset
Jitter Generation
5, 6
155.52 MHz (12kHz - 20MHz BW)
622.08 MHz (12kHz - 20 MHz BW)
Operating Temperature (Options C of F)
1 ,3
Symbol
F
IN
APR
F
OUT1
F
OUT2
V
CC
I
CC
F
IN
F
IN
F
IN
V
OCM
V
OH
V
OL
V
P-P
t
R
t
F
SYM
Φ
n
Φ
n
Φ
n
Φ
n
Φ
n
Φ
n
Φ
n
Φ
J
Φ
J
T
OP
Min
0.008
±40
500
125
3.13
Typical
Maximum
400
850
850
Units
MHz
ppm
MHz
MHz
V
mA
3.3
140
LVCMOS
LVDS
LVPECL
3.46
180
V
CC
-1.5
V
CC
-1.085
V
CC
-1.830
45
V
CC
-1.3
V
CC
-0.950
V
CC
-1.7
700
0.5
0.5
50
-64/-27
-95/-55
-123/-123
-143/-110
-146/-130
-146/-146
-146/-146
0.30
0.12
0 to 70 or -40 to 85
V
CC
-1.1
V
CC
-0.880
V
CC
-1.620
55
V
V
V
mV p-p
ns
ns
%
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
ps RMS
ps RMS
0C
1. See Standard Frequencies and Ordering Information.
2. Parameters are tested with production test circuit below (Fig 2).
3. Parameters are tested at ambient temperature with test limits guard banded for specified operating temperature.
4. Measured from 20% to 80% of a full output swing (Fig 3).
5. Not tested in production, guaranteed by design, verified at qualification.
6. The FX-402 phase noise and jitter performance can be optimized for specific applications. Please consult with Vectron’s Application Engineers for
more information.
7. LVCMOS input signal levels are valid for input frequencies < 100 MHz.
Page 2 of 8
Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com
Rev: 8/13/2009
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can permanently damage the device. Functional operation is not implied
at these or any other conditions in excess of conditions represented in the operational sections of this data sheet. Exposure to
absolute maximum ratings for extended periods may adversely affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Power Supply
Storage Temperature
Soldering Tewmp/TIme
Symbol
V
DD
T
STR
T
LS
Ratings
6
-55 to 125
260/40
Unit
V
0C
0C/sec
Reliability
The FX-402 is capable of meeting the following qualification tests
Table 3. Environmental Compliance
Parameter
Mechanical Shock
Mechanical Vibration
Solderability
Gross and Fine Leak
Resistance to Solvents
Conditions
MIL-STD-883, Method 2002
MIL-STD-883, Method 2007
MIL-STD-883, Method 2003
MIL-STD-883, Method 1014
MIL-STD-883, Method 2016
Handling Precautions
Although ESD protection circuitrry has been designed into the the FX-402, proper precautions should be taken when handling
and mounting. VI employs a human body model and a charged-device model (CDM) for ESD susceptibility testing and design
protection evaluation. ESD thresholds are dependent on the circuit parameters used to define the model. Although no industry
wide standard has been adopted for the CDM, a standard HBM of resistance=1.5Kohms and capacitance = 100pF is widely used
and therefore can be used for comparison purposes
Table 4. Predicted ESD R$atings
Model
Human Body Model
Charged Device Model
Minimum
500 V
500 V
Conditions
MIL-STD 883, Method 3015
JEDEC, JESD22-C101
Page 3 of 8
Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com
Rev: 8/13/2009
Reflow Profile
Table 5. Reflow Profile (IPC/JEDEC J-STD-020C)
Parameter
PreHeat Time
Ramp Up
Time Above 217 0C
Time To Peak Temperature
Time At 260 0C
Ramp Down
Symbol
t
S
R
UP
t
L
t
AMB-P
t
P
R
DN
Value
60 sec Min, 180 sec Max
3 0C/sec Max
60 sec Min, 150 sec Max
480 sec Max
20 sec Min, 40 sec Max
6 0C/sec Max
The FX-402 is qualified to meet the JEDEC
standard for Pb-Free assembly. The temperatures
and time intervals listed are based on the Pb-Free
small body requirements. The temperatures refer
to the topside of the package, measured on the
package body surface. The FX-402 should not
be subjected to a wash process that will immerse
it in solvents. NO CLEAN is the recommended
procedure. The FX-402 has been designed for pick
and place reflow soldering. The FX-402 may be
reflowed once and should not be reflowed in the
inverted position.
Figure 4. Suggested IR Profile
Tape and Reel
Table 6. Tape and Reel Information
Tape Dimensions (mm)
W
F
Do
Po
P1
A
B
Reel Dimensions (mm)
C
D
N
W1
W2
#/Reel
32
14.2
1.5
4
20
330
1.5
13
20.2
100
44.4
50.4
200
Figure 5. Tape and Reel
Page 4 of 8
Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com
Rev: 8/13/2009
Pin Configuration
Figure 6. Pin Configuration
Table 7. Pin Functions
Pin #
1
2
3
4
5
VMON
O
Symbol
SEL0
SEL1
GND
I
I
GND
I/O
Level
LVCMOS
LVCOMS
Supply
Frequency Select - see table 3
Frequency Select – see table 3
Case and Electrical Ground
Not present
Function
VCXO Control Voltage Monitor
Under locked conditions VMON should be > 0.3V and <3.0V. The input fre-
quency may be out of range if the voltage exceeds these levels
LVCMOS
Output Disable
Disabled = Logic “1”
Enabled = Logic “0” or no connect
Lock Detect
Locked = Logic “1”
Loss of Lock = Logic “0”
Frequency Output – Primary
Complimentary Frequency Output - Primary
Divided-Down VCSO/VCXO Output, or Disabled
Complimentary Divided-Down VCSO/VCXO Output, or Disabled
Case and Electrical Ground
Input Frequency – AC Coupled
Power Supply Voltage (3.3 V ±5%)
6
OD
I
7
LD
O
LVCMOS
8
9
10
11
12
13
14
FOUT1
CFOUT1
FOUT2
CFOUT2
GND
FIN
VCC
O
O
O
O
GND
I
VCC
LCPECL
LVPECL
LVPECL
LVPECL
Supply
LVCMOS or
LVPECL
Supply
LVCMOS input signal levels are valid for input frequencies < 100 MHz.
Table 8. Control Logic (LVCMOS)
SEL 0
0
0
1
1
SEL 1
0
1
0
1
CLock Input
FIN
1
FIN
2
FIN
3
FIN
4
Page 5 of 8
Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com
Rev: 8/13/2009
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