sinhoo
重要提醒(下列条件适用于
SMD
产品系列内的所有零件)：
•
请参照技术手册中的建议设计电路板。
•
必须根据回流焊/波峰焊技术规范选择合格的焊料，严格控制焊接温度、时间。 •焊
PCB SMD NUT
电路板表贴螺母柱
接工艺会导致产品表面变色。
•
爬锡现象会导致内孔堵塞，因此通孔产品不适用波峰焊，建议采用回流焊。 •所有
产品应在出厂
12
个月内½用，超出有效期会½响可焊性。
•
必须在密封、干燥环境下保存。
•
零件与
PCB
的连接强度由产品、焊盘、焊接效果等因素综合决定
•
必须控制最大锁附扭力，防止元件和
PCB
受到机械破坏。
•
工½电流由
PCB
、电缆接头、电缆横截面等因素综合决定。
•
手册中如有标注参考电流，零件½用材料为黄铜
C3604(H59)
Cautions and Warnings:
The following conditions apply to all goods within the product series of Sinhoo PCB SMD
General:
All recommendations according to the general technical specifications of the data-sheet have to be complied with.
The responsibility for the applicability of customer specific products and use in a particular customer design is always within the authority of the
customer. All technical specifications for standard products do also apply for customer specific products.
Product Specific:
Follow all instructions in the datasheet, especially:
•
The solder profile has to be complied with according to the technical reflow soldering specification, otherwise no warranty will be sustained.
•
Surface discoloration due to reflow processing is permitted.
•
Wave soldering is not applicable. Reflow soldering is recommended.
•
All products shall be used before the end of the period of 12 months based on the product date-code, if not a 100% solderability can't be ensured.
•
The maximum permissible torques must be complied with to prevent mechanical destruction of the elements and PCB.
•
Operating current depends on PCB, cable lug and cross section of the cable
o
•
The connection strength between parts and PCB is determined by product, pad and welding effect
•
If the operating current is marked in the manual, the material used for the parts is brass C3604(H59)
sinhoo
PCB SMD NUT
电路板表贴螺母柱
Thread sizes 080, S1, S1.2, S1.4 and M1.6
All dimensions are in milineters.
Thread
Size x
Pitch
M 1x0.25
M1.2x0.25
M1.4x0.3
M1.6x0.35
M2x0.4
M2.5x0.45
M3x0.5
M3.5x0.6
M4x0.7
—
—
—
Thru
Hole
Type
+0.10
-0.08
—
—
—
—
—
—
—
—
—
3.2
3.6
4.2
SMTSO
SMTSO
SMTSO
SMTSO
SMTSO
SMTSO
SMTSO
SMTSO
SMTSO
SMTSO
SMTSO
SMTSO
1hread or
Thru Hole
Code
10
12
14
16
20
25
30
35
40
32
36
42
0.5 1
0.5
1
0.5 1
0.5
1
0.5 1
—
—
—
—
—
—
—
1
1
1.5
1.5 2
1.5 2
1.5 2
1.5
1.5 2
1.5 2
2
Therad/thru hole sizes M2, M. 5, M3, M3. 5, M4, 3. 6, 4. 2
Length Code"L"±0.13 (Length code in millimeters)
2 2.5 3
2.5 3
2.5 3
2.5 3
2 2.5 3
2.5 3
2.5 3
2.5 3
2 2.5 3
2.5 3
2.5 3
2.5 3
—
—
—
— —
—
—
6.5 7
6.5 7
6.5 7
6.5 7
6.5 7
6.5
7
6.5 7
6.5
7
8
8
8
8
8
8
8
8
—
—
—
— —
—
—
Length Code"L"±0.13
(Length code in
millimeters)
Below is blind hole with 7mm thread depth
Min.
Sheet
A
C
Thickne Max. Max.
ss
H
Nom
Ref. ±0.13
Rated
Hole Size
0D
In Sheet Min.Solder
Current
+0.08
Pad
(A)
2.5
2.5
2.5
2.5
3.73
4.22
4.22
5.41
6.35
4.22
5.41
6.35
4.19
4.19
4.19
4.19
6.2
6.2
6.2
7.77
9.37
6.2
7.77
9.37
15
15
15
15
30
30
30
40
50
20
30
40
Tightening
Torque
(Kgf.cm)
0.3
0.6
1
1.5
1.5
3
5
6
8
—
—
—
—— — —
—
—
—— — —
9 10
9
10
9 10
9 10
9 10
9
10
9 10
9
10 —
11
—
— —
—
—
—
一
0.5
0.5
0.5
0.48 2.41 3.66 —
0.48 2.41 3.66 —
0.48 2.41 3.66 —
0.48 2.41 3.66
—
3.6 —
3.18
3.18
3.18
3.18
*更多
”L"
尺寸未列在表中，请略我们确认！
MORE "L" SIZES ARE NOT LISTED IN THE TABLE, PLEASE CONTACT US FOR CONFIRMATIO
All dimensions are in inches.
Thread
Size
,060-80
(#0-80)
.086-56
(#2-56)
.112-40
(#4-40)
,060-80
(#6-32)
.164-32
(#8-32)
—
—
Thru Hole
+.004 -.003
—
—
—
—
—
.116
.143
Type
Thread or
Thru Hole
Code
080
256
440
632
832
116
143
Length Code"L"±.005
(Length code in 32nds of an inch)
Min. Sheet
A
Thickness Max.
.020
.060
.060
.060
.060
.060
.060
.019
.060
.060
.060
.060
.060
.060
C
Max.
.095
.142
.161
.208
.245
.161
.208
E
Ref.
.144
—
—
—
—
—
—
±.005
—
.219
.219
.281
.344
.219
.281
H
Nom.
.125
—
—
—
—
—
—
0H
Hole Size In
Sheet
+.003-.000
.098
.147
.166
.213
.250
.166
.213
0D
Rated
Min.Solder Current
Pad
(A)
.165
.244
.244
.306
.369
.244
.306
15
30
30
40
50
30
40
Tightening
Torque
(Kgf.cm)
1.5
1.5
5
6
8
—
—
METRIC
公制尺寸
—
— —
—
18
18
18
18
18
—
—
—
20
20
20
20
20
— —
25 30
25 30
25 30
25 30
25 30
0.5
3.5 4
3.5
4
3.5
4
3.5 4
3.5 4
3.5 4
3.5 4
3.5
4
4.5 5
4.5 5
4.5 5
4.5 5
4.5 5
4.5 5
4.5 5
4.5 5
5.5 6
5.5 6
5.5 6
5.5 6
5.5 6
5.5 6
5.5 6
5.5 6
12 13 15
13 15
13 15
13 15
1.53 1.53
5.56 —
5.56
—
5.56 —
7.14
—
8.74 —
5.56
—
7.14 —
8.74
—
11 12
11 12
11
12
11
1.53
1.53 4.09 —
1.53 1.53 4.09 —
1.53 1.53 5.28
—
1.53 1.53 6.22 —
1.53 1.53
4.09
—
1.53 1.53 5.28 —
— —
— —
1
12 13 15
1.5 2
2
2
— —
— —
—
— —
—
—
— —
1.53 1.53 6.22
—
Thread s i zes 080, S1, S1.2, S1.4 and M1.6
Therad/thru hole sizes M2, M. 5, M3, M3. 5, M4, 3. 6, 4. 2
2-56, 4-40, 6-32, 8-32, 116 and 143
SMTSO
SMTSO
SMTSO
SMTSO
SMTSO
SMTSO
SMTSO
.062
.062
.062
.062
.062
.062
.062
.125
.125
.125
.125
.125
.125
.125
—
.187
.187
.187
.187
.187
.187
—
.250
.250
.250
.250
.250
.250
—
.312
.312
.312
.312
.312
.312
—
.375
.375
.375
.375
.375
.375
UNIFIED
英制尺寸
Classification Reflow Profile for SMT components:
Classification Reflow Soldering Profile:
Profile Feature
Preheat Temperature Min〔)
Preheat Temperature Max
Preheat Time t
s
from T
smi
„ to T
smax
Ramp-up Rate (T
L
to T
p
)
Liquidous Temperature
Time t
L
maintained above T
L
Peak package body temperature
Time within 5°C of actual peak temperaure
Ramp-down Rate (T
L
to T
p
)
Time 25°C to peak temperature
tp
L min
Package Classification Reflow Temperature:
Time
Value
150 °C
Properties
PB-Free Assembly I Package Thickness < 1.6 mm
PB-Free Assembly I Package Thickness 1.6 mm - 2.5 mm
PB-Free Assembly I Package Thickness > 2.5 mm
Volume mm
3
<350
260 °C
260 °C
250 °C
Volume mm
3
350-2000
260 °C
250 °C
245 °C
Volume
mm
3
>2000
260 °C
245 °C
245 °C
Ts max
200 °C
ts
60-120 seconds
3 °C/ second max.
T
L
匕
217 °C
60-150 seconds
see table
20 - 30 seconds
6 °C/ second max.
8 minutes max.
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