1.5A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, UUC6
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Microchip(微芯科技) |
| 包装说明 | DIE-6 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 高边驱动器 | NO |
| 输入特性 | STANDARD |
| 接口集成电路类型 | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 代码 | X-XUUC-N6 |
| JESD-609代码 | e0 |
| 功能数量 | 2 |
| 端子数量 | 6 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | TOTEM-POLE |
| 标称输出峰值电流 | 1.5 A |
| 输出极性 | TRUE AND INVERTED |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | UNSPECIFIED |
| 封装形式 | UNCASED CHIP |
| 峰值回流温度（摄氏度） | 240 |
| 认证状态 | Not Qualified |
| 最大压摆率 | 4.5 mA |
| 最大供电电压 | 18 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| 处于峰值回流温度下的最长时间 | 30 |
| 断开时间 | 0.05 µs |
| 接通时间 | 0.05 µs |
| MIC4428CY | MIC4428AJB | MIC4427CY | MIC4427AJB | MIC4426AJB | |
|---|---|---|---|---|---|
| 描述 | 1.5A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, UUC6 | Buffer/Inverter Based MOSFET Driver, 1.5A, BICMOS, CDIP8, CERDIP-8 | 1.5A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, UUC6 | Buffer/Inverter Based MOSFET Driver, 1.5A, BICMOS, CDIP8, CERDIP-8 | Buffer/Inverter Based MOSFET Driver, 1.5A, BICMOS, CDIP8, CERDIP-8 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIE-6 | DIP, DIP8,.3 | DIE-6 | DIP, DIP8,.3 | DIP, DIP8,.3 |
| Reach Compliance Code | compli | compli | compliant | unknown | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | - | - | Microchip(微芯科技) |
| 高边驱动器 | NO | NO | NO | NO | - |
| 输入特性 | STANDARD | STANDARD | STANDARD | STANDARD | - |
| 接口集成电路类型 | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | - |
| JESD-30 代码 | X-XUUC-N6 | R-GDIP-T8 | X-XUUC-N6 | R-GDIP-T8 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | - |
| 功能数量 | 2 | 2 | 2 | 2 | - |
| 端子数量 | 6 | 8 | 6 | 8 | - |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 125 °C | - |
| 输出特性 | TOTEM-POLE | TOTEM-POLE | TOTEM-POLE | TOTEM-POLE | - |
| 标称输出峰值电流 | 1.5 A | 1.5 A | 1.5 A | 1.5 A | - |
| 输出极性 | TRUE AND INVERTED | COMPLEMENTARY | TRUE | TRUE | - |
| 封装主体材料 | UNSPECIFIED | CERAMIC, GLASS-SEALED | UNSPECIFIED | CERAMIC, GLASS-SEALED | - |
| 封装代码 | DIE | DIP | DIE | DIP | - |
| 封装形状 | UNSPECIFIED | RECTANGULAR | UNSPECIFIED | RECTANGULAR | - |
| 封装形式 | UNCASED CHIP | IN-LINE | UNCASED CHIP | IN-LINE | - |
| 峰值回流温度（摄氏度） | 240 | NOT SPECIFIED | 240 | NOT SPECIFIED | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 最大压摆率 | 4.5 mA | 8 mA | 4.5 mA | 8 mA | - |
| 最大供电电压 | 18 V | 18 V | 18 V | 18 V | - |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | YES | NO | YES | NO | - |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | - |
| 温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | - |
| 端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | - |
| 端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | - |
| 端子位置 | UPPER | DUAL | UPPER | DUAL | - |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED | - |
| 断开时间 | 0.05 µs | 0.06 µs | 0.05 µs | 0.06 µs | - |
| 接通时间 | 0.05 µs | 0.06 µs | 0.03 µs | 0.04 µs | - |
| 零件包装代码 | - | DIP | - | DIP | DIP |
| 针数 | - | 8 | - | 8 | 8 |
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