
3A BUF OR INV BASED PRPHL DRVR, DSO8, 4 X 4 MM, LEAD FREE, MLF-8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | DFN |
| 包装说明 | HVSON, |
| 针数 | 8 |
| 制造商包装代码 | MLF |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 内置保护 | TRANSIENT |
| 接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 代码 | S-XDSO-N8 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 湿度敏感等级 | 2 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出电流流向 | SINK |
| 标称输出峰值电流 | 3 A |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVSON |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 | 20 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 18 V |
| 表面贴装 | YES |
| 技术 | BCDMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | MATTE TIN |
| 端子形式 | NO LEAD |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3 mm |

| MIC4125YMLTR | MIC4124YME | MIC4123YMLTR | MIC4124YMLTR | |
|---|---|---|---|---|
| 描述 | 3A BUF OR INV BASED PRPHL DRVR, DSO8, 4 X 4 MM, LEAD FREE, MLF-8 | 3A BUF OR INV BASED PRPHL DRVR, DSO8, 4 X 4 MM, LEAD FREE, MLF-8 | 3A BUF OR INV BASED PRPHL DRVR, DSO8, 4 X 4 MM, LEAD FREE, MLF-8 | |
| 包装说明 | HVSON, | HLSOP, SOP8,.24 | HVSON, | HVSON, |
| Reach Compliance Code | unknow | compliant | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 内置保护 | TRANSIENT | TRANSIENT | TRANSIENT | TRANSIENT |
| 接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 代码 | S-XDSO-N8 | R-PDSO-G8 | S-XDSO-N8 | S-XDSO-N8 |
| JESD-609代码 | e3 | e3 | e3 | e3 |
| 长度 | 3 mm | 4.89 mm | 4 mm | 3 mm |
| 湿度敏感等级 | 2 | 2 | 2 | 2 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出电流流向 | SINK | SINK | SINK | SINK |
| 标称输出峰值电流 | 3 A | 3 A | 3 A | 3 A |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVSON | HLSOP | HVSON | HVSON |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1.68 mm | 1 mm | 1 mm |
| 最大供电电压 | 20 V | 20 V | 20 V | 20 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | BCDMOS | BCDMOS | BCDMOS | BCDMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | MATTE TIN | Matte Tin (Sn) - annealed | MATTE TIN | MATTE TIN |
| 端子形式 | NO LEAD | GULL WING | NO LEAD | NO LEAD |
| 端子节距 | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 |
| 宽度 | 3 mm | 3.9 mm | 4 mm | 3 mm |
| 是否无铅 | 不含铅 | - | 不含铅 | 不含铅 |
| 厂商名称 | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) |
| 零件包装代码 | DFN | - | DFN | DFN |
| 针数 | 8 | - | 8 | 8 |
| 制造商包装代码 | MLF | - | MLF | MLF |
| 标称供电电压 | 18 V | - | 18 V | 18 V |
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