Walsin Technology Corporation
WA04Y
±5%,
Convex Type
General purpose chip resistors array
Size 0402x2
Customer
:
Approval No :
Issue Date
:
Customer Approval :
Page 1 of 7
WA04Y
Version 12
Nov.-2006
Walsin Technology Corporation
FEATURE
1. Small size and light weight
2. Reduced size of final equipment
3. Lower surface mounted assembly costs
4. Higher component and equipment reliability
APPLICATION
•
•
•
Consumer electrical equipment, PDA, Digital Cam-coder, …
EDP, Computer application
Mobile phone, Telecom
DESCRIPTION
The resistors array is constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are
added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The
composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to
within tolerance by laser cutting of this resistive layer.
The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For
ease of soldering the outer layer of these end terminations is a Lead-tin or Tin (lead free) solder alloy.
Fig 1. Outline of chip-R array WA04Y
Page 2 of 7
WA04Y
Version 12
Nov.-2006
Walsin Technology Corporation
QUICK REFERENCE DATA
Item
Series No.
Size
Resistance Tolerance
Resistance Range
TCR (ppm/°C)
10Ω≤R<1MΩ
R<10Ω, R>1MΩ
Max. dissipation at
T
amb
=70°C
Max. Operation
Voltage (DC or RMS)
Max. overload voltage
Climatic category
Note :
1.
2.
This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication
60115-8”
Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by
General Specification
WA04Y(Convex)
0402x2 (1005x2)
±5%
10Ω ~ 1MΩ, Jumper
≤ ±
300
-
1/16 W
25V
50V
55/155/56
RCWV
=
Rated Power
×
Resistance Value
or Max. RCWV listed above, whichever is lower.
Dimensions
WA04Y
L
W
T
P
A
Ta
Tb
1.00
±
0.10
1.00
±
0.10
0.35
±
0.10
0.65
±
0.10
0.34
±
0.10
0.20
±
0.15
0.25
±
0.15
W
T
a
P
T T
b
A
L
Page 3 of 7
WA04Y
Version 12
Nov.-2006
Walsin Technology Corporation
Marking
No marking for WA04Y chip resistors array
FUNCTIONAL DESCRIPTION
Product characterization
Standard values of nominal resistance are taken from the E24 series for resistors with a tolerance of
±5%,
The values of the E24 series are in accordance with “IEC publication 60063”
Derating
The power that the resistor can dissipate depends on the operating temperature; see Fig.2
Figure 2. Maximum dissipation in percentage of rated power
As a function of the ambient temperature
CONSTRUCTION
R1=R2
MOUNTING
Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by
automatic placement systems.
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.
Page 4 of 7
WA04Y
Version 12
Nov.-2006
Walsin Technology Corporation
SOLDERING CONDITION
The robust construction of chip resistors
allows them to be completely immersed in a
solder bath of 260°C for one minute.
Therefore, it is possible to mount Surface
Mount Resistors on one side of a PCB and
other discrete components on the reverse
(mixed PCBs).
Surface Mount Resistors are tested for
solderability at 235°C during 2 seconds.
The test condition for no leaching is 260°C
for 60 seconds. Typical examples of
soldering processes that provide reliable
joints without any damage are given in Fig
3.
Fig 3. Infrared soldering profile for Chip Resistors array
CATALOGUE NUMBERS
The resistors have a catalogue number starting with .
WA04
Size code
WA04 : 0402
Y
Type code
Y
: x2, convex
472_
Resistance code
E24 : 2 significant digits followed
by no. of zeros and a blank
4.7Ω
10Ω
220Ω
Jumper
=4R7_
=100_
=221_
=000_
J
Tolerance
J :
±5%
P : Jumper
T
Packaging code
T : 7” Reel
taping
_
Termination code
_ = SnPb base (“_”
means a blank)
L
=
Sn base (lead
free)
(“_” means a blank)
Reeled tape packaging
: 8mm width paper taping 10,000pcs per reel.
Page 5 of 7
WA04Y
Version 12
Nov.-2006
FPGA/CPLD
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