电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CHP1/21004870FLF

产品描述Fixed Resistor, Metal Glaze/thick Film, 0.5W, 487ohm, 300V, 1% +/-Tol, 100ppm/Cel,
产品类别无源元件    电阻器   
文件大小359KB,共4页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准
下载文档 详细参数 全文预览

CHP1/21004870FLF概述

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 487ohm, 300V, 1% +/-Tol, 100ppm/Cel,

CHP1/21004870FLF规格参数

参数名称属性值
是否Rohs认证符合
Objectid7213471316
Reach Compliance Codecompliant
ECCN代码EAR99
构造Cylindrical
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
封装直径2.01 mm
封装长度5.08 mm
封装形状CYLINDRICAL PACKAGE
封装形式MELF
包装方法TR, 7 INCH
额定功率耗散 (P)0.5 W
额定温度70 °C
参考标准AEC-Q200
电阻487 Ω
电阻器类型FIXED RESISTOR
尺寸代码2008
表面贴装YES
技术THICK FILM/METAL GLAZE
温度系数100 ppm/°C
端子形状WRAPAROUND
容差1%
工作电压300 V

文档预览

下载PDF文档
Resistors
Cylindrical High Power
Surface Mount Metal Glaze™
CHP
CHP Series
Surface Mount Metal Glaze
TM
Up to 2 watts
Up to 1000 volts
0.2 ohm to 2.2 megohm range
Up to 2 watts
RoHS-compliant version available
Up to 1000 volts
150°C maximum operating temperature
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
AEC-Q200
150°C maximum operating temperature
Cylindrical High Power
Metal Glaze™
thick film element
fired at 1000°C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
High
temperature
dielectric
coating
Solder over
High
nickel barrier
temperature
dielectric
coating
nickel barrier
OBSOLETE
IRC
Type
Indus-
try
Foot-
print
1206
Size
Code
1
Solder over
All Pb-free parts comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3)
Electrical Data
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
teristics
Charac
Thermal Shock
Temperature Coefficient
Maximum
m Change
Maximu
Change
As specified
Test Method
±0.25% +.01 Ω
MIL-PRF-55342H, §4.8.3
MIL-R-55342H Par 3.16 (-55°C +
+150°C / -65°C)
(MIL-STD-202, Method 107G:
125°C)
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
Test Method
Thermal Shock
Low Temperature Operation
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.25% + 0.01 ohm
±0.5% +.01 Ω
MIL-PRF-55342H, §4.8.5
(-65°C)
MIL-PRF-55342H, §4.8.6
(150°C x 100 Hours)
Short Time Overload
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Moisture Resistance
Exposure
Resistance to Bonding
High Temperature Exposure
±0.5% + 0.01 ohm
±1% for R>100K ohm
±1% for R>100KΩ
±0.5% +.01 Ω
MIL-R-55342H Par 3.12
MIL-PRF-55342H, §4.8.7
2.5 x
P x R
for 5 seconds
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.5% +.01 Ω
As specified
±1% +.01 Ω
MIL-PRF-55342H, §4.8.8.2
±0.25% + 0.01 ohm
95% minimum coverage
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-PRF-55342H, §4.8.8.2
MIL-STD-202, Method 208 (245°C for 5 seconds)
(MIL-STD-202, Method 106G)
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
Temperature Coefficient
Solderability
Life Test
Moisture Resistance
Terminal Adhesion Strength
MIL-PRF-55342H, §4.8.11
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
1200 gram push from underside of mounted chip for 60 seconds
(MIL-STD-202, Method 208H)
exert pull on chip contacts for 5 seconds
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
Solderability
Life Test
±1% +.01 Ω
IRC – defined
Terminal Adhesion Strength (push)
±1% + 0.01 ohm
Chip mounted in center of 90mm long board, deflected 1mm so as to
(no mechanical damage)
1200 gram push from underside of mounted device for 60 sec
no mechanical damage
95%
0.01 ohm
±1% +
minimum coverage
no mechanical damage
MIL-PRF-55342H, §4.8.12
±1% +.01 Ω
IRC reserves the right to make changes in product specification
(no mechanical damage)
without notice or liability.
General Note
Terminal Adhesion
Strength (flex)
All information is subject to IRC’s own data and is considered accurate at time of going to print.
IRC-defined
Device mounted in center of 90mm long board, deflected 1 mm to exert
pull on contacts for 5 seconds
General Note
• Facsimile: 361 992 3377 • Website: www.irctt.com
Telephone: 361 992 7900
© IRC Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
CHP
BI Technologies
Series Issue March
Welwyn
3
IRC
2011 Sheet 1 of
A subsidiary of
TT electronics plc
www.ttelectronics.com/resistors
© TT Electronics plc
03.19
TM1804 DEMO
95443 流水燈LED還是要多棵一點,比較有感覺,所以再加一串上去一共14個led,TM1804是可以直接联級擴充的,MCU是用1T的51晶振12Mhz ,實物照:影片如下http://player.youku.com/player.php/sid/XNDQ1 ......
naga568 51单片机
升压boost拓扑电路限制占空比?
升压boost拓扑电路限制占空比?, 而降压 buck的电路 就不用限制呢? ...
Aguilera 电源技术
运放差分放大问题
469813上图是:差分采集电压放大后差分输入ADC转换的电路图 Vshunt是正常的电压输入,R1=R3 1K,R2=R4 5K,R6=R5 100Ω,Vcm=2.5V,OPA333为CMOS精密运放 AINN和AINP是ADC的差分输入 ......
bigbat 模拟电子
急!调试A4的LCD遇到的问题
大家好,现在我在调试A4(ARM11)的LCD驱动遇到一些问题不知道如何去解决,请指点一二。 1 在调节背光时,一点屏,屏的亮度会变化。 2 在背光低时,如果功率过大,频闪的厉害。 3 LCD显示, ......
laopo163 嵌入式系统
【项目外包】音视频压缩记录板
音视频压缩记录板 项目预算:¥ 30,000~40,000 开发周期: 60 天 项目分类: 嵌入式 竞标要求: 项目 ......
CSTO项目交易 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 895  1433  938  1514  1781  19  29  31  36  30 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved