HLMP-KA45
T-1 (3 mm) High Intensity InGaN Lamp
Data Sheet
Description
This blue LED is designed in an industry standard T-1
package with clear and non-diffused optics. This lamp
is ideal for use as indicators and for general purpose
lighting.
Features
•
Popular T1 diameter package
•
General purpose leads
•
Reliable and rugged
•
Binned for color and intensity
•
InGaN blue dice
Applications
•
Status indicators
•
Small message panel
•
Running and decorative lights for commercial use
•
Back-lighting
•
Consumer audio
Package Dimensions
1.14 (.045)
0.51 (.020)
3.43 (.135)
2.92 (.115)
∅
3.17 (.125)
2.67 (.105)
4.70 (.185)
4.19 (.165)
6.35 (.250)
5.58 (.220)
Notes:
1. All dimensions are in mm (inches).
2. An epoxy meniscus may extend about 1 mm (0.040") down the leads.
3. For PCB hole recommendations, see the Precautions section.
24.1(.95) MIN.
0.65 (0.026) max.
1.52 (.060)
1.02 (.040)
2.79 (.110)
2.29 (.090)
(0.022) 0.55 SQ. TYP.
(0.016) 0.40
CAUTION:
Devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. For additional details, refer to Application Note AN-1142.
Ordering Information
HLM P -X X X X – X X X X X
Mechanical Option
00: Bulk
Color Bin Selection
0: Full color bin distribution
Maximum Iv Bin Options
0: Open (No maximum limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Viewing Angle
45:50 degree
Color
A: Blue
Package
K: T-1
Absolute Maximum Ratings at T
A
= 25
°C
Parameter
DC Forward Current
[1]
Peak Pulsed Forward Current
[2]
Power Dissipation
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Note:
1. Derate linearly as shown in Figure 2.
2. Duty factor = 10%, Frequency = 1 kHz.
HLMP-KA45 (Blue)
30
100
116
115
–35 to +85
–35 to +85
Unit
mA
mA
mW
°C
°C
°C
2
Device Selection Guide
Color and Dominant
Wavelength
λ
d
(nm)
Typ.
Blue 470
Blue 470
Blue 470
Part Number
HLMP-KA45-E0000
HLMP-KA45-J0000
HLMP-KA45-NQ000
Luminous Intensity
Iv (mcd) at 20 mA
Min.
85
240
680
Luminous Intensity
Iv (mcd) at 20 mA
Max.
–
–
1500
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength,
λ
d
is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
Electrical /Optical Characteristics Table at T
A
= 25
°C
Parameter
Forward Voltage
Capacitance
Thermal Resistance
Viewing Angle
Dominant Wavelength
Peak Wavelength
Spectral Halfwidth
Symbol
V
F
C
Rθ
J-PIN
2θ
1/2
λ
d
λ
P
Δλ
1/2
Min.
2.8
Typ.
3.2
40
465
50
470
464
24
Max.
3.8
Units
V
pF
°C/W
deg
nm
nm
nm
Test Conditions
I
F
= 20 mA
V
F
= 0, f = 1 MHz
LED Junction-to-Cathode Lead
I
F
= 20 mA
Peak of Wavelength of Spectral
Distribution at I
F
= 20 mA
Wavelength Width at Spectral
Distribution ½ Power Point at
I
F
= 20 mA
Notes:
1. 2
θ
1/2
is the off-axis angle where the luminous intensity is 1/2 the on axis intensity.
2. The dominant wavelength,
λ
d
, is derived from the Chromaticity Diagram and represents the color of the lamp.
3
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
35
30
FORWARD CURRENT – mA
25
20
15
10
5
380
430
480
530
580
WAVELENGTH - nm
630
680
0
0
20
40
60
AMBIENT TEMPERATURE – °C
80
100
Rθ
J-A
= 780°C/W
Figure 1. Relative Intensity vs. Wavelength
RELATIVE INTENSITY
Figure 2. Maximum forward current vs. ambient temperature based on T
jmax
= 115
°C
30
25
FORWARD CURRENT - mA
20
15
10
5
0
0
1
2
FORWARD VOLTAGE - V
3
4
RELATIVE INTENSITY
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90 -75 -60 -45 -30 -15 0 15 30 45 60 75
ANGULAR DISPLACEMENT – DEGREES
90
Figure 3. Forward Current vs. Forward Volatge
Figure 4. Radiation pattern
Intensity Bin Limit
Intensity Range (mcd)
Bin
E
F
G
H
J
K
L
M
N
P
Q
Color Categories
Lambda (nm)
Max.
110.0
140.0
180.0
240.0
310.0
400.0
520.0
680.0
880.0
1150.0
1500.0
Min.
85.0
110.0
140.0
180.0
240.0
310.0
400.0
520.0
680.0
880.0
1150.0
Color
Blue
Cat #
1
2
3
4
5
Min.
460.0
464.0
468.0
472 .0
476.0
Max.
464.0
468.0
472 .0
476.0
480.0
Tolerance for each bin limit is ±0.5 nm.
Mechanical Option Matrix
Mechanical Option Code
00
Definition
Bulk Packaging, minimum increment
500 pcs/bag
Maximum tolerance for each bin limit is ±15%.
Note:
All categories are established for classification of products. Products may
not be available in all categories. For further clarification/information,
contact your local Avago representative.
4
Precautions
Lead Forming
•
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
•
If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
•
It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
•
Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
•
If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
•
Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25
°C,
before handling.
•
Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
•
Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size
Lead size (typ.)
Dambar shear-
off area (max.)
Lead size (typ.)
Dambar shear-
off area (max.)
0.45 × 0.45 mm
(0.018 × 0.018 in.)
0.65 mm
(0.026 in)
0.50 × 0.50 mm
(0.020 × 0.020 in.)
0.70 mm
(0.028 in)
Soldering Conditions
•
Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
•
The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
•
Recommended soldering conditions:
Wave
Soldering
Pre-heat Temperature
Pre-heat Time
Peak Temperature
Dwell Time
105
°
C Max.
60 sec Max.
250
°
C Max.
3 sec Max.
Diagonal
0.636 mm
(0.025 in)
0.919 mm
(0.036 in)
0.707 mm
(0.028 in)
0.99 mm
(0.039 in)
Manual Solder
Dipping
–
–
260
°
C Max.
5 sec Max.
Plated Through-
Hole Diameter
0.98 to 1.08 mm
(0.039 to 0.043 in)
1.05 to 1.15 mm
(0.041 to 0.045 in)
Note:
Refer to application note AN1027 for more information on soldering LED
components.
TURBULENT WAVE
250
LAMINAR
HOT AIR KNIFE
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
200
TEMPERATURE (°C)
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
150
100
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
50
PREHEAT
0
10
20
30
40
50
60
TIME (MINUTES)
70
80
90
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
100
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Figure 5. Recommended wave soldering profile
5
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