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MRC1/2-100-R300-G-BLK

产品描述Fixed Resistor, Metal Glaze/thick Film, 0.5W, 0.3ohm, 200V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 1206, MELF
产品类别无源元件    电阻器   
文件大小56KB,共4页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
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MRC1/2-100-R300-G-BLK概述

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 0.3ohm, 200V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 1206, MELF

MRC1/2-100-R300-G-BLK规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
Objectid1862757015
包装说明MELF, 1206
Reach Compliance Codecompliant
ECCN代码EAR99
构造MELF
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
最低工作温度-55 °C
封装直径1.6 mm
封装长度3.25 mm
封装形状CYLINDRICAL PACKAGE
封装形式MELF
包装方法Bulk
额定功率耗散 (P)0.5 W
额定温度70 °C
电阻0.3 Ω
电阻器类型FIXED RESISTOR
尺寸代码1206
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数100 ppm/°C
端子形状WRAPAROUND
容差2%
工作电压200 V

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METAL GLAZE™ HIGH POWER DENSITY
SURFACE MOUNT POWER RESISTOR
ISO-9001
Registered
OBSOLETE MRC1
MRC
SERIES
(For other size see current datasheet)
1/2 watt in 1/8 watt package (1206 footprint)
1 watt in 1/2 watt package (2010 footprint)
MRC1/2: 0.1 ohm to 10,000 ohm
MRC1: 0.05 ohm to 1.0 ohm
(contact factory for higher values)
150°C maximum operating temperature
• Superior surge handling capability
Metal Glaze
TM
thick film
element fired at 1000°C to
solid ceramic substrate
High temperature
dielectric coating
60/40 Solder over nickel barrier
MRC SPECIFICATIONS:
Size Industry
Code
1
Footprint
C
1206
IRC
Type
MRC1/2
Maximum
Working Maximum
Power Rating Voltage
2
Voltage
1/2W @ 70°C
200
400
Resistance
Range (ohms)
3
0.1 to 0.99
1.0 to 10K
20 to 10K
0.05 to 0.099
0.10 to 1.0
3
E
1
2010
MRC1
1W @ 70°C
350
700
Tolerance
(±%)
3
1, 2, 5
1, 2, 5
0.25, 0.5
2, 5
1, 2, 5
TCR
(ppm/°C)
3
100
50, 100
50, 100
200
100
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Low Range
See page 8 for product dimensions, recommended solder pads, and standard packaging.
2
Not to exceed
√PxR
Consult factory for tighter TCR, tolerance, or resistance values.
MRC APPLICATIONS:
The MRC1/2 will dissipate 1/2 watt at 70°C on a 1206 footprint, while the MRC 1 will dissipate 1 watt at 70°C on a 2010
footprint. The MRC is recommended for applications where board real estate is a major concern. Due to the high power
density and superior surge handling capability, it is also recommended as a direct replacement on existing board
designs where standard 1206 or 2010 resistors are marginal or failing.
MRC PERFORMANCE CHARACTERISTICS:
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
Maximum Change
As specified
±(0.5% +0.01 ohm)
±(0.25% +0.01 ohm)
±(1.0% +0.01 ohm)
±(0.5% +0.01 ohm)
±(0.25% 0.01 ohm)
95% minimum coverage
±(0.5% +0.01 ohm)
±(1.0% +0.01 ohm)
±(1% +0.01 ohm)
no mechanical damage
±(1% + 0.01 ohm)
no mechanical damage
Test Method
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x
√PxR
for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hour at 70°C intermittent)
1200 gram push from underside of mounted chip for 60 seconds
Chip mounted in center of 90mm long board, deflected 5mm so as to
exert pull on chip contacts for 10 seconds
WIREWOUND AND FILM TECHNOLOGIES DIVISION
736 Greenway Road
Boone, North Carolina 28607-1860
Tel: 828-264-8861
Fax: 828-264-8866
www.irctt.com
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