TiWi-SL MODULE
DATASHEET
Integrated 802.11 b/g WLAN Module
FEATURES
IEEE
802.11 b/g compliant.
Typical WLAN Transmit Power:
o
+18.0 dBm, 1 Mbps, CCK (b)
o
+13.9 dBm, 54 Mbps, OFDM (g)
Typical WLAN Sensitivity:
o
- 88 dBm, 8% PER,11 Mbps
o
-75 dBm, 10% PER, 54 Mbps
Miniature footprint: 14 mm x 21 mm
Low height profile: 2.3 mm
Operating Voltage: 2.9V to 3.6V
Operating temperature: -40 to +85 C
Embedded network stack
Wireless Security WEP, WPA Personal,
WPA2 Personal
Terminal for PCB/Chip antenna feeds
Compact design based on Texas
Instruments CC3000 transceiver
SPI host interface
Simple integration with microcontrollers and
microprocessors
Worldwide acceptance: FCC (USA), IC
(Canada), and CE (Europe)
Modular certification allows reuse of LSR
FCC ID and ETSI certification without
repeating the expensive testing on your end
product
RoHS compliant
Streamlined development with LSR design
services
o
DESCRIPTION
The TiWi-SL is a high performance 2.4 GHz
WLAN module that contains an IP networking
stack in a pre-certified footprint that simplifies
the process of implementing internet
connectivity.
The module includes the necessary PHY, MAC,
and network layers to support WLAN
applications through a simple SPI connection to
host microcontrollers or other embedded
processors.
Need to get to market quickly? Not an expert in
802.11. Need a custom antenna? Would you
like to own the design? Would you like a
custom design? Not quite sure what you need?
Do you need help with your host board? LSR
Design Services will be happy to develop
custom hardware or software, or assist with
integrating the design. Contact us at
sales@lsr.com or call us at 262-375-4400.
Home automation
Home Network aggregators
Remote appliance diagnostics/support
Home security
Remote storage devices
Home network appliance
Cameras and video surveillance
Fitness
Cable replacement for medical and personal
healthcare
APPLICATIONS
Thermostats, appliances, HVAC controller,
and remote displays, Smart Energy
Home entertainment control
Sensor Networks
Medical
Home Monitoring
Toys
The information in this document is subject to change without notice.
330-0085-R4.1
Copyright © 2011-2014 LSR
Page 1 of 40
TiWi-SL MODULE
DATASHEET
ORDERING INFORMATION
Order Number
450-0067
450-0067R
450-0089
Description
TiWi-SL Module (Tray, SPQ = 50)
TiWi-SL Module (Tape and Reel, SPQ = 1000)
TiWi-SL EM Board with Chip Antenna
Table 1 Orderable TiWi-SL Part Numbers
MODULE ACCESSORIES
Order Number
Description
001-0001
2.4 GHz Dipole Antenna with Reverse
Polarity SMA Connector
080-0001
U.FL to Reverse Polarity SMA Bulkhead
Cable 105mm
Table 2 Module Accessories
APPLICABLE DOCUMENTS
TiWi-SL EM Board User Guide (330-0086)
TiWi-SL Antenna Design Guide (330-0092)
The information in this document is subject to change without notice.
330-0085-R4.1
Copyright © 2011-2014 LSR
Page 2 of 40
TiWi-SL MODULE
DATASHEET
BLOCK DIAGRAM
Figure 1 TiWi-SL Module Block Diagram – Top Level
The information in this document is subject to change without notice.
330-0085-R4.1
Copyright © 2011-2014 LSR
Page 3 of 40
TiWi-SL MODULE
DATASHEET
FUNCTIONAL BLOCK FEATURES
WLAN Features
IEEE802.11b/g compliant WLAN MAC Baseband Processor and RF transceiver
IEEE Std 802.11d,i PICS compliant
Supports serial debug interface
Supports Serial Peripheral Interface (SPI) Host Interface
Media Access Controller (MAC)
o
Embedded ARM™ Central Processing Unit (CPU)
o
Hardware-Based Encryption/Decryption Using 64-, 128-Bit WEP, TKIP or AES Keys,
o
Supports requirements for Wireless Fidelity (Wi-Fi) Protected Access (WPA and
WPA2.0) and IEEE
o
Std 802.11i [Includes Hardware-Accelerated Advanced-Encryption Standard (AES)]
Baseband Processor
2.4GHz Radio
o
Digital Radio Processor (DRP) implementation
o
Internal LNA
o
Supports : IEEE Std 802.11b, 802.11g, 802.11b/g
Network Stack Supported Protocols
Transport layer:
o
TCP
o
UDP
Network layer:
o
IPv4
o
Ping
o
DHCP
o
DNS Client
Link layer:
o
ARP
Wireless Security System Features
Supported modes:
o
Open (no security)
o
WEP
o
WPA-personal
o
WPA2-personal
Supported encryption types:
o
WEP
o
TKIP
o
AES
o
Open
The information in this document is subject to change without notice.
330-0085-R4.1
Copyright © 2011-2014 LSR
Page 4 of 40
TiWi-SL MODULE
DATASHEET
TABLE OF CONTENTS
FEATURES .......................................................................................................................... 1
APPLICATIONS ................................................................................................................... 1
DESCRIPTION ..................................................................................................................... 1
ORDERING INFORMATION ................................................................................................ 2
MODULE ACCESSORIES ................................................................................................... 2
APPLICABLE DOCUMENTS ............................................................................................... 2
BLOCK DIAGRAM ............................................................................................................... 3
FUNCTIONAL BLOCK FEATURES .................................................................................... 4
WLAN Features ........................................................................................................................................... 4
Network Stack Supported Protocols ......................................................................................................... 4
Wireless Security System Features .......................................................................................................... 4
PIN DESCRIPTIONS ............................................................................................................ 8
ELECTRICAL SPECIFICATIONS ...................................................................................... 10
Absolute Maximum Ratings ..................................................................................................................... 10
Recommended Operating Conditions .................................................................................................... 10
General Characteristics ............................................................................................................................ 11
TCP and UDP Throughput ........................................................................................................................ 12
Power Consumption ................................................................................................................................. 13
RF Characteristics .................................................................................................................................... 14
SPI HOST CONTROLLER INTERFACE............................................................................ 20
Overview .................................................................................................................................................... 20
SPI Interface Description.......................................................................................................................... 20
SPI Line Description ................................................................................................................................. 20
SPI Timing .................................................................................................................................................. 21
DEVICE POWER-UP AND ENABLE ................................................................................. 22
DEVICE POWER-DOWN ................................................................................................... 23
SOLDERING RECOMMENDATIONS ................................................................................ 24
Recommended Reflow Profile for Lead Free Solder ............................................................................. 24
CLEANING ......................................................................................................................... 25
The information in this document is subject to change without notice.
330-0085-R4.1
Copyright © 2011-2014 LSR
Page 5 of 40
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