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H2010CPC2611F30-W

产品描述Fixed Resistor, Metal Glaze/thick Film, 1W, 2610ohm, 150V, 1% +/-Tol, -300,300ppm/Cel, 2009,
产品类别无源元件    电阻器   
文件大小128KB,共1页
制造商State of the Art Inc
标准
下载文档 详细参数 全文预览

H2010CPC2611F30-W概述

Fixed Resistor, Metal Glaze/thick Film, 1W, 2610ohm, 150V, 1% +/-Tol, -300,300ppm/Cel, 2009,

H2010CPC2611F30-W规格参数

参数名称属性值
是否Rohs认证符合
Objectid930023391
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN代码EAR99
YTEOL7.9
构造Chip
JESD-609代码e4
端子数量2
最高工作温度150 °C
最低工作温度-65 °C
封装高度0.71 mm
封装长度5.13 mm
封装形式SMT
封装宽度2.38 mm
包装方法Waffle Pack
额定功率耗散 (P)1 W
电阻2610 Ω
电阻器类型FIXED RESISTOR
系列2010(STD)-THICKFILM
尺寸代码2009
技术METAL GLAZE/THICK FILM
温度系数300 ppm/°C
端子面层Silver (Ag)
容差1%
工作电压150 V

H2010CPC2611F30-W文档预览

2010 Thick Film Chip Resistor
Standard Grade, Wraparound
PERFORMANCE CHARACTERISTICS
Resistance Range
Tolerances (1)
TCR
Thermal Resistance
Maximum Power
Maximum Voltage
(1)+/- 0.5% limited availability
1
W-40
M
W
0.5%,1%, 2%, 5%,10%
±100, ±200, ±300 ppm
48.4°C/W
1000 mW
150 Volts
GLASS
PASSIVATION
RESISTOR
FILM
96% ALUMINA CHIP
WRAPAROUND
TERMINATIONS
CURRENT NOISE
TEMPERATURE RISE (°C)
POWER DISSIPATION
fiber epoxy board
ceramic board
ENVIRONMENTAL PERFORMANCE (2)
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Bonding Exposure
Moisture Resistance
High Temperature Exposure
Life Test
±0.03%
±0.03%
±0.03%
±0.03%
±0.05%
±0.05%
See Chart
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
(2)Typical resistance change, test methods and criteria
per MIL-PRF-55342.
PART NUMBERING
S 2010 C P X 150 J 20 - TR
PACKAGING CODE: - TR = Tape/Reel - W = Waffle Carrier (Default packaging is Bulk)
TEMPERATURE CHARACTERISTIC: 10: ±100 ppm 20: ±200 ppm 30: ±300 ppm
TOLERANCE: F: 1% G: 2% J: 5% K: 10% M: 20%
RESISTANCE VALUE:
Four digits are used for tolerances of 1% or lower, three digits are used above 1%. Leading digits are significant while the last digit
specifies the number of zeros to add. The letter "R" is used to represent the decimal for fractional ohmic values. Example: 5R6 is 5.6
ohms.
TERMINATION FINISH: X: Sn60 over Nickel (Solderable) C: Silver bearing (Epoxy bondable-RoHS) G: Gold (Epoxy bondable-RoHS)
Y: Silver over Nickel (Solderable -RoHS) Z: Gold over Nickel (Solderable-RoHS)
PRODUCT DESIGNATION: P: Thick film on alumina U: Untrimmed alumina (10% & 20% tolerance only)
TERMINATION TYPE: C: Wraparound termination
SIZE CODE
GRADE: S: Standard Production H: High Reliability (For Screening options, contact the factory)
MECHANICAL
INCHES
MILLIMETERS
.252
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.202 (.200 - .210)
.094 (.093 - .100)
.028 (.023 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.164 (.160 - .168)
.0323 grams
5.13
2.38
0.71
0.51
0.48
4.17
(5.08 - 5.33)
(2.36 - 2.54)
(0.58 - 0.84)
(0.38 - 0.64)
(0.38 - 0.64)
(4.06 - 4.27)
.100
.154
.049
“Specifications subject to change without notice.”
STATE OF THE ART, INC.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004
www.resistor.com
Fax (814) 355-2714
Toll Free 1-800-458-3401
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