High Performance COM Express
®
Dramatically Increased Graphics Performance
conga-BM67
Up to Intel® Core™ i7-2710QE
quad core processor
Extreme graphics performance
COM Express™ Type 2 module featuring
DisplayPort and HDMI
DRAM
Chipset
Ethernet
I/O Interfaces
Sound
Graphics
Formfactor
CPU
Formfactor COM Express™ Basic, (95 x 125 mm), Type II Connector Layout
Intel
®
Core™ i7-2710QE (SV), 2,1 GHz (32 nm process, 6MB cache, 1333 MHz, TDP 45 W, 989 rPGA package)
Intel
®
Core™ i5 -2510E (SV), 2.5 GHz (32 nm process, 3MB cache, 1333 MHz, TDP 35 W, 989 rPGA package)
Intel
®
Core™ i3-2330E, 2.2 GHz, (32 nm process, 3MB cache, 1333 MHz, TDP 35W, 989 rPGA package)
Intel
®
Celeron
®
B810, 1.6 GHz (32nm process, 2MB cache, TDP 35W, 989 rPGA package)
Integrated dual channel memory controller, up to 25,6 GByte/sec. memory bandwidth,
Integrated Intel® HD Graphics with dynamic frequency up to 1100 MHz, Intel® Clear Video HD Technology
2 Sockets, SO-DIMM DDR3 1333 MHz, up to 16 GByte
Mobile Intel® 6 Series Chipset, Intel® QM67 Platform Controller Hub
Gigabit Ethernet, Intel® Ethernet PHY with AMT support
6x PCI Express™ lanes, 4x Serial ATA® (AHCI) with RAID support, 1x EIDE (UDMA-66/100) optional, 8x USB 2.0 (EHCI), PCI Bus 33 MHz Rev. 2.3, LPC bus, I²C
bus (fast mode, 400 kHz, multi-master)
Digital High Definition Audio Interface with support for multiple audio codecs
Processor integrated Mobile Intel® 6 Series HD graphics, OpenGL 3.0 and DirectX 10.1 support, Two independent pipelines for full dual view support, High
performance hardware MPEG-2 decoding, WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 Mbit/s, hardware motion compensation (using
HDMI 1.4 with 3D), no PEG support
Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface, VESA mappings, resolutions up to 1920x1200, Automatic Panel, Detection via
EDID/EPI
3x DisplayPorts 1.1, max. resolution 2560x1600
3x ports shared
350 MHz RAMDAC, resolutions up to QXGA (2048x1536)
1 x Intel compliant SDVO ports with 200MPixel/sec. Supports external DVI, TV and LVDS transmitter
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup Data Backup, I²C bus (fast
mode, 400 kHz, multi-master), Power Loss Control
AMI Aptio
®
UEFI 2.x firmware, 8 MByte serial SPI firmware flash
The conga-BM67 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and RSA algo-
rithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce
will benefit also with improved authentication, integrity and confidence levels.
ACPI 3.0 with battery support
Microsoft® Windows 8, Microsoft® Windows7, Microsoft® Windows® embedded Standard, Microsoft® Windows XP, Linux
Typ. application: Processor TDP: 35 .. 45 W, see manual for full details
Operating: 0 .. +60°C Storage: -20 .. +80°C
10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.
95 x 125 mm (3.74” x 4.92”)
LVDS
Display Port (DP)
HDMI or DVI
CRT Interface
SDVO
congatec Board Controller
Embedded BIOS Features
Security
Power Management
Operating Systems
Power Consumption
Temperature:
Humidity Operating:
Size
congatec AG, Auwiesenstraße 5, 94469 Deggendorf, Germany
Phone +49 (991) 2700-0, Fax +49 (991) 2700-111, info@congatec.com
w w w.congatec.com
Block Diagram conga-BM67
A-B
Power Management and Control Signals
High Definition Audio (HDA) I/F
GPIs/GPOs
4x SATA
Gbit Ethernet
SM Bus
I2C
LCD I/F
(LVDS)
8x USB 2.0
CRT
Order Information conga-BM67
Article
conga-BM67/i7-2710QE
conga-BM67/i5-2510E
conga-BM67/i3-2330E
conga-BM67/B810
PN
046101
046102
046104
046105
046122
046123
046124
046125
046120
046121
068755
068756
068757
Description
Intel® Core™ i7-2710QE Quad Core Processor 2.1GHz, 6MByte L2 cache and 1600MT/s dual
channel DDR3 memory interface
Intel® Core™ i5-2510E dual core processor 2.5GHz, 3MByte L2 cache and 1333MT/s dual channel
DDR3 memory interface
Intel® Core™ i3-2330E dual core processor 2.2GHz, 3MByte L2 cache and 1333MT/s dual channel
DDR3 memory interface
Intel® Celeron™ B810 dual core processor 1.6GHz, 2MByte L2 cache and 1333MT/s dual channel
DDR3 memory interface
Standard passive cooling solution with integrated heat pipes, 15mm fins and 20mm overall heat
sink height. All stand-offs are with 2.7mm bore hole.
Standard passive cooling solution with integrated heat pipes, 15mm fins and 20mm overall
heat sink height. All stand-offs are M2.5mm threaded.
Standard active cooling solution with integrated heat pipes, 15mm fins, 20mm overall heat sink
height and integrated 12V fan. All stand-offs are with 2.7mm bore hole.
Standard active cooling solution with integrated heat pipes, 15mm fins, 20mm overall heat sink
height and integrated 12V fan. All stand-offs are M2.5mm threaded.
Standard heatspreader with integrated heat pipes. All stand-offs are with 2.7mm bore hole.
Standard heatspreader with integrated heat pipes. All stand-offs are M2.5mm threaded.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 2GB RAM
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM
6 PCIe Lanes
Intel®
(optional)
TPM
Gigabit Ethernet
PHY 82579LM
LPC Bus
BIOS
(Flash)
Processor
RTC
conga-BM67/CSP-HP-B
conga-BM67/CSP-HP-T
conga-BM67/CSA-HP-B
conga-BM67/CSA-HP-T
conga-BM67/HSP-HP-B
conga-BM67/HSP-HP-T
DDR3L-SODIMM-1600 (2GB)
DDR3L-SODIMM-1600 (4GB)
DDR3L-SODIMM-1600 (8GB)
Board Controller
STMicroelectronics
STM32
1x x1 PCIe Link
Watchdog
CORE
DMI x4
(Direct Media
Interface)
Intel® FDI
(Flexible Display
Interface)
CORE
CORE
SPI
8 PCIe Lanes
1x x1 PCIe Link
Mobile Intel® QM67
Express Chipset
Intel® BD82QM67 PCH
(Intel® BD82HM65 for Celeron™
equipped modules)
1x SATA
Digital Display
Interface
3x HDMI/DVI OR
3x DisplayPort (DP)
CORE
BC SPI
2nd Generation
Intel® Core™ i7
Intel® Core™ i5
Intel® Core™ i3
Intel® Celeron™
Graphics
CORE
Memory
Controller
Hardware Monitoring
and Fan Control Circuitry
PCIe to PCI Bridge
Intel® certified Pericom
Memory Types
(1066 or 1333MHz)
DDR3-SODIMM
Socket (top)
16 GByte Max. Total
DDR3-SODIMM
Socket (bottom)
PI7C9X113SL
C-D
Engineering Tools / Accessories for COM Express
®
conga-CEVAL
conga-Cdebug
conga-CKIT
conga-LDVI/EPI
conga-HDMI/Display Port adapter
DVI-D ADD2 Card
Dual DVI-D ADD2 Card
conga-FPA2
065749
047854
064714
011115
500014
058500
013226
047250
Evaluation carrier board for COM-Express-modules
COM-Express debugging platform. Including cable for COM, PS/2 and VGA.
COM-Express-Starterkit, incl. conga-CEVAL, conga-CDEBUG, conga-FPA1 (PN: 024241), Dual DVI-D ADD2 card, Power supply, USB-Stick, ... Without COM Express-module
LVDS to DVI converter board for digital flat panels with onboard EEPROM
The conga-HDMI/DisplayPort adapter is used fo convert the chipset graphic ports Port-B, Port-C and Port-D to the HDMI or DisplayPort Interface
ADD2 display adapter card with single DVI-D digital output. Suitable for all Intel based platforms that support Serial Digital Display Outputs (SDVO) on the standard, x16 PCI Express Graphics (PEG) port.
ADD2 display adapter card with dual independent DVI-D output. Suitable for all Intel based platforms that support Serial Digital Display Outputs (SDVO) on the standard, x16 PCI Express Graphics (PEG) port.
Flatpanel prototype adapter to develop your own flatpanel adapter Including cables set.
© 2014 congatec AG. The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner‘s license agreements, which are avaialable at www.congatec.com and/or upon request.
Product names, logos, brands, and other trademarks featured or referred to within this datasheet, or the congatec website, are the property of their respective trademark holders. These trademark holders are not affiliated with congatec
AG, our products, or our website.
Rev. July 28, 2014 BLU
congatec AG, Auwiesenstraße 5, 94469 Deggendorf, Germany
Phone +49 (991) 2700-0, Fax +49 (991) 2700-111, info@congatec.com
1x IDE
Fan
Control
PCI Bus
1x SDVO
SATA to IDE
Chip
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