电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

TBJD107J004CBSC0700

产品描述Tantalum Capacitor, Polarized, Tantalum (dry/solid), 4V, 5% +Tol, 5% -Tol, 100uF, Surface Mount, 2917, CHIP
产品类别无源元件    电容器   
文件大小593KB,共4页
制造商AVX
标准  
下载文档 详细参数 全文预览

TBJD107J004CBSC0700概述

Tantalum Capacitor, Polarized, Tantalum (dry/solid), 4V, 5% +Tol, 5% -Tol, 100uF, Surface Mount, 2917, CHIP

TBJD107J004CBSC0700规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Objectid1694094848
包装说明, 2917
Reach Compliance Codecompliant
ECCN代码EAR99
YTEOL6.92
其他特性ESR AND RIPPLE CURRENT IS MEASURED AT 100KHZ
电容100 µF
电容器类型TANTALUM CAPACITOR
介电材料TANTALUM (DRY/SOLID)
ESR900 mΩ
高度2.8 mm
JESD-609代码e3
漏电流0.004 mA
长度7.3 mm
安装特点SURFACE MOUNT
负容差5%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形式SMT
包装方法BULK
极性POLARIZED
正容差5%
额定(直流)电压(URdc)4 V
纹波电流160 mA
尺寸代码2917
表面贴装YES
Delta切线0.08
端子面层Matte Tin (Sn)
端子形状J BEND
宽度4.3 mm

文档预览

下载PDF文档
TBJ SERIES
CWR11 - MIL-PRF-55365/8 Established Reliability,
COTS-Plus & Space Level
Fully qualified to MIL-PRF-55365/8, the CWR11 is the military version of EIA-535BAAC, with four case sizes designed for
maximum packaging efficiency on 8mm & 12mm tape for high volume production (ensuring no TCE mismatch with any
substrate). This construction is compatible with a wide range of SMT board assembly processes including convection
reflow solder, conductive epoxy or compression bonding techniques. The part also carries full polarity, capacitance /
voltage and JAN brand marking.
The series is qualified to MIL-PRF-55365 Weibull “B”, “C”, “D” and “T” levels, with all surge options (“A”, “B” & “C”) available.
For Space Level applications, SRC9000 qualification is recommended (see ratings table for part number availability).
There are four termination finishes available: solder plated, fused solder plated, hot solder dipped and gold plated
(these are “H”, “K”, “C” and “B” termination, respectively, per MIL-PRF-55365).
The molding compound has been selected to meet the requirements of UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the High Reliability Tantalum MSL section located in the back of the High
Reliability Tantalum Catalog.
GENERAL DESCRIPTION
L
W
H
CASE DIMENSIONS:
millimeters (inches)
W
1
A
S
A
Case
Code
A
B
C
D
EIA
Metric
3216-18
3528-21
Length (L)
Width (W)
Height (H)
Term. Width (W
1
)
±0.10 (±0.004)
1.20 (0.047)
2.20 (0.087)
2.20 (0.087)
2.40 (0.094)
Term. Length A
±0.30(±0.012)
0.80 (0.031)
0.80 (0.031)
1.30 (0.051)
1.30 (0.051)
S min
1.10 (0.043)
1.40 (0.055)
2.90 (0.114)
4.40 (0.173)
(Brown marking on gold body)
Polarity Stripe (+)
“J” for “JAN” Brand
Capacitance Code
Rated Voltage
Manufacturer’s ID
MARKING
3.20±0.20
1.60±0.20
1.60±0.20
(0.126±0.008) (0.063±0.008) (0.063±0.008)
3.50±0.20
2.80±0.20
1.90±0.20
(0.138±0.008) (0.110±0.008) (0.075±0.008)
6.00±0.30
3.20±0.30
2.50±0.30
6032-28
(0.236±0.012) (0.126±0.012) (0.098±0.012)
7.30±0.30
4.30±0.30
2.80±0.30
7343-31
(0.287±0.012) (0.169±0.012) (0.110±0.012)
CAPACITANCE AND RATED VOLTAGE, V
R
(MIL VOLTAGE CODE) RANGE CASE SIZE
Capacitance
µF
Code
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
6.8
10
15
22
33
47
68
100
104
154
224
334
474
684
105
155
225
335
475
685
106
156
226
336
476
686
107
4V (C)
6V (D)
10V (F)
Rated Voltage DC (V
R
) at 85ºC
15V (H)
20V (J)
25V (K)
35V (M)
A
A
A
A
B
B
B
C
C
C
D
D
50V (N)
A
B
B
B
C
C
C
D
D
D
D
A
A
B
B
B
C
D
D
A
A
A
B
B
B
C
C
D
D
A
A
A
B
B
B
C
D
D
A
A
A
B
B
B
C
D
D
A
A
A
B
B
B
C
C
D
D
A
A
B
B
B
C
C
C
D
D
D
40
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
083121
high reliability tantalum capacitors
USB相关
谁能给我讲下StellarisWare的usb_dev_serial这个程序,刚接触,什么都不懂,看的头大了都~拜托了~再讲下usb,cdc,uart和FIFO的知识吧~谢谢了哈...
119083515 微控制器 MCU
TI C5000编译器的错误信息列表
TI C5000编译器的错误信息列表 401352 401353 ...
灞波儿奔 DSP 与 ARM 处理器
分享C语言书籍
本帖最后由 wingard 于 2015-11-12 10:02 编辑 做单片机开发基本都是和C语言打交道,对于这种很偏向于底层的语言来说入门容易但要正真熟练精通掌握却相当的难,由于不可避免的因素,在大学里 ......
wingard 下载中心专版
智能手持PDA
我现在要一款pda 要求win ce 系统 ,支持wifi功能,请大家介绍几家国内的厂家...
eeq619 嵌入式系统
PCB分层堆叠在控制EMI辐射中的作用和设计技巧
〖文章转载或出处〗≡中国电子技术信息网≡ 网址:www.EC66.com PCB分层堆叠在控制EMI辐射中的作用和设计技巧作者:Rick Hartley高级PCB硬体工程师Applied Innovation Inc.解决EMI问题的办法 ......
jinye 无线连接
请问wince中怎么实现mid播放?
请问wince中怎么实现mid播放??那里有软解码器??...
lamborghini 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 424  533  1445  2255  657  9  11  30  46  14 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved