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nanoX-BT-J1900-1G

产品描述computer-On-modules - com mini com exp intel j1900 bay trail 1G
产品类别模块/解决方案   
文件大小341KB,共2页
制造商All Sensors
标准
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nanoX-BT-J1900-1G概述

computer-On-modules - com mini com exp intel j1900 bay trail 1G

nanoX-BT-J1900-1G规格参数

参数名称属性值
ManufactureADLINK Technology
产品种类
Product Category
Computer-On-Modules - COM
RoHSYes
Form FacCOM Express Mini Size Type 10
Processor BrandIntel
Processor TypeIntel Celeron J1900
频率
Frequency
2 GHz
Memory Size1 GB
Memory TypeDDR3L
接口类型
Interface Type
Audio, eMMC, Ethernet, GPIO, SATA, SDIO, Serial, USB
工作电源电压
Operating Supply Voltage
12 V
最大工作温度
Maximum Operating Temperature
+ 60 C
Dimensions84 mm x 55 mm
Backup BatteryYes
Cache Memory32 kB
Description/FunctiCOM Express mini size type 10 with Intel Celeron J1900 at 2 GHz and 2 GB non ECC DDR3L
最小工作温度
Minimum Operating Temperature
0 C
Power Consumpti10 W
Processor SeriesIntel Celeron J1900

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nanoX-BT
Type 10
COM Express
®
Mini Size Type 10 Module with
Intel
®
Atom™ or Celeron
®
Processor System-on-Chip
Features
Single, dual, quad-core Intel
®
Atom™ or
Celeron
®
Processor System-on-Chip
Up to 4GB soldered Dual Channel DDR3L at
1333MHz
One DDI channel, one LVDS (optional eDP)
Three PCIe x1, GbE
Two SATA 3Gb/s, four USB and one USB client
Supports Smart Embedded Management
Agent (SEMA) functions
Extreme Rugged™ operating temperature:
-40°C to +85°C (optional)
Specifications
Core System
CPU
Single, dual, quad-core Intel
®
Atom™ or quad-core Celeron
®
Atom™ E3845 1.91 GHz 542/792 Gfx (Turbo) 10W (4C/1333)
Atom™ E3827 1.75 GHz 542/792 Gfx (Turbo) 8W (2C/1333)
Atom™ E3826 1.46 GHz 533/667 Gfx (Turbo) 7W (2C/1066)
Atom™ E3825 1.33 GHz 533 Gfx (No Turbo) 6W (2C/1066)
Atom™ E3815 1.46 GHz 400 Gfx (No Turbo) 5W (1C/1066)
Celeron
®
N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W (4C/1333)
Celeron
®
J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333)
Supports: Single, dual or quad Out-of-Order Execution (OOE)
processor cores, Intel
®
VT-x, Intel
®
SSE4.1 and SSE4.2, Intel
®
64 architecture, IA 32-bit , PCLMULQDQ Instruction DRNG,
Intel
®
Thermal Monitor (TM1 & TM2)
Note: Availability of features may vary between processor SKUs.
Ethernet
Intel
®
MAC/PHY
Interface
Intel
®
i210LM (MAC/PHY) Ethernet controller
10/100/1000 GbE connection
I/O Interfaces
USB
SATA
Serial
eMMC
SDIO
GPIO
1x USB 3.0 (USB 0) 3x USB 2.0 (USB 1,2,3) and
1x USB 2.0 client (USB 7)
Two SATA 3 Gb/s ports
2 UART ports COM1/2 with console redirection
Optional soldered on module bootable eMMC flash storage
8 GB
Optional SDIO support mulitplexed over GPIO pins
4 GPO and 4 GPI with interrupt
Single channel non-ECC 1333/1066 MHz soldered DDR3L
memory up to 4GB (1GB/2GB or 4GB)
Embedded BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS
Cache
Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way
L1 write-back data cache
2MB for E3845, N2930 and J1900
1MB for E3827, E3826 and E3825
512K for E3815
Expansion Busses
3 PCI Express x1 Gen2 (AB): Ianes 0/1/2;
optional PCIe x4 (lose GbE)
LPC bus, SMBus (system), I
2
C (user)
SEMA Board Controller Supports: Voltage/Current monitoring, Power sequence
debug support, AT/ATX mode control, Logistics and Forensic
information, Flat Panel Control, General Purpose I
2
C,
Watchdog Timer
Debug Headers
40-pin multipurpose flat cable connector
Use in combination with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS
flashing, power test points, debug LEDs
60-pin XDP header for ICE debug of CPU/chipset on break
out board
Memory
Super I/O
On carrier if needed (standard support for
W83627DHG-P)
Power
Standard Input
Wide Input
Management
Power States
ECO mode
ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
ATX = 5~14V / 5Vsb
AT = 5~14V
ACPI 4.0 compliant, Smart Battery support
C0, C1, C1E, C4, C6 S0, S3, S4, S5 (Wake on USB S3/S4,
WOL S3/S4/S5
Supports deep S5 (ECO mode) for power saving
Mechanical and Environmental
Form Factor
PICMG COM.0: Rev 2.1 Type 10
Dimension
Mini size: 84 mm x 55 mm
Operating Temperature Standard: 0°C to +60°C
Extreme Rugged™: -40 to +85°C (optional)
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and
Method 214A, Table 214-I, Condition D
HALT
Thermal Stress, Vibration Stress, Thermal Shock and
Combined Test
Video
7th generation Intel
®
graphics core architecture with four
execution units supporting two independent displays
3D graphics hardware acceleration
Supports for DirectX11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2
Video decode hardware acceleration including support for
H.264, MPEG2, MVC, VC-1, WMV9 and VP8 formats
Video encode hardware acceleration including support for
H.264, MPEG2 and MVC formats
Digital Display Interface One DDI channel supporting DisplayPort/HDMI/DVI
LVDS/eDP
Single/dual channel 18/24-bit LVDS
eDP support (optional)
GPU Feature Support
Operating Systems
Standard Support
Windows 7/8 32/64-bit, Linux 32/64-bit
Extended Support (BSP) WES7/8, WEC7, Linux , VxWorks
Audio
Chipset
Audio Codec
Intel
®
HD Audio integrated in SOC
Located on carrier miniBASE-10R
http://www.adlinktech.com/Computer-on-Module

 
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