cExpress-BT
Type 6
COM Express
®
Compact Size Type 6 Module with
Intel
®
Atom™ or Celeron
®
Processor System-on-Chip (SOC)
Features
Single, dual, quad-core Intel
®
Atom™ or
Celeron
®
Processor System-on-Chip (SOC)
Up to 8GB Dual Channel DDR3L at 1333MHz
VGA and two DDI channels (optional LVDS)
Three PCIe x1, GbE
Two SATA 3Gb/s, one USB 3.0, seven USB 2.0
Supports Smart Embedded Management
Agent (SEMA) functions
Extreme Rugged™ operating temperature:
-40°C to +85°C (optional)
Specifications
Core System
CPU
Single, dual, quad-core Intel
®
Atom™ or Celeron
®
Processor
Atom™ E3845 1.91 GHz 542/792 (Turbo) 10W (4C/1333)
Atom™ E3827 1.75 GHz 542/792 (Turbo) 8W (2C/1333)
Atom™ E3826 1.46 GHz 533/667 (Turbo) 7W (2C/1066)
Atom™ E3825 1.33 GHz 533 (No Turbo) 6W (2C/1066)
Atom™ E3815 1.46 GHz 400 (No Turbo) 5W (1C/1066)
Celeron
®
N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W
(4C/1333)
Celeron
®
J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W
(4C/1333)
Supports: Single, dual or quad Out-of-Order Execution (OOE)
processor cores, Intel
®
VT-x, Intel
®
SSE4.1 and SSE4.2, Intel
®
64 architecture, IA 32-bit , PCLMULQDQ Instruction DRNG,
Intel
®
Thermal Monitor (TM1 & TM2)
Note: Availability of features may vary between processor SKUs.
Audio
Chipset
Audio Codec
Intel
®
HD Audio integrated in SOC
Located on carrier Express-BASE6
Ethernet
Intel
®
MAC/PHY
Interface
Intel
®
i210LM (MAC/PHY) Ethernet controller
10/100/1000 GbE connection
I/O Interfaces
USB
SATA
Serial
eMMC
SDIO
GPIO
1x USB 3.0 (USB 0) 3x USB 1.1/2.0 (USB 1,2,3) and
4x USB 2.0 only (USB 4,5,6,7)
Two SATA 3 Gb/s ports
2 UART ports COM1/2 with console redirection
Optional soldered on module bootable eMMC flash storage
8 to 64 GB
On module mini SD card socket
4 GPO and 4 GPI with interrupt
Dual channel non-ECC 1333/1066 MHz DDR3L memory up
to 8GB in dual stacked SODIMM sockets
Embedded BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS
Cache
Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way
L1 write-back data cache
2MB for E3845, N2930 and J1900
1MB for E3827, E3826 and E3825
512K for E3815
Expansion Busses
3 PCI Express x1 Gen2 (AB): Ianes 0/1/2; build option PCIe
x4 (lose GbE)
LPC bus, SMBus (system), I
2
C (user)
SEMA Board Controller Supports: Voltage/Current monitoring, Power sequence
debug support, AT/ATX mode control, Logistics and Forensic
information, Flat Panel Control, General Purpose I
2
C, Failsafe
BIOS (dual BIOS), Watchdog Timer and Fan Control
Debug Headers
40-pin multipurpose flat cable connector
Use in combination with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS
flashing, Power test points, Debug LEDs
26-pin XDP header for ICE debug of CPU/chipset
Memory
Super I/O
On carrier if needed (standard support for
W83627DHG-P)
TPM
Chipset
Type
*TPM is optional
Ateml AT97SC3204
TPM 1.2
Power
Standard Input
Wide Input
Management
Power States
ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
ATX = 5~20 V / 5Vsb ±5% or AT = 5 ~20V
ACPI 4.0 compliant, Smart Battery support
C0, C1, C1E, C4, C6
S0, S3, S4, S5 (Wake on USB S3 for port 0~7/S4 for port
0~3, WOL S3/S4/S5
Supports deep S5 (ECO mode) for power saving
ECO mode
Video
7th generation Intel
®
graphics core architecture with four
execution units supporting two independent displays
3D graphics hardware acceleration
Supports DirectX 11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2
Video decode hardware acceleration including support for
H.264, MPEG2, MVC, VC-1, WMV9 and VP8 formats
Video encode hardware acceleration including support for
H.264, MPEG2 and MVC formats
Digital Display Interface DDI1 supporting DisplayPort/ HDMI/ DVI (optional dual
channel 18/24-bit LVDS support)
DDI2 supporting DisplayPort / HDMI / DVI
VGA
Analog VGA supporting resolutions of up to
2560 x 1600 x 24bpp @60
GPU Feature Support
Mechanical and Environmental
Specification
PICMG COM.0: Rev 2.1 Type 6
Form Factor
Compact size: 95 mm x 95 mm
Operating Temperature Standard: 0°C to +60°C
Extreme Rugged™: -40°C to +85°C (optional)
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and
Method 214A, Table 214-I, Condition D
HALT
Thermal Stress, Vibration Stress, Thermal Shock and
Combined Test
Operating Systems
Standard Support
Windows 7/8 32/64-bit, Linux 32/64-bit
Extended Support (BSP) WES7/8, WEC7/8, Linux , VxWorks
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