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nanoX-BT-E3827-1G

产品描述computer-On-modules - com mini com exp intel e3827 bay trail 1G
产品类别模块/解决方案   
文件大小341KB,共2页
制造商All Sensors
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nanoX-BT-E3827-1G概述

computer-On-modules - com mini com exp intel e3827 bay trail 1G

nanoX-BT-E3827-1G规格参数

参数名称属性值
ManufactureADLINK Technology
产品种类
Product Category
Computer-On-Modules - COM
RoHSYes
Form FacCOM Express Mini Size Type 10
Processor BrandIntel
Processor TypeIntel Atom E3827
频率
Frequency
1.75 GHz
Memory Size1 GB
Memory TypeDDR3L
接口类型
Interface Type
Audio, eMMC, Ethernet, GPIO, SATA, SDIO, Serial, USB
工作电源电压
Operating Supply Voltage
12 V
最大工作温度
Maximum Operating Temperature
+ 60 C
Dimensions84 mm x 55 mm
Backup BatteryYes
Cache Memory32 kB
Description/FunctiCOM Express mini size type 10 with Intel Atom E3827 at 1.75 GHz and 2 GB non ECC DDR3L
最小工作温度
Minimum Operating Temperature
0 C
Power Consumpti8 W
Processor SeriesIntel Atom E3827

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nanoX-BT
Type 10
COM Express
®
Mini Size Type 10 Module with
Intel
®
Atom™ or Celeron
®
Processor System-on-Chip
Features
Single, dual, quad-core Intel
®
Atom™ or
Celeron
®
Processor System-on-Chip
Up to 4GB soldered Dual Channel DDR3L at
1333MHz
One DDI channel, one LVDS (optional eDP)
Three PCIe x1, GbE
Two SATA 3Gb/s, four USB and one USB client
Supports Smart Embedded Management
Agent (SEMA) functions
Extreme Rugged™ operating temperature:
-40°C to +85°C (optional)
Specifications
Core System
CPU
Single, dual, quad-core Intel
®
Atom™ or quad-core Celeron
®
Atom™ E3845 1.91 GHz 542/792 Gfx (Turbo) 10W (4C/1333)
Atom™ E3827 1.75 GHz 542/792 Gfx (Turbo) 8W (2C/1333)
Atom™ E3826 1.46 GHz 533/667 Gfx (Turbo) 7W (2C/1066)
Atom™ E3825 1.33 GHz 533 Gfx (No Turbo) 6W (2C/1066)
Atom™ E3815 1.46 GHz 400 Gfx (No Turbo) 5W (1C/1066)
Celeron
®
N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W (4C/1333)
Celeron
®
J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333)
Supports: Single, dual or quad Out-of-Order Execution (OOE)
processor cores, Intel
®
VT-x, Intel
®
SSE4.1 and SSE4.2, Intel
®
64 architecture, IA 32-bit , PCLMULQDQ Instruction DRNG,
Intel
®
Thermal Monitor (TM1 & TM2)
Note: Availability of features may vary between processor SKUs.
Ethernet
Intel
®
MAC/PHY
Interface
Intel
®
i210LM (MAC/PHY) Ethernet controller
10/100/1000 GbE connection
I/O Interfaces
USB
SATA
Serial
eMMC
SDIO
GPIO
1x USB 3.0 (USB 0) 3x USB 2.0 (USB 1,2,3) and
1x USB 2.0 client (USB 7)
Two SATA 3 Gb/s ports
2 UART ports COM1/2 with console redirection
Optional soldered on module bootable eMMC flash storage
8 GB
Optional SDIO support mulitplexed over GPIO pins
4 GPO and 4 GPI with interrupt
Single channel non-ECC 1333/1066 MHz soldered DDR3L
memory up to 4GB (1GB/2GB or 4GB)
Embedded BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS
Cache
Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way
L1 write-back data cache
2MB for E3845, N2930 and J1900
1MB for E3827, E3826 and E3825
512K for E3815
Expansion Busses
3 PCI Express x1 Gen2 (AB): Ianes 0/1/2;
optional PCIe x4 (lose GbE)
LPC bus, SMBus (system), I
2
C (user)
SEMA Board Controller Supports: Voltage/Current monitoring, Power sequence
debug support, AT/ATX mode control, Logistics and Forensic
information, Flat Panel Control, General Purpose I
2
C,
Watchdog Timer
Debug Headers
40-pin multipurpose flat cable connector
Use in combination with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS
flashing, power test points, debug LEDs
60-pin XDP header for ICE debug of CPU/chipset on break
out board
Memory
Super I/O
On carrier if needed (standard support for
W83627DHG-P)
Power
Standard Input
Wide Input
Management
Power States
ECO mode
ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
ATX = 5~14V / 5Vsb
AT = 5~14V
ACPI 4.0 compliant, Smart Battery support
C0, C1, C1E, C4, C6 S0, S3, S4, S5 (Wake on USB S3/S4,
WOL S3/S4/S5
Supports deep S5 (ECO mode) for power saving
Mechanical and Environmental
Form Factor
PICMG COM.0: Rev 2.1 Type 10
Dimension
Mini size: 84 mm x 55 mm
Operating Temperature Standard: 0°C to +60°C
Extreme Rugged™: -40 to +85°C (optional)
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and
Method 214A, Table 214-I, Condition D
HALT
Thermal Stress, Vibration Stress, Thermal Shock and
Combined Test
Video
7th generation Intel
®
graphics core architecture with four
execution units supporting two independent displays
3D graphics hardware acceleration
Supports for DirectX11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2
Video decode hardware acceleration including support for
H.264, MPEG2, MVC, VC-1, WMV9 and VP8 formats
Video encode hardware acceleration including support for
H.264, MPEG2 and MVC formats
Digital Display Interface One DDI channel supporting DisplayPort/HDMI/DVI
LVDS/eDP
Single/dual channel 18/24-bit LVDS
eDP support (optional)
GPU Feature Support
Operating Systems
Standard Support
Windows 7/8 32/64-bit, Linux 32/64-bit
Extended Support (BSP) WES7/8, WEC7, Linux , VxWorks
Audio
Chipset
Audio Codec
Intel
®
HD Audio integrated in SOC
Located on carrier miniBASE-10R
http://www.adlinktech.com/Computer-on-Module

 
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