CRCW...C e3
www.vishay.com
Vishay
Lead (Pb)-free Thick Film, Rectangular
Commodity Chip Resistors
FEATURES
• High volume product suitable for commercial
applications
• Excellent stability (R/R
1 % for 1000 h at
70 °C)
• Lead (Pb)-free solder contacts on Ni barrier layer
• Metal glaze on ceramic
• Protective overglaze
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
CASE
SIZE
INCH
CASE
SIZE
METRIC
POWER RATING
P
70 °C
W
LIMITING
ELEMENT
VOLTAGE
MAX. V
50
TEMPERATURE
COEFFICIENT
ppm/K
± 100
CRCW0402...C
0402
RR 1005M
0.063
± 200
± 200
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
at 70 °C = 1.5 A
± 100
CRCW0603...C
0603
RR 1608M
0.10
75
± 200
± 200
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
at 70 °C = 2.0 A
± 100
CRCW0805...C
0805
RR 2012M
0.125
150
± 200
± 200
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
at 70 °C = 2.5 A
± 100
CRCW1206...C
1206
RR 3216M
0.25
200
± 200
± 200
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
at 70 °C = 3.5 A
Notes
• These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
±1
±5
1R0 to 10M
1R0 to 9R76
1R0 to 10M
E24; E96
E24
±1
±5
1R0 to 10M
1R0 to 9R76
1R0 to 10M
E24; E96
E24
±1
±5
1R0 to 10M
1R0 to 9R76
1R0 to 10M
E24; E96
E24
TOLERANCE
%
RESISTANCE
RANGE
1R0 to 10M
1R0 to 9R76
1R0 to 10M
E-SERIES
±1
±5
E24; E96
E24
TECHNICAL SPECIFICATIONS
PARAMETER
Rated dissipation at 70°C
(1)
Limiting element voltage
U
max.
AC/DC
Insulation voltage
U
ins.
(1 min)
Insulation resistance
Category temperature range
Failure rate
Weight/1000 pieces
UNIT
W
V
V
°C
h
-1
g
0.65
2
CRCW0402...C
0.063
50
> 75
CRCW0603...C
0.10
75
> 100
> 10
9
- 55 to + 155
0.3 x 10
-9
5.5
10
CRCW0805...C
0.125
150
> 200
CRCW1206...C
0.25
200
> 300
Note
(1)
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
Revision: 05-Jun-13
Document Number: 28773
1
For technical questions, contact:
ff3aresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CRCW...C e3
www.vishay.com
Vishay
PART NUMBER AND PRODUCT DESCRIPTION
PART NUMBER: CRCW0603562RFKECC
C
R
C
W
0
6
0
3
5
6
2
TCR
R
F
K
E
C
C
SPECIAL
Up to 2 digits
C
= Commodity
MODEL/SIZE
CRCW0402
CRCW0603
CRCW0805
CRCW1206
D11/CRCW0603-C
MODEL
D10/CRCW0402-C
D11/CRCW0603-C
D12/CRCW0805-C
D25/CRCW1206-C
VALUE
R
= Decimal
K
= Thousand
M
= Million
0000
= Jumper
100
TCR
± 200
ppm/K
± 100
ppm/K
TOLERANCE
F
= ± 1.0 %
J
= ± 5.0 %
Z
= Jumper
PACKAGING
EA, EB
EC, ED
EE, EI
K
= ± 100 ppm/K
N
= ± 200 ppm/K
0
= Jumper
PRODUCT DESCRIPTION: D11/CRCW0603-C 100 562R 1 % ET6 E3
562R
RESISTANCE
VALUE
10R
= 10
562R
= 562
10K
= 10.0 k
1M
= 1 M
0R0
= Jumper
1%
TOLERANCE
±
5%
±
1%
ET6
PACKAGING
ET1, ET2
ET5, ET6
ET7, EF4
e3
LEAD (Pb)-FREE
e3
= Pure tin
termination
finish
PACKAGING
REEL
MODEL
TAPE
WIDTH
8 mm
DIAMETER
180 mm/7"
254 mm/10"
330 mm/13"
180 mm/7"
254 mm/10"
330 mm/13"
180 mm/7"
254 mm/10"
330 mm/13"
180 mm/7"
254 mm/10"
330 mm/13"
PITCH
PIECES/
REEL
10 000
20 000
50 000
5000
10 000
20 000
5000
10 000
20 000
5000
10 000
20 000
PACKAGING CODE
PART NUMBER PRODUCT DESC.
PAPER
PAPER
ED
ET7
EI
ET2
EE
EF4
EA
ET1
EB
ET5
EC
ET6
EA
ET1
EB
ET5
EC
ET6
EA
ET1
EB
ET5
EC
ET6
CRCW0402…C
2 mm
CRCW0603…C
8 mm
4 mm
CRCW0805…C
8 mm
4 mm
CRCW1206…C
8 mm
4 mm
DIMENSIONS
SIZE
INCH METRIC
0402
1005
0603
1608
0805
2012
1206
3216
L
1.0 ± 0.10
1.60 ± 0.10
2.0 ± 0.10
3.05 ± 0.10
DIMENSIONS
(in millimeters)
W
0.5 ± 0.05
0.80 ± 0.10
1.25 ± 0.15
1.55 ± 0.10
H
T1
0.30 ± 0.05 0.25 ± 0.10
0.45 ± 0.10 0.3 ± 0.2
0.50 ± 0.10 0.35 ± 0.15
0.55
+ 0.10
- 0.05
T2
0.2 ± 0.1
0.3 ± 0.2
0.35 ± 0.2
0.45 ± 0.2
SOLDER PAD DIMENSIONS
(1)
(in millimeters)
REFLOW SOLDERING
WAVE SOLDERING
a
b
l
a
b
l
0.4
0.6
0.5
0.5
0.9
1.0
0.9
0.9
1.0
0.7
1.3
1.2
0.9
1.3
1.3
0.9
1.7
2.0
1.1
1.7
2.3
0.35 ± 0.15
Note
(1)
The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials maybe required to maintain
the reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on boardmaterials.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or
in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many
other parameters. Still the given solder pad dimensions will be found adequate for most general applications.
Revision: 05-Jun-13
Document Number: 28773
2
For technical questions, contact:
ff3aresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CRCW...C e3
www.vishay.com
FUNCTIONAL PERFORMANCE
Rated Power in %
120
100
Vishay
80
60
40
20
0
- 55
- 25
0
25
50
Derating
75
100
125
155 175
70 Ambient Temperature in
°C
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST
METHOD
REQUIREMENTS PERMISSIBLE
CHANGE (R)
TEST
PROCEDURE
STABILITY
CLASS 1
OR BETTER
1
to 10 M
±1%
± 100 ppm/K,
± 200 ppm/K
± (0.25 %
R
+ 0.05
)
STABILITY
CLASS 2
OR BETTER
1
to 10 M
±5%
± 200 ppm/K
± (0.5 %
R
+ 0.05
)
Stability for product types:
CRCW...C e3
4.5
4.8.4.2
4.13
-
-
-
Resistance
Temperature
coefficient
Short time
overload
-
(20/- 55/20) °C and
(20/125/20) °C
U
= 2.5 x
P
70
x
R
2 x
U
max.;
duration: Acc. to the style
Solder bath method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Solder bath method;
Sn96.5Ag3Cu0.5
non activated flux;
(245 ± 5) °C
(3 ± 0.3) s
Good tinning ( 95 % covered)
no visible damage
4.17.5
58 (Td)
Solderability
Pre-aging
4 h at 155 °C,
dryheat
Good tinning ( 95 % covered)
no visible damage
4.18.2
4.19
58 (Td)
14 (Na)
Resistance to
soldering heat
Rapid change
of temperature
Damp heat,
steady state
Climatic sequence:
Dry heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
DC load
Solder bath method
(260 ± 5) °C; (10 ± 1) s
30 min. at - 55 °C;
30 min. at 125 °C;
5 cycles
(40 ± 2) °C;
56 days;
(93 ± 3) % RH
-
125 °C; 16 h
55 °C;
90 % RH; 24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C;
90 % RH; 24 h; 5 cycles
U
=
P
70
x
R
U
max.
± (0.25 %
R
+ 0.05
)
± (0.5 %
R
+ 0.05
)
± (0.25 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
± (0.5 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
4.24
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
78 (Cab)
-
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
-
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
Revision: 05-Jun-13
Document Number: 28773
3
For technical questions, contact:
ff3aresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CRCW...C e3
www.vishay.com
Vishay
REQUIREMENTS PERMISSIBLE
CHANGE (R)
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST
METHOD
TEST
PROCEDURE
STABILITY
CLASS 1
OR BETTER
1
to 10 M
STABILITY
CLASS 2
OR BETTER
1
to 10 M
Stability for product types:
CRCW...C e3
U
=
P
70
x
R
U
max.;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
4.25.3
-
Endurance
at 125 °C
125 °C, 1000 h
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
± (4 %
R
+ 0.1
)
± (2 %
R
+ 0.1
)
4.25.1
-
Endurance
at 70 °C
APPLICABLE SPECIFICATIONS
• EN 60115-1
• EN 140400
• EN 140401-802
• IEC 60068-2-X
• IEC 60286-3
Generic specification
Sectional specification
Detail specification
Variety of environmental test procedures
Packaging of SMD components
Revision: 05-Jun-13
Document Number: 28773
4
For technical questions, contact:
ff3aresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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