Minitek™ Unshrouded Stacking Headers
2,00 mm
s
CUSTOMISABLE:
Wide variety of stack heights in
0.13 mm increments
s
Custom sizes to meet your specific
design requirements
s
High temperature plastic
Technical Data
Physical
Housing: High-temperature,
black thermoplastic
Flammability rating: UL 94 V-0
Pin: Phosphor-bronze
Plating: Gold over 1.27 µm nickel
Mating Data
Operating Temperature
-55°C to +125°C
s
Minitek™ ctw contacts and housings
s
Minitek™Vertical receptacles
s
Minitek™Shunts
Page
48
50
52
Packaging
Standard: TMT in bags
SMT in Tape-and-reel
Optional: Tubes (see drawing)
Processing Information
Compatible with wave, vapor-phase, and
IR reflow soldering processes
Electrical Performance
Current rating: 2 A continuous
Insulation resistance: 1000 MΩ min.
Contact resistance: 25 mΩ max.
Dielectric withstanding voltage: 650 V
Voltage rating: 200 V
Reference Information
File no. E66906
File no. LR46923
Product drawing: 59112, 59132, or 59202
Product specification: DPS-12-011
Specifications subject to change without notice.
Mechanical Performance
Mating cycles (durability): 100
Typical Applications
Receptacle
Mating side
Mating side
Board
Space
Stack
OAL Height
Mating side
OAL
Stack
Height
OAL
OAL
Stack
Height
Solder side
Solder side
Solder side
Technical / Application Support / Drawings / Specifications / Samples:
www.fciconnect.com/basics
42
Minitek™ Unshrouded Stacking Headers
2,00 mm
Part Number
5
9
Lead
Solder
Side
Option
2
Plating
Pin Style
Positions
Per Row
Stack Height
1
= Through Mount (TMT)
2
= Surface Mount (SMT)
G
= 0,76 µm Gold on mating area,
2-6 µm Tin-Lead on solder side
F
= Gold flash
02
to
25
(TMT)
02
to
25
(SMT)
XX.X
= mm
Specify mm
[i.e., 037 = 03.7 mm]
in 0.1 mm increments
1
= 2.50
3
= 3.00
0
= SMT
Pin
Style
22
24
26
28
30
32
34
36
38
40
OAL (TMT)
mm
8.20
9.55
10.19
11.79
13.54
14.10
15.60
17.09
19.08
21.08
Height (SMT)
mm
6.53
7.87
8.51
10.11
11.86
12.42
13.92
15.42
17.40
19.41
PACKING:
= Bags (TMT)
A
= Tape-and-reel (SMT)
Step-by-Step Design
1. Determine desired board spacing
2. Select receptacle and calculate stack height
Stack Height = Board Spacing – Receptacle Height
3. Find the insertion depth from the chart below.
Calculate max./ min. OAL
OAL = Stack Height + Tail + Insertion Depth
4. Select the Pin Style with OAL between max.
and min. values
Height (mm)
Insertion
Depth (max.)
Insertion
Depth (min.)
RECEPTACLES
TMT
SMT
4.50
2.30
4.30
3.03
2.20
1.43
Example:
Recommended PCB Layout
1. Application requires a board spacing of 14.1
2. Select the appropriate receptacle, in this case
3.0 height (SMT)
The Header Stack Height is 14.1 – 3.0 = 11.1
3. For 1,6 mm board application (TMT),
the 2.5 Solder side is selected
OAL (max.) = 14.1 + 2.5 + 3.4 = 20.0
OAL (min.) = 14.1 + 2.5 + 1.28 = 17.88
4. Select Pin Style 38 with OAL = 19.07
5. Part Number is 59112-G38-10-141
Dimensions in mm
Technical / Application Support / Drawings / Specifications / Samples:
www.fciconnect.com/basics
43
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