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M3253503E1B120JVMB

产品描述Ceramic Capacitor, Multilayer, Ceramic, 100V, 5% +Tol, 5% -Tol, C0G, -/+30ppm/Cel TC, 0.000012uF, 0603,
产品类别无源元件    电容器   
文件大小1MB,共21页
制造商KEMET(基美)
官网地址http://www.kemet.com
标准
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M3253503E1B120JVMB概述

Ceramic Capacitor, Multilayer, Ceramic, 100V, 5% +Tol, 5% -Tol, C0G, -/+30ppm/Cel TC, 0.000012uF, 0603,

M3253503E1B120JVMB规格参数

参数名称属性值
是否Rohs认证符合
Objectid7173366379
包装说明, 0603
Reach Compliance Codecompliant
ECCN代码EAR99
YTEOL7
电容0.000012 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度0.99 mm
JESD-609代码e4
长度1.6 mm
安装特点SURFACE MOUNT
多层Yes
负容差5%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形式SMT
包装方法WAFFLE TRAY
正容差5%
额定(直流)电压(URdc)100 V
参考标准MIL-PRF-32535
尺寸代码0603
表面贴装YES
温度特性代码C0G
温度系数-/+30ppm/Cel ppm/°C
端子面层Gold (Au) - with Nickel (Ni) barrier
端子形状WRAPAROUND
宽度0.81 mm

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Reliability Surface Mount Capacitors,
MIL-PRF-32535, 4 – 200 VDC (C0G and BP Dielectrics)
Overview
The KEMET MIL-PRF-32535 C0G and BP surface mount
capacitors are designed, tested and screened to meet
demanding high reliability defense and aerospace
applications. MIL-PRF-32535 is Defense Logistics Agency's
(DLA) first capacitor specification for defense and
aerospace that capitalizes on industry leading base metal
electrode (BME) technology. Qualified under performance
specification MIL-PRF-32535 and QPL listed, this series
meets or exceeds the requirements outlined by DLA and
is currently available in M (standard reliability) and T (high
reliability) product levels. Driven by the demand for higher
capacitance and smaller case size MLCCs in high reliability
applications, KEMET’s MIL-PRF-32535 C0G and BP
provides over an 18-fold increase in capacitance over MIL-
PRF-55681 and MIL-PRF-123, allowing for reduced board
space and continuing the trend for miniaturization.
In addition to being the first BME C0G and BP dielectric
qualified for use in defense and aerospace applications,
MIL-PRF-32535 is the first DLA specification to recognize
a flexible termination option. KEMET's flexible termination
utilizes a pliable and conductive silver epoxy between the
base metal and nickel barrier layers of the termination
system. The addition of this epoxy layer inhibits the transfer
of board stress to the rigid ceramic body, therefore mitigating
flex cracks, which can result in a low IR or short circuit
failures..
Benefits
• Patented BME technology
• Qualified per MIL-PRF-32535 (QPL)
• Standard reliability (M Level)
• High reliability (T Level)
• Flexible termination option available
• EIA 0402, 0603, 0805, 1206, 1210, 1812, 2220 case sizes
• DC voltage ratings of 4 V, 6.3 V, 10 V, 16 V, 25 V, 50 V,
100 V and 200 V
• Capacitance offerings ranging from 1.0 pF up to 180 nF
• Available capacitance tolerances of ±0.10 pF, ±0.25 pF,
±0.5 pF, ±1%, ±2%, ±5%, and 10%
• No piezoelectric noise
• Extremely low ESR and ESL
• High ripple current capability
• Preferred capacitance solution at line frequencies and
into the MHz range
• No capacitance change with respect to applied rated DC
voltage
• Negligible capacitance change with respect to
temperature from −55°C to +125°C
• No capacitance decay with time
• Non-polar device, minimizing installation concerns
Built Into Tomorrow
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1095_MIL-PRF-32535 • 6/4/2021
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