DSC1103
DSC1123
Low-Jitter Precision LVDS Oscillator
General Description
The DSC1103 & DSC1123 series of high
performance oscillators utilizes a proven
silicon MEMS technology to provide excellent
jitter and stability over a wide range of
supply voltages and temperatures.
By
eliminating the need for quartz or SAW
technology, MEMS oscillators significantly
enhance reliability and accelerate product
development, while meeting stringent clock
performance criteria for a variety of
communications, storage, and networking
applications.
DSC1103 has a standby feature allowing it to
completely power-down when EN pin is
pulled low; whereas for DSC1123, only the
outputs are disabled when EN is low. Both
oscillators are available in industry standard
packages, including the small 3.2x2.5 mm
2
,
and are “drop-in” replacements for standard
6-pin LVDS quartz crystal oscillators.
Features
Low RMS Phase Jitter: <1 ps (typ)
High Stability: ±10, ±25, ±50 ppm
Wide Temperature Range
o
Industrial: -40° to 85° C
o
Ext. commercial: -20° to 70° C
High Supply Noise Rejection: -50 dBc
Short Lead Time: 2 Weeks
Wide Freq. Range: 2.3 to 460 MHz
Small Industry Standard Footprints
o
2.5x2.0, 3.2x2.5, 5.0x3.2, & 7.0x5.0 mm
Excellent Shock & Vibration Immunity
o
Qualified to MIL-STD-883
High Reliability
o
20x better MTF than quartz oscillators
Low Current Consumption
Supply Range of 2.25 to 3.6 V
Standby & Output Enable Function
Lead Free & RoHS Compliant
LVPECL & HCSL Versions Available
Block Diagram
Applications
Storage Area Networks
o
SATA, SAS, Fibre Channel
Passive Optical Networks
o
EPON, 10G-EPON, GPON, 10G-PON
Ethernet
o
1G, 10GBASE-T/KR/LR/SR, and FCoE
HD/SD/SDI Video & Surveillance
PCI Express: Gen 1 & Gen 2
DisplayPort
Output Enable Modes
EN Pin
High
NC
Low
DSC1103
Outputs Active
Outputs Active
Standby
DSC1123
Outputs Active
Outputs Active
Outputs Disabled
_____________________________________________________________________________________________________________________________ _________________
DSC1103 | DSC1123
Page 1
MK-Q-B-P-D-110410-03-6
DSC1103
DSC1123
Low-Jitter Precision LVDS Oscillator
Absolute Maximum Ratings
Item
Supply Voltage
Input Voltage
Junction Temp
Storage Temp
Soldering Temp
ESD
HBM
MM
CDM
Ordering Code
Unit
V
V
°C
°C
°C
V
40sec max.
Min
-0.3
-0.3
-
-55
-
-
Max
+4.0
V
DD
+0.3
+150
+150
+260
4000
400
1500
Condition
Enable Modes
0: Enable/Standby
2: Enable/Disable
Temp Range
E: -20 to 70
I: -40 to 85
L: -40 to 105
Packing
T: Tape & Reel
: Tube
DSC11
0
3
C I 5
Package
A: 7.0x5.0mm
B: 5.0x3.2mm
C: 3.2x2.5mm
D: 2.5x2.0mm
N: 7.0x5.0mm
(no center pad)
-
125.0000
T
Freq (MHz)
125.0000
Stability
1: ±50ppm
2: ±25ppm
5: ±10ppm
Note: 1000+ years of data retention on internal memory
Specifications
Parameter
Supply Voltage
1
Condition
V
DD
I
DD
EN pin low – outputs are disabled
DSC1103
DSC1123
Includes frequency variations due
to initial tolerance, temp. and
power supply voltage
1 year @25°C
T=25°C
Min.
2.25
Typ.
Max.
3.6
0.095
22
±10
±25
±50
±5
5
Unit
V
mA
Supply Current
20
Frequency Stability
Aging
Startup Time
2
Input Logic Levels
Input logic high
Input logic low
Output Disable Time
3
Output Enable Time
Enable Pull-Up Resistor
4
Supply Current
Output offset Voltage
Delta Offset Voltage
Pk to Pk Output Swing
Output Transition time
3
Rise Time
Fall Time
Frequency
Output Duty Cycle
Period Jitter
Integrated Phase Noise
Notes:
1.
2.
3.
4.
Δf
Δf
t
SU
V
IH
V
IL
t
DA
t
EN
ppm
ppm
ms
V
ns
ms
ns
kΩ
0.75xV
DD
-
DSC1103
DSC1123
Pull-up resistor exist
40
29
1.125
350
200
2.3
48
2.5
200kHz to 20MHz @156.25MHz
100kHz to 20MHz @156.25MHz
12kHz to 20MHz @156.25MHz
0.28
0.4
1.7
-
0.25xV
DD
5
5
20
LVDS Outputs
I
DD
V
OS
∆V
OS
Output Enabled, R
L
=100Ω
R=100Ω Differential
Single-Ended
20% to 80%
R
L
=50Ω, C
L
= 2pF
Single Frequency
Differential
32
1.4
50
mA
V
mV
mV
ps
V
PP
t
R
t
F
f
0
SYM
J
PER
J
PH
460
52
MHz
%
ps
RMS
ps
RMS
2
Pin 6 V
DD
should be filtered with 0.1uf capacitor.
t
su
is time to 100ppm of output frequency after V
DD
is applied and outputs are enabled.
Output Waveform and Test Circuit figures below define the parameters.
Output is enabled if pad is floated or not connected.
_____________________________________________________________________________________________________________________________ _________________
DSC1103 | DSC1123
Page 2
MK-Q-B-P-D-110410-03-6
DSC1103
DSC1123
Low-Jitter Precision LVDS Oscillator
Nominal Performance Parameters
(Unless specified otherwise: T=25° C, V
DD
=3.3 V)
0
-10
2.5
50-mV
Phase Jitter (ps RMS)
156MHz-LVDS
2.0
Rejection (dBc)
-20
-30
-40
-50
-60
-70
-80
0.1
1
10
100
100-mV
212MHz-LVDS
320MHz-LVDS
1.5
410MHz-LVDS
1.0
0.5
0.0
1000
10000
0
200
400
600
800
1000
Supply Noise Frequency (kHz)
Low-end of integration BW: x kHz to 20 MHz
Power supply rejection ratio
Phase jitter (integrated phase noise)
Output Waveform
t
R
t
F
Output
Output
80
%
50%
20%
350 mV
830 mv
1/
f
o
t
EN
t
DA
V
IH
Enable
V
IL
Typical Termination Scheme
V
DD
0.1uF
6
2
3
5
4
100 Ω
100 Ω
_____________________________________________________________________________________________________________________________ _________________
DSC1103 | DSC1123
Page 3
MK-Q-B-P-D-110410-03-6
DSC1103
Test Circuit
DSC1123
Low-Jitter Precision LVDS Oscillator
Solder Reflow Profile
ax
260
°
C
Temperature (°C)
cM
.
20-40
Sec
217
°
C
200
°
C
ax
.
60-150
Sec
150
°
C
3C
/Se
60-180
Sec
cM
Reflow
Pre heat
8 min max
Cool
Time
25
°
C
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp) 3°C/Sec Max.
Preheat Time 150°C to 200°C
60-180 Sec
Time maintained above 217°C
60-150 Sec
255-260°C
Peak Temperature
Time within 5°C of actual Peak
20-40 Sec
6°C/Sec Max.
Ramp-Down Rate
Time 25°C to Peak Temperature
8 min Max.
3C
/
Se
_____________________________________________________________________________________________________________________________ _________________
DSC1103 | DSC1123
Page 4
MK-Q-B-P-D-110410-03-6
S
S
S
6C
6C
6C/
M
cM
cM
ec
a.
a.
a x.
DSC1103
DSC1123
Low-Jitter Precision LVDS Oscillator
Package Dimensions
7.0 x 5.0 mm Plastic Package
EXTERNAL DIMENSIONS
Units: mm [ inches]
7±0.10 [0.276±0.004]
6
5
4
4
2.54 [0.100]
5
6
RECOMMENDED SOLDER PAD LAYOUT
Units: mm [ inches]
Via to Ground
Plane
1.4±0.10 [0.055±0.004]
Via to Power
Trace
2.54[0.100]
1.1±0.01[0.43±0.004]
3.7 [0.146] REF
6
5
4
1.8 [0.071]
2.6 [0.102]
1
2
3
1
2
3
5±0.10 [0.197±0.004]
3
2
2.8 [0.110]
1
0.85±0.05
No.
1
2
3
4
5
6
PAD
Pin Terminal
Enable
N/C
Ground
OUT
OUT-
VDD
TIE TO GND
1.4 [0.055]
1.4 [0.055]
5.0 x 3.2 mm Plastic Package
EXTERNAL DIMENSIONS
Units: mm [ inches]
5±0.05 [0.197±0.002]
6
5
4
4
1.27 [0.050]
5
6
0.64±0.05
Via to Ground
Plane
RECOMMENDED SOLDER PAD LAYOUT
Units: mm [ inches]
Via to Power
Trace
1.27[0.05]
1.2 [0.047] REF
6
1.2 [0.047] REF
1
3
2
1
0.7±0.1 [0.079±0.002]
5
2
4
3
1
2
3
3.2±0.05 [0.126±0.002]
0.85±0.05
No.
1
2
3
4
5
6
Pin Terminal
Enable
N/C
Ground
OUT
OUT-
VDD
1.1 [ 0.043]
0.64 [0.025]
_____________________________________________________________________________________________________________________________ _________________
DSC1103 | DSC1123
Page 5
MK-Q-B-P-D-110410-03-6
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