CMOS 8-bit A/D converters
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | SOP, SOP20,.4 |
| Reach Compliance Code | unknow |
| 最大模拟输入电压 | 5 V |
| 转换器类型 | A/D CONVERTER |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.2% |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | BINARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP20,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| ADC0803-1LCD | ADC0803-1CD | ADC0803-1CN | ADC0803-1LCN | ADC0804C | ADC0803 | |
|---|---|---|---|---|---|---|
| 描述 | CMOS 8-bit A/D converters | CMOS 8-bit A/D converters | CMOS 8-bit A/D converters | CMOS 8-bit A/D converters | 16 A SPDT MINIATURE POWER RELAY | CMOS 8-bit A/D converters |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | - |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | - |
| 包装说明 | SOP, SOP20,.4 | SOP, SOP20,.4 | DIP, DIP20,.3 | DIP, DIP20,.3 | - | - |
| Reach Compliance Code | unknow | unknow | unknow | unknow | - | - |
| 最大模拟输入电压 | 5 V | 5 V | 5 V | 5 V | - | - |
| 转换器类型 | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER | - | - |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 | - | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | - |
| 最大线性误差 (EL) | 0.2% | 0.2% | 0.2% | 0.2% | - | - |
| 位数 | 8 | 8 | 8 | 8 | - | - |
| 功能数量 | 1 | 1 | 1 | 1 | - | - |
| 端子数量 | 20 | 20 | 20 | 20 | - | - |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | - | - |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | SOP | SOP | DIP | DIP | - | - |
| 封装等效代码 | SOP20,.4 | SOP20,.4 | DIP20,.3 | DIP20,.3 | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | - | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | - | - |
| 表面贴装 | YES | YES | NO | NO | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | - |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | - | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | - | - |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | - | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | - | - |
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