0603(0201) Ultra Mini Type
Multilayer Ceramic Capacitors
Features
* Smaller, thinner, and lighter than 1005(0402)
* High density mounting
* Higher mount rate due to special carrier tape
Illustration
Case
Dimensions (mm)
L
W
B
min.
T
max.
B
L
W
Applications
T
C0603
(0201)
0.60
±
0.03
0.30
±
0.03
0.1
0.33
* Cellular phone
* Portable/Handheld devices (PDA's, MP3 players,
etc).
* RF Module (VCO, TCXO, PA, etc).
Capacitance
1.0
1.5
2.0
2.2
3.0
3.3
4.0
4.7
5.0
6.0
6.8
7.0
8.0
9.0
10
12
15
18
22
27
33
39
47
56
68
82
100
220
470
1.0
2.2
4.7
10
C0G
25V
25V
X5R
16V
6.3V
Y5V
16V
(nF)
(pF)
under development
High Density Mounting
0402(C1005)
t=0.5mm
0.4
0.3
0.5
0.3
0.2
0.2
0.2 0.6
0.3
0.2
0.4
1.0
Solder pad dimensions (mm)
Case
Size
Label
Solder resist
Chip Capacitor
Solder pad
0201(C0603)
t=0.3mm
C0603
(0201)
Approx 1/3
A
0.25 ~ 0.35
(Unit:mm)
(Unit:mm)
C
Mount area(place 10pcs)
Mount area(place 10pcs)
13.76mm
22
13.76mm
Mount area(place 10pcs)
Mount area(place 10pcs)
4.86mm
2
2
4.86mm
B
B
A
0.20 ~ 0.30
Chip cap
0402 (t=0.5mm)
0201(t=0.3mm)
Cubage
1
0.216
PCB projective area
(mm
2
/pcs)
0.5
0.18
Weight
Pitch between parts(mm)
(mg/pcs) Ldirection Wdirection
1.2
0.3
0.4
0.2
0.3
0.2
Mount area
(mm
2
/pcs)
1.12
0.4
C
0.25 ~ 0.35
TDK CORPORATION OF AMERICA 1600 Feehanville Drive Mount Prospect, Illinois 60056 ; Phone: 847-803-6100 www.TDK.com
June 2001
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