电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

10091836-S0J-80B

产品描述high speed / modular connectors xcede 2pr 6col RT pol guide NO key
产品类别连接器   
文件大小1MB,共4页
制造商FCI [First Components International]
下载文档 详细参数 全文预览

10091836-S0J-80B概述

high speed / modular connectors xcede 2pr 6col RT pol guide NO key

10091836-S0J-80B规格参数

参数名称属性值
ManufactureFCI
产品种类
Product Category
High Speed / Modular Connectors
RoHSN
工厂包装数量
Factory Pack Quantity
304

文档预览

下载PDF文档
BAcKpAneL connectors
XCede
®
HigH-PerformanCe
BaCkPlane ConneCtor SyStem
Description
Fci’s Xcede
®
connector platform is designed for 25 Gb/s
performance to provide the headroom to support future
high-speed, serial data rate requirements demanded by
next-generation equipment in data centers and service
provider networks. the use of engineering polymers in a
resonance-damping shield enables very low crosstalk
across a wide frequency range.
Xcede connectors also address requirements for higher
linear signal density at the interface of backplane and
daughter card. signal connectors can be configured with
2, 4 or 6 differential pairs per column, providing up to 82.4
differential pairs/inch, suiting architectures with multiple
front or rear fabric slots and blade systems with cooling
straight through the backplane. complementary guidance
and power modules are also included in the product
range. A wafer organizer can be used to combine groups
of right-angle signal, guidance and power modules as an
integrated daughter-card connector.
the Xcede backplane header system provides the
ruggedness and long-term reliability required by today’s
systems. the wide ground contacts feature a stiffness-
enhancing rib and are advanced well ahead of the signals
for exceptional robustness and signal pin protection.
FeAtures & BeneFits
High-speed backplane system designed for 25 Gb/s
Use of engineering materials in the shield aids in
reduction of crosstalk resonances
1.85 mm column pitch offers high linear signal density
• Configurations with 6 differential pairs/column fit 36 mm
card slot pitch and provide 82.4 pairs/inch
• 4 pairs/column fit 25 mm slot pitch with 54.9 pairs/inch
• 2 pairs/column fit 15 mm slot pitch with 27.5 pairs/inch
Two ground vias between differential pairs allow elongated
antipads to further improve impedance
Optional short compliant pin permits deeper backdrilling and
dual diameter vias to enhance return loss performance
Wide ground contacts feature a stiffening rib and are
advanced well ahead of signals for exceptional robustness
and signal pin protection
Intermateable, electrically and mechanically interchangeable
licensed second source to Amphenol TCS
Xcede® is a registered trademark of Amphenol corporation
tArGet MArKets / AppLicAtions
Communications
Routers
Switches
Networking
Access
Transport
Wireless
Data
Servers
Storage Systems
Industrial
Medical
Test & Measurement
关于maplab的几个问题。
1、在debugger下,进行调试的步骤有哪些? 是先BUILD ALL--debugger ---run吗?需要program吗? 2、几个命令:animate是什么意思?step over? step into? 3、还有调试时有运行到光标处 ......
zachy 嵌入式系统
51嵌入式系统教程
51嵌入式系统教程...
ldxd520 51单片机
新回复短消息消息通知
不知道有没有这样的功能,对于主题的发布者,如果有新网友回复什么的,可以来个新回复通知什么的,就像系统的短消息一样的,这样就对于一些管理者,版主,更加了解自己版块的事物啦,然后也可以 ......
gaoxiao 为我们提建议&公告
基于51系列单片机的数字万用表的设计
我毕设是基于51系列单片机的数字万用表的设计 实现电压电阻电流的测量,分别至少有三个档位。我现在用proteus仿真仿不出来,快答辩了。谁有整套的软件设计的东西,能否发给我。我邮箱:fengyan ......
fengyan 51单片机
怎么测试红外摄像机的距离?
怎么测试红外摄像机的距离? 大家谈谈怎么测试厂家所说的红外距离?...
飞雪 工业自动化与控制
片内flash 片外flash的驱动问题
u-boot里有关于flash的驱动代码(flash.c), 这个驱动代码是片内flash的还是片外flash的? 如果是片外的,那么片内的驱动在哪?如果是片内的,那么片外的在哪? linux里也有flash驱动,和u ......
shiminghu 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 716  320  2886  1652  596  15  13  56  2  12 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved