电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C1812Q273M1XAL7246

产品描述Ceramic Capacitor, Ceramic, 100V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.027uF, 1812,
产品类别无源元件    电容器   
文件大小1MB,共8页
制造商KEMET(基美)
官网地址http://www.kemet.com
下载文档 详细参数 全文预览

C1812Q273M1XAL7246概述

Ceramic Capacitor, Ceramic, 100V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.027uF, 1812,

C1812Q273M1XAL7246规格参数

参数名称属性值
是否Rohs认证不符合
Objectid709531586
包装说明, 1812
Reach Compliance Codenot_compliant
ECCN代码EAR99
YTEOL6.5
电容0.027 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度2.03 mm
JESD-609代码e0
长度4.57 mm
负容差20%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形式SMT
包装方法Bulk
正容差20%
额定(直流)电压(URdc)100 V
系列C(SIZE)Q
尺寸代码1812
温度特性代码X7R
温度系数15% ppm/°C
端子面层Tin/Lead (Sn70Pb30) - with Nickel (Ni) barrier
宽度3.18 mm

文档预览

下载PDF文档
CERAMIC HIGH RELIABILITY
GENERAL INFORMATION GR900 SERIES
HIGH RELIABILITY — GR900
/ Q-SPEC
GR900 capacitors are intended for use in any application where the
chance of failure must be reduced to the lowest possible level. While
any well-made multilayer ceramic capacitor is an inherently reliable
device, GR900 capacitors receive special attention in all phases of
manufacture including:
Raw Materials Selection
Clean Room Production
Individual Batch Testing
C-SAM (when applicable)
Singular Batch Identity is Maintained
Destructive Physical Analysis
These parts are well worth the added investment in comparison to the
cost of a device or system failure.
Typical applications include: Medical, Aerospace, Communication
Satellites, Radar and Guidance Systems.
SCREENING AND SAMPLE TESTS
Each batch receives the following testing/inspections:
In Process Inspection (Per MIL-PRF-123):
1.
2.
100% Visual Inspection.
Destructive Physical Analysis: (DPA) - A sample is pulled from
each lot and examined per EIA-469 and KEMET’s strict internal
void and delamination criteria. Sampling plan is per MIL-PRF-123.
C-SAM (GR900 / “A” in the fifth character position of the ordering
code): May be performed on batches failing to meet the DPA
criteria for removal of marginal product. Not required on each lot.
C-SAM (Q-SPEC / “Q” in the fifth character position of the ordering
code): Receive 100% C-SAM of lot prior to application of end
metallization.
Group A
1. Thermal Shock:
Materials used in the construction of multilayer
ceramic capacitors possess various thermal coefficients of expansion.
To assure maximum uniformity, each part is temperature cycled in
accordance to MIL-STD-202, Method 107, Condition A with Step 3
being 125°C. Number of cycles shall be 20 (100% of lot).
2. Voltage Conditioning:
One of the most strenuous environments for
any capacitor is the high temperature/high voltage test. All units are
subject to twice-rated voltage to the units at the maximum rated
temperature of 125°C for a minimum of 168 hours and a maximum of
264 hours. The voltage conditioning may be terminated at any time
during 168 hours to 264 hours time interval that confirmed failures meet
the requirements of the PDA during the last 48 hours of 1 unit or .4%
(100% of lot).
Optional Voltage Conditioning (Accelerated Voltage
Conditioning):
All conditions of the standard voltage conditioning
apply with the exception of increased voltage and decreased test time.
Refer to MIL-PRF-123 for the proper formula.
*Step 5 is performed on chips at this point (100% of lot).
3. Dielectric Withstanding Voltage:
250% of the DC rated voltage at
25°C (100% of lot).
9. Percent Defective Allowable (PDA):
The overall PDA is 8% for
parts outside the MIL-PRF-123 values. The PDA is per MIL-PRF-
123 for all parts that are valid MIL-PRF-123 values. The PD
includes steps 1 through 8 above with the following exceptions.
Capacitance exclusion - capacitance values no more than 5% or
.5pF, whichever is greater for BX characteristic or 1% or .3pF,
whichever is greater for BP characteristic beyond specified
tolerance limit, shall be removed from the lot but shall not be
considered defective for determination of the PD.
Insulation Resistance at 25°C — Product which is not acceptable
for twice the military limit but is acceptable per the military limit, is
removed from the lot but shall not be considered defective for
determination of the PD.
10. Visual and Mechanical Examination:
Performed per MIL-
PRF-123 criteria.
11. Radiographic Examination (Leaded Devices Only):
Radial
devices receive a one-plane X-ray.
12. Destructive Physical Analysis (DPA):
A sample is examined
on each lot per EIA-469. Sampling Plan is per MIL-PRF-123.
STANDARD PACKAGING
All products are packaged in trays except C512 capacitors which
are packaged 1 piece per bag.
*Note: All packaging is ESD protected.
DATA PACKAGE
A data package is sent with each shipment which contains:
1. Final Destructive Physical Analysis (DPA) report.
2. Certificate of Compliance stating that the parts meet all
applicable requirements of the appropriate military specification to
the best failure level to which KEMET is approved.
3. Summary of Group A Testing.
Group B
MIL-PRF-123 Group B testing is available with special order.
Please contact KEMET for additional information and ordering
details.
4. Insulation Resistance:
The 25°C measurement with rated
voltage applied shall be the lesser of 100 GΩ or 1000 Megohm -
Microfarads (100% of lot).
*5. Insulation Resistance:
The 125°C measurement with rated
voltage applied shall be the lesser of 10 GΩ or 100 Megohm -
Microfarads (100% of lot). For chips, 125°C IR is performed prior to
Step 3 above.
6. Storage
at 150°C for 2 hours minimum without voltage applied
followed by a 12-hour minimum stabilization period (temperature
characteristic BX only).
7. Capacitance:
Shall be within specified tolerance at 25°C (100%
of lot). (Aging phenomenon is taken into account for BX dielectric
to obtain capacitance.)
8. Dissipation Factor:
Shall not exceed 2.5% for X7R (BX)
dielectric, 0.15% for C0G (BP) dielectric at 25°C. (100% of lot.)
3.
12
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
TMS320LF2407实现三相SPWM波形发生器
TMS320LF2407实现三相SPWM波形发生器...
安_然 微控制器 MCU
关于isa地址映射(讨论和请教)
用的vxworks5.5,硬件环境pc104,有个数字IO板,isa总线的。板卡的物理基地址是0x300。有下面几个问题请教高手: 1、因为MMU的存在,是不是要访问这个板子,需要进行物理地址到虚拟地址的映射 ......
eeworld_tw 嵌入式系统
中科信软招聘nrec兼职讲师
中科信软科技有限公司(简称中科信软)培训中心依托中国科学院强大技术人才优势,以国内绝对领先的师资力量,根据企事业单位的实用需求,通过定制培训方案,提供各种技术及管理培训,将企事业单 ......
nobody133 求职招聘
EEWORLD大学堂----电源设计小贴士10:估算表面贴装半导体的温升
电源设计小贴士10:估算表面贴装半导体的温升:https://training.eeworld.com.cn/course/500...
dongcuipin 电源技术
晒WEBENCH设计的过程+3.3V-5V升压电路
1、进入WNBENCH主页,选择 ”电源“选项,并填入相应的参数,点击开始 163981 2、点比较所有按键 163987 3、显示所有方案,选择一种,点开始设计 163982 4、点击查看波形 163983 ......
常见泽1 模拟与混合信号
请问vxworks如何识别和加载usb设备的驱动程序?
我要在vxworks平台下写一个usb设备的驱动,系统通过枚举识别出usb设备,但系统如何选择驱动程序呢?是根据(bDeviceClass,bDeviceSubClass,bDeviceProtocl)信息,还是根据(idVendor,idProduct),或则 ......
wzp9999 实时操作系统RTOS

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1526  2930  2740  619  56  31  59  56  13  2 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved