电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CHP1/8-504120C13LF

产品描述Fixed Resistor, Metal Glaze/thick Film, 0.25W, 412ohm, 200V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 1206, ROHS COMPLIANT
产品类别无源元件    电阻器   
文件大小382KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准  
下载文档 详细参数 全文预览

CHP1/8-504120C13LF概述

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 412ohm, 200V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 1206, ROHS COMPLIANT

CHP1/8-504120C13LF规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Objectid1180766166
包装说明ROHS COMPLIANT
Reach Compliance Codecompliant
ECCN代码EAR99
JESD-609代码e1
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
封装形状CYLINDRICAL PACKAGE
包装方法TR, 13 INCH
额定功率耗散 (P)0.25 W
额定温度70 °C
电阻412 Ω
电阻器类型FIXED RESISTOR
尺寸代码1206
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数50 ppm/°C
端子面层Tin/Silver/Copper (Sn96.0Ag3.5Cu0.5)
端子形状WRAPAROUND
容差0.25%
工作电压200 V

文档预览

下载PDF文档
Cylindrical High Power
Surface Mount Metal Glaze™
CHP Series
·
Cylindrical High Power
Up to 2 watts
·
Surface Mount Metal Glaze
TM
Up to 1000 volts
·
0.2 ohm to 2.2 megohm range
·
Up to 2 watts
RoHS-compliant version available
·
Up to 1000 volts
150°C maximum operating temperature
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
150°C maximum operating temperature
CHP
Metal Glaze™
thick fi lm element
fi red at 1000°C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
Solder over
nickel barrier
Solder over
nickel barrier
High
temperature
dielectric
coating
High
temperature
dielectric
coating
Electrical Data
IRC
Type
Indus-
try
Foot-
print
1206
Size
Code1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
teristics
Charac
Thermal Shock
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Maximum
m Change
Maximu
Change
±0.25% +.01 Ω
As specified
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.25% + 0.01 ohm
±0.5% +.01 Ω
Test Method
MIL-PRF-55342H, §4.8.3
Test Method
MIL-R-55342H Par 3.16 (-55°C +
+150°C / -65°C)
(MIL-STD-202, Method 107G:
125°C)
MIL-PRF-55342H, §4.8.5
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
(-65°C)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
MIL-R-55342H Par 3.12
2.5 x
P x R
for 5 seconds
MIL-PRF-55342H, §4.8.7
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-PRF-55342H, §4.8.8.2
Short Time Overload
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
±1%
+ 0.01 ohm
±0.5%
for R>100KΩ
±1% for R>100K ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
MIL-PRF-55342H, §4.8.6
(150°C x 100 Hours)
Resistance to Bonding Exposure
Moisture Resistance
Solderability
High Temperature Exposure
±0.5% +.01 Ω
±0.25% +.01 Ω
±0.5% +.01 Ω
As specified
MIL-PRF-55342H, §4.8.8.2
95% minimum coverage
±0.5% + 0.01 ohm
Temperature Coefficient
Life Test
Resistance
Moisture
Life Test
Solderability
Terminal Adhesion Strength
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
1200 gram push from underside of mounted chip for 60 seconds
(MIL-STD-202, Method 208H)
MIL-STD-202, Method 208 (245°C for 5 seconds)
(MIL-STD-202, Method 106G)
±1%
+ 0.01
±0.5%
+.01 Ω
ohm
±1% +
minimum coverage
95%
0.01 ohm
no mechanical damage
MIL-PRF-55342H, §4.8.11
MIL-PRF-55342H, §4.8.12
±1% +.01 Ω
IRC – defined
Chip mounted in center of 90mm long board, deflected 1mm so as to
Terminal Adhesion Strength (push)
±1% + 0.01 ohm
(no mechanical damage)
exert pull on chip contacts for 5 seconds
1200 gram push from underside of mounted device for 60 sec
no mechanical damage
IRC-defined
±1% +.01 Ω
General Note
Device mounted in center of 90mm long board, deflected 1 mm to exert
Terminal Adhesion Strength (flex)
cation without notice or liability.
IRC reserves the right to make changes in product specifi
(no mechanical damage)
All information is subject to IRC’s own data and is considered accurate at time of going to print.
pull on contacts for 5 seconds
A subsidiary of
© IRC Wire and Film Technologies Division
General Note
Telephone:
Facsimile:
Website: www.irctt.com
rpus Christi Te
TT electronics plc
ries Issue March
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
09.12
刚被某网友吐槽某活动的礼品没吸引力用不上,你怎么看!
被吐糟的活动礼品: 195606 活动名称:晒出TI C2000的使用经验或优秀设计作品!(本次活动离结束时间仅剩4天) 一等奖:小米盒子 吐槽理由:工程师不看电视,派不上用场。 那就送 ......
maylove 微控制器 MCU
【AN-738应用笔记】在Windows CE.NET下使用AD7877触摸屏控制器
简介 AN-738应用笔记详细介绍了一种方法,这种方法可将ADI公司的AD7877触摸屏控制器连接到Intel® PXA25x处理器,以便在Windows® CE操作系统下使用。 115994 115995...
EEWORLD社区 ADI 工业技术
初学MSP430F5529有关的 通用I/O口的设置之二
这一部分讲外部中断。  看介绍再加弄懂程序才是王道  外部中断是MSP430优先级最低的中断而且是可屏蔽中断。用起来比较简单。  1.2.7 简单的端口中断(外部中断) P1 ......
fish001 微控制器 MCU
【已颁奖】三人行必有我师——EEworld网友原创教程隆重登场!
【已颁奖】:颁奖贴 https://bbs.eeworld.com.cn/thread-435756-1-1.html 大家应该都知道EEWORLD联合众网友出品的第一本书——《MCU工程师炼成记》,这本凝结了众人心血的书为论坛学习4 ......
EEWORLD社区 微控制器 MCU
430编程C语言常识(IAR)结构体与联合体
结构体与联合体是C语言的常见数据类型,可对C的基本数据类型进行组合使之能表示复杂的数据结构,意义深远,是优异代码的必备工具。 一. struct与 union的基本用法,在语法上union与struct ......
yuwei19891112 TI技术论坛
【TI首届低功耗设计大赛】金刚狼和云MySQL的交互
本帖最后由 ljj3166 于 2014-10-21 12:12 编辑 周末又折腾了一下金刚狼 整出个模型,没能详细记载过程,来个玩次一贴流吧 ----------------------------------金刚狼和云数据库的交互----- ......
ljj3166 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 599  1102  1227  2882  1047  13  23  25  59  22 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved