3 Volt Intel
®
Advanced+ Boot Block
Flash Memory (C3) Stacked-Chip Scale
Package Family
Datasheet
Product Features
■
■
■
■
Flash Memory Plus SRAM
— Reduces Memory Board Space
Required, Simplifying PCB Design
Complexity
Stacked-Chip Scale Package (Stacked-
CSP) Technology
— Smallest Memory Subsystem Footprint
— Area : 8 x 10 mm for 16Mbit (0.13 µm)
Flash + 2Mbit or 4Mbit SRAM
— Area : 8 x 12 mm for 32Mbit (0.13 µm)
Flash + 4Mbit or 8Mbit SRAM
— Height : 1.20 mm for 16Mbit (0.13 µm)
Flash + 2Mbit or 4Mbit SRAM and
32Mbit (0.13um) Flash + 8Mbit SRAM
— Height : 1.40 mm for 32Mbit (0.13 µm)
Flash + 4Mbit SRAM
— This Family also includes 0.25 µm and
0.18 µm technologies
Advanced SRAM Technology
— 70 ns Access Time
— Low Power Operation
— Low Voltage Data Retention Mode
Intel
®
Flash Data Integrator (FDI)
Software
— Real-Time Data Storage and Code
Execution in the Same Memory Device
— Full Flash File Manager Capability
■
■
■
■
Advanced+ Boot Block Flash Memory
— 70 ns Access Time at 2.7 V
— Instant, Individual Block Locking
— 128 bit Protection Register
— 12 V Production Programming
— Ultra Fast Program and Erase Suspend
— Extended Temperature –25 °C to +85 °C
Blocking Architecture
— Block Sizes for Code + Data Storage
— 4-Kword Parameter Blocks (for data)
— 64-Kbyte Main Blocks (for code)
— 100,000 Erase Cycles per Block
Low Power Operation
— Async Read Current: 9 mA (Flash)
— Standby Current: 7 µA (Flash)
— Automatic Power Saving Mode
Flash Technologies
— 0.25 µm ETOX™ VI, 0.18 µm ETOX™
VII and 0.13 µm ETOX™ VIII Flash
Technologies
— 28F160xC3, 28F320xC3
The 3 Volt Intel
®
Advanced+ Boot Block Flash Memory (C3) Stacked-Chip Scale Package
(Stacked-CSP) device delivers a feature-rich solution for low-power applications. The C3
Stacked-CSP memory device incorporates flash memory and static RAM in one package with
low voltage capability to achieve the smallest system memory solution form-factor together with
high-speed, low-power operations. The C3 Stacked-CSP memory device offers a protection
register and flexible block locking to enable next generation security capability. Combined with
the Intel
®
Flash Data Integrator (Intel
®
FDI) software, the C3 Stacked-CSP memory device
provides a cost-effective, flexible, code plus data storage solution.
Notice:
This document contains information on new products in production. The specifications
are subject to change without notice. Verify with your local Intel sales office that you have the lat-
est datasheet before finalizing a design.
252636-001
February, 2003
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The 3 Volt Intel® Advanced+ Boot Block Flash Memory Stacked-CSP Family may contain design defects or errors known as errata which may cause
the product to deviate from published specifications. Current characterized errata are available on request.
MPEG is an international standard for video compression/decompression promoted by ISO. Implementations of MPEG CODECs, or MPEG enabled
platforms may require licenses from various entities, including Intel Corporation.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
548-4725 or by visiting Intel's website at http://www.intel.com. Additional information on this product family can be obtained by accessing the Intel®
Flash website: http://www.intel.com/design/flash.
Copyright © 2003 Intel Corporation.
*Other names and brands may be claimed as the property of others.
2
Datasheet
Contents
Contents
1.0
Introduction....................................................................................................................................7
1.1
1.2
1.3
1.4
2.0
2.1
Document Conventions ........................................................................................................7
Product Overview .................................................................................................................7
Package Ballout....................................................................................................................8
Signal Definitions ..................................................................................................................9
Bus Operation .....................................................................................................................11
2.1.1 Read ......................................................................................................................11
2.1.2 Output Disable .......................................................................................................12
2.1.3 Standby..................................................................................................................12
2.1.4 Flash Reset............................................................................................................13
2.1.5 Write ......................................................................................................................13
Read Array (FFh) ................................................................................................................13
Read Identifier (90h) ...........................................................................................................13
Read Status Register (70h) ................................................................................................14
3.3.1 Clear Status Register (50h) ...................................................................................14
CFI Query (98h) ..................................................................................................................15
Word Program (40h/10h) ....................................................................................................15
3.5.1 Suspending and Resuming Program (B0h/D0h)....................................................15
Block Erase (20h) ...............................................................................................................16
3.6.1 Suspending and Resuming Erase (B0h/D0h) ........................................................16
Block Locking......................................................................................................................18
3.7.1 Block Locking Operation Summary........................................................................19
3.7.2 Locked State ..........................................................................................................19
3.7.3 Unlocked State ......................................................................................................19
3.7.4 Lock-Down State ...................................................................................................19
3.7.5 Reading a Block’s Lock Status ..............................................................................20
3.7.6 Locking Operation during Erase Suspend .............................................................20
3.7.7 Status Register Error Checking .............................................................................20
128 Bit Protection Register .................................................................................................21
3.8.1 Reading the Protection Register ............................................................................21
3.8.2 Programming the Protection Register (C0h)..........................................................21
3.8.3 Locking the Protection Register .............................................................................22
Power-Up/Down Characteristics.........................................................................................23
Additional Flash Features ...................................................................................................23
4.2.1 Improved 12 Volt Production Programming ...........................................................23
4.2.2 F-VPP < VPPLK for Complete Protection..............................................................23
Absolute Maximum Ratings ................................................................................................24
Operating Conditions ..........................................................................................................25
Capacitance ........................................................................................................................25
Principles of Operation
...............................................................................................................11
3.0
Flash Memory Modes of Operation............................................................................................13
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
4.0
Power and Reset Considerations
..............................................................................................23
4.1
4.2
5.0
Electrical Specifications
.............................................................................................................24
5.1
5.2
5.3
Datasheet
3
Contents
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
6.0
7.0
DC Characteristics.............................................................................................................. 26
Flash AC Characteristics. ................................................................................................... 29
Flash AC Characteristics—Write Operations...................................................................... 31
Flash Erase and Program Timings(1)................................................................................. 31
Flash Reset Operations ...................................................................................................... 34
SRAM AC Characteristics—Read Operations.................................................................... 35
SRAM AC Characteristics—Write Operations .................................................................... 37
SRAM Data Retention Characteristics—Extended Temperature ....................................... 39
Migration Guide Information
...................................................................................................... 40
System Design Considerations..................................................................................................
41
7.1
Background......................................................................................................................... 41
7.1.1 Flash + SRAM Footprint Integration ...................................................................... 41
7.1.2 Advanced+ Boot Block Flash Memory Features ................................................... 41
Flash Control Considerations ............................................................................................. 41
7.2.1 F-RP# Connected to System Reset....................................................................... 42
7.2.2 F-VCC, F-VPP and F-RP# Transition .................................................................... 42
Noise Reduction ................................................................................................................. 43
Simultaneous Operation ..................................................................................................... 44
7.4.1 SRAM Operation during Flash “Busy” ................................................................... 45
7.4.2 Simultaneous Bus Operations ............................................................................... 45
Printed Circuit Board Notes ................................................................................................ 45
System Design Notes Summary......................................................................................... 45
7.2
7.3
7.4
7.5
7.6
Appendix A Program/Erase Flowcharts
............................................................................................. 46
Appendix B CFI Query Structure
........................................................................................................ 52
Appendix C Word-Wide Memory Map Diagrams
............................................................................... 59
Appendix D Device ID Table
................................................................................................................ 62
Appendix E Protection Register Addressing.....................................................................................
63
Appendix F Mechanical and Shipping Media Details........................................................................
64
Appendix G Additional Information
.................................................................................................... 68
Appendix H Ordering Information.......................................................................................................
69
4
Datasheet
Contents
Revision History
Date of
Revision
02/11/03
Version
-001
Description
Initial release, Stacked-Chip Scale Package
Datasheet
5
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