• Lead wire with tin-plated copper, diameter 0.6mm
HF
FREE
HALOGEN
Pb
• Protects against harmful overcurrents in primary and
secondary applications
• Small radial-leaded design minmizes board space and
eliminates need for additional mounting components
(BK/PCS holder optional if field replacement is
desirable)
• Designed to UL 248-14
Rated
Current
800mA-10A
Electrical Characteristics
1 xIn
1.5 xIn
min
max
4hr
10 min
2 xIn
max
2 min
Packaging – mm / [inches]
Agency Information
• UL Listed: File E19180 JDXY1, JDYX7
• PSE: File JET5766-31007-1001,
File JET5766-31007-1002
Specifications
• Solderability: EIA-186-9E Method 9
• High frequency vibration: MIL-STD-202F,
Method 201A
• Operating temperature: -40°C to +125°C
• Soldering heat resistance: 260°C, 10 sec. max.
(IEC 60068-2-20)
Ordering
• Specify product and packaging code
(i.e., SR-5F-1A-AP)
Dimensions - mm / [inches]
Mounting Socket (RoHS compliant)
• Available as option. Specify catalog number BK/PCS
(In bulk 100 per bag)
Socket (PCS)
0.03"
0.30"
(7.62mm)
(0.76mm)
0.20"
(5.08mm)
0.095"
(2.41mm)
0.29"
(7.37mm)
(3.05mm
±
0.25mm)
0.12"
±
0.01"
0709
BU-SB07219
Page 1 of 3
Data Sheet 4073
Specifications
Catalog
Number
SR-5F-800mA
SR-5F-1A
SR-5F-1.25A
SR-5F-1.6A
SR-5F-2A
SR-5F-2.5A
SR-5F-3.15A
SR-5F-4A
*SR-5F-5A
*SR-5F-6.3A
*SR-5F-7A
*SR-5F-8A
*SR-5F-10A
Voltage
Rating
(Vac)
250
250
250
250
250
250
250
250
250
125
125
125
125
Interrupting Rating
(amps) @ Rated
Voltage (50Hz)
**
50
50
50
50
50
50
50
50
50
50
50
50
50
Typical DC Cold
Resistance (W)
***
0.245
0.171
0.116
0.076
0.058
0.049
0.037
0.026
0.018
0.015
0.011
0.010
0.007
Typical Melting I
2
t
†
Maximum Voltage
(A
2
S)
†
Drop@1In (mV)
‡
1.5
400
2.6
400
4.4
330
6.9
330
9
330
15
330
23.2
330
35.4
330
55
250
75
250
107
250
120
200
145
200
Maximum Power
Dissipation @
1In(mW)
†††
320
400
413
528
660
825
1040
1320
1250
1575
1750
1600
2000
Agency Approvals
cULus
PSE
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
*Conducting path min. 0.2mm
2.
**Interrupting ratings measured at 50A, 95%-100% of PF on AC.
***Typical DC Cold Resistance measured at <10% of rated current.
†Typical Melting I
2
t measured at 10I
n
.
‡ Maximum Voltage Drop measured at 20°C ambient temperature at rated current.
†††Maximum Power Dissipation measured at 20°C ambient temperature at rated current.
0709
BU-SB07219
Page 2 of 3
Data Sheet 4073
Time-Current Curve
Time in Seconds
Current in Amps
Packaging Code
Packaging Suffix
-BK
-BK1
-BK2
-AP
-AP1
Description
200 fuses in polybag, Lead L = 4.3 ± 0.3
200 fuses in polybag, Lead L = 18.8 ± 1.0
200 fuses in polybag, Lead L = 21 ± 3.0
1000 fuses Ammo Pack, Pitch = 12.7
1000 fuses Ammo Pack, Pitch = 15
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is
intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained
in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support
systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in
LED 是light emitting diode (发光二极管)的缩写,是一种由半导体技术制成的电光源。LED的核心部分是由P型半导体和N型半导体组成的晶片,在P型半导体和N型半导体之间有一个过渡层,称为P2N结。在正向导通时,半导体中的多数载流子和少数载流子复合,释放出的能量以光子或部分以光子的形式发射出来,大量的光子形成光子流,即发光。P2N结加反向电压时,少数载流子难以注入,故不发...[详细]
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