20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486
9F, No 81, Shui Lee Rd. • Hsinchu, Taiwan, R.O.C. • tel: 886.3.5169222 • fax: 886.3.5169213
LUMNDS531-OCT1905
rev. A.1
1
2.5G CWDM Series Laser Diode Module (18 channel)
Preliminary
C-XXXXX-DFB2.5-XX-SXXXI/XXX-X-XX
LD Pin Assignment
½½
½½½½½½
½½½½
½½½½½½
½½
½½½½½½
½½½½
½½
½½
½½½½½½½½½½½½½½½½½½½½½½½½½½½
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
½½½½½½½½½½½½½½½½½½½½½
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
½½½½½½½½½½½½½½½½½½½½½½
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
½½½½½½½½½½½½½½½½½½½½½½½½½½½
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
½½½½½½½½½½½½½½½½
½½½½½½½½½½½½½½½½½½½½½
½½½½½½½½½½½½½½½½½½½½½½½½½½½
½½½½½
½½½½½½½½½½½½½
½½½½½
½½½½½½½½½½½½½
½½½½½½½
½½½½½½½½½½½½½
LUMINENTOIC.COM
20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486
9F, No 81, Shui Lee Rd. • Hsinchu, Taiwan, R.O.C. • tel: 886.3.5169222 • fax: 886.3.5169213
LUMNDS531-OCT1905
rev. A.1
2
2.5G CWDM Series Laser Diode Module (18 channel)
Preliminary
C-XXXXX-DFB2.5-XX-SXXXI/XXX-X-XX
Packaging Dimension
Units in mm.
Part Number: C-XXXXX-DFB2.5-TX-SXXXI
½½½½½½½
½½½½½½½½½½½½½½½½½½½½½½½
Optical plane
½½½½½½½
½½½½½½½½½½½½½½½½½½½½½½½
Optical plane
½½½½½½½½½½½½½½½½½½
½½½½
LUMINENTOIC.COM
20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486
9F, No 81, Shui Lee Rd. • Hsinchu, Taiwan, R.O.C. • tel: 886.3.5169222 • fax: 886.3.5169213
LUMNDS531-OCT1905
rev. A.1
3
2.5G CWDM Series Laser Diode Module (18 channel)
Preliminary
C-XXXXX-DFB2.5-XX-SXXXI/XXX-X-XX
Packaging Dimension
Units in mm.
Part Number: C-XXXXX-DFB2.5-PX-SXXXI/XXX-X-XX
½½½½½½½½½½½
½½½½½½½½½½½½½½½½½
½½½½½½½½½½½½½½
½½½½½½½½
½½½½½½½½
½½½½½½½½
½½½½½½½½½
½½½½½½½½½½½½
½½½½½½½½
½½½½½½½½½½½½½½½½½½½½½½½½½½½
LUMINENTOIC.COM
20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486
9F, No 81, Shui Lee Rd. • Hsinchu, Taiwan, R.O.C. • tel: 886.3.5169222 • fax: 886.3.5169213
LUMNDS531-OCT1905
rev. A.1
4
2.5G CWDM Series Laser Diode Module (18 channel)
Preliminary
C-XXXXX-DFB2.5-XX-SXXXI/XXX-X-XX
Ordering Information
C-XXXXX-DFB2.5-XX-SXXXI/XXX-X-XX
Wavelength
1270=1270 nm
1290=1290 nm
1310=1310 nm
1330=1330 nm
1350=1350 nm
1370=1370 nm
1390=1390 nm
1410=1410 nm
1430=1430 nm
1450=1450 nm
1470=1470 nm
1490=1490 nm
1510=1510 nm
1530=1530 nm
1550=1550 nm
1570=1570 nm
1590=1590 nm
1610=1610 nm
"-" =Wavelength ±2nm
"A"=Wavelength ±3nm
Package
T=TOSA
R=Receptacle
P=Pigtail
"-"=A Type
B =B Type
D =DType
Connector
FC/ST/SC/MU/LC/-
- = PC Fiber
APC = APC Fiber
Fiber Output Power
L/M/H/2
Flange type (-;O;V;K)
-/G5/R5
Blank = RoHS non-compliant product
G5 = RoHS 5/6-compliant product (lead exemption)
GR = Full RoHS compliant product (no exemption)
Pin Assignment
"I" = Isolator
RoHS Compliant
Warnings
Handling Precautions:
This device is susceptible to damage as a result of electrostatic discharge (ESD). A static free environment is highly recommended. Follow
guidelines according to proper ESD procedures.
Laser Safety:
Radiation emitted by laser devices can be dangerous to human eyes. Avoid eye exposure to direct or indirect radiation.
Legal Notice
IMPORTANT NOTICE!
All information contained in this document is subject to change without notice, at Luminent's sole and absolute discretion. Luminent warrants performance of its
intended for use in implantation or other life support applications where malfunction may result in injury or death to persons. Luminent customers using or selling
products for use in such applications do so at their own risk and agree to fully defend and indemnify Luminent for any damages resulting from such use or sale.
THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN “AS IS" BASIS. Customer agrees that Luminent is not liable for any actual,
consequential, exemplary, or other damages arising directly or indirectly from any use of the information contained in this document. Customer must contact Lumi-
nent to obtain the latest version of this publication to verify, before placing any order, that the information contained herein is current.
在全球半导体产业因景气不佳而纷传并购、整合之际,两大IT巨头三星、IBM日前却双双宣布,将强化半导体产业投资。 三星电子本周一宣布,已向韩国证券交易所提交一份申请文件,打算2008年投下10.5亿美元,用于升级内存芯片生产线、改进技术工艺,从而提高产能并降低成本。无独有偶。本周二IBM公司宣布,未来3年将投资10亿美元,用于扩充位于纽约州 East Fishkill 的半导体工厂,以消...[详细]
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