THICK FILM
LEAD FREE CHIP RESISTORS (FCF)
FEATURES
Small size and lightweight with size range per int'l standard
Highly stable in auto-placement surface mounting application
Suitable for lead free soldering.
Compatible with flow and reflow soldering
APPLICATIONS
Consumer Electronics
Measurement instrument
Automotive industry
Electronic watch and camera
Computer
SOLDERING TEMPERATURE CURVE
T
(
˚C
)
250
200
150
100
50
0
0
50
100
150
200
250
2 K/s
forced
cooling
50
0
235˚C to 260˚C
10s
second wave
5 K/s
2 K/s
T
(
˚C
)
250
230˚C
200
180˚C
150˚C
90±30s
10 ~ 15s
Soldering Zone
Pre Heating Zone
Peak : Less than 245˚C
first wave
200 K/s
100˚C to 130˚C
150
100
Heating time
t (s)
Typical values (solid line).
Process limits (dotted line).
WAVE soldering.
t (s)
IR Reflow Soldering
PART NUMBER
FCF
Type
05
Size
F
Tolerance
T
Packing
1002
GM
P
TCR
FCF
01:0201
02:0402
03:0603
05:0805
06:1206
20:2010
25:2512
12:1225
B
C
D
F
G
J
:
± 0.1%
:
± 0.25%
:
± 0.5%
:
± 1%
:
± 2%
:
± 5%
S :
T :
V:
W:
P :
Y:
±
Paper tape
±
Paper tape
±
Paper tape
±
Paper tape
±
Plastic tape
±
Plastic tape
1Kpcs
5Kpcs
10Kpcs
20Kpcs
4Kpcs
16Kpcs
examples:
1002 100x10
2
=10KΩ
P : 50PPM
3
THICK FILM
LEAD FREE CHIP RESISTORS (FCF)
RATING
FCF SERIES
Type
Size
Power
Rating
at 70˚C
1/20W
1/16W
1/10W
1/8W
1/4W
1/2W
1W
Max.
RCWV
15V
50V
50V
150V
200V
200V
200V
Max.
Resistance Temperature
Overload Tolerance
Coefficient
Voltage
(TCR; ppm/˚C )
(%)
30V
100V
100V
300V
400V
400V
400V
±1%(F)
±5%(J)
±1%(F)
±5%(J)
±0.1%(B)
±0.25%(C)
±0.5%(D)
±1%(F)
±2%(G)
±5%(J)
±1%(F)
±5%(J)
±1%(F)
±5%(J)
±300
±200
±50
±50
±50
±100 ±50
±200
±200
±100
±200
±100
±200
Resistance
Range
Min.
10Ω
0Ω&1Ω
10Ω
0Ω&1Ω
20Ω
20Ω
20Ω
10Ω
Standard
Resistance
Max.
Values
E-24
E-96
E-24
E-96
E-96
E-96
E-96
E-24
E-24
E-96
E-24
E-96
E-24
FCF01
FCF02
FCF03
FCF05
FCF06
FCF20
FCF25
0201
0402
0603
0805
1206
2010
2512
1MΩ
1MΩ
1MΩ
10MΩ
510KΩ
510KΩ
510KΩ
1MΩ
10MΩ
1Ω
0Ω&1Ω 10MΩ
1Ω
10MΩ
0Ω&1Ω 10MΩ
10MΩ
1Ω
0Ω&1Ω 10MΩ
0201,0402,0603 size maximum resistance Rmax≦50mΩ and rated current I
R
≦1A
●
0805,1206,2010,2512 size maximum resistance Rmax≦50mΩ and rated current I
≦2A
R
1Ω~10Ω:
●
Temperature Coefficient of Resistance for 0402,0603,0805,1206 = -300~+500
●
Temperature Coefficient of Resistance for 0201,2010,2512 =±300
Jumper :
●
LOW RESISTANCE
Type
Size
Power
Rating
at 70˚C
1/10W
1/8W
1/4W
1/2W
1W
2W
Max.
RCWV
Max.
Resistance Temperature
Overload Tolerance
Coefficient
Voltage
(%)
(TCR; ppm/˚C )
754mV
843mV
1192mV
1686mV
2385mV
3373mV
±1%(F)
±5%(J)
±1%(F)
±5%(J)
±1%(F)
±5%(J)
±300
±400
±200
±400
±600
±1000
±100
±150
Resistance
Range
Min.
100mΩ
50mΩ
50mΩ
40mΩ
22mΩ
10mΩ
20mΩ
10mΩ
Max.
910mΩ
91mΩ
910mΩ
47mΩ
39mΩ
20mΩ
910mΩ
19mΩ
FCF03
FCF05
FCF06
FCF20
FCF25
FCF15
0603
0805
1206
2010
2512
1225
302mV
337mV
477mV
675mV
954mV
1349mV
4
THICK FILM,
LEAD FREE LOW RESISTANCE CHIP RESISTORS(FCF)
SPECIFICATION AND TEST METHODS
ITEM
DC Resistance
SPECIFICATION
J :±5%
G:±2%
F:
±1%
D:±0.5%
C:
±0.25%
B:
±0.1%
Zero ohm Jumper＜50mΩ
J,G:
△
R≦± (2% + 0.1Ω)
F,D:
△
R≦± (1% + 0.05Ω)
C,B:
△
R≦± (0.5% + 0.05Ω)
Over 95% of termination
must be covered with solder
TEST METHOD
IEC 60115-1 4.5 / JIS C 5202 5.1
Measure the resistance value.
Short time
Overload
IEC 60115-1 4.13 / JIS C 5202 5.5
2.5X Rated voltage or Max. Overload Voltage
for 5 sec. measure resistance after 30 minutes
IEC 60115-1 4.17 / JIS C 5202 6.5
After immersing flux, dip in the 245±2˚C
molten solder bath for 3±0.5 sec.
IEC 60115-1 4.18 / JIS C 5202 6.4
With 260±5˚C for 10±1 sec.
Solderability
Resistance to
Solder Heat
J,G:
△
R≦± (1% + 0.1Ω)
F,D,C,B:
△
R≦± (0.5% + 0.05Ω)
No mechanical damage
J,G:±200ppm/˚C
F:±100
±50ppm/˚C
D,C,B:±50ppm/˚C
Temperature
Coefficient of
Resistance
(TCR)
IEC 60115-1 4.8.4.2 / JIS C 5202 5.2
Test temperature : 25˚C (T1)→ -55˚C (T2)
25˚C (T1)→ 125˚C (T2)
TCR (ppm/˚C) =
R2-R1
R1
x
1
x 10
6
T2-T1
T1: 25˚C T2: Test temperature
R1: Resistance at reference temperature (T1)
R2: Resistance at test temperature (T2)
Load Life
Humidity
J,G:
△
R≦± (3% + 0.1Ω)
F,D:
△
R≦± (1% + 0.05Ω)
C,B:
△
R≦± (0.5% + 0.05Ω)
IEC 60115-1 4.24.2 / JIS C 5202 7.9
Maintain the temperature of the resistor at 40±2˚C
and 90~95% R.H. with the rated voltage
applied.Cycle ON for 1.5 hours and OFF for 0.5 hour
for 1000+48/-0 hours. After 1~4 hour, measure the
resistance value.
IEC 60115-1 4.25.1 / JIS C 5202 7.10
Permanent resistance change after 1000+48/-0
hours (1.5 hours ON , 0.5 hour OFF) at RCWV
or Max.Keep the resistor at 70±2˚C ambient
JIS C 5202 5.8
4.0xRated voltage (Max. Overload Voltage)
1 sec ON, 25 sec OFF, test 10,000 cycles
IEC 60115-1 4.19 / JIS C 5202 7.4
Repeat 5 cycles as follows
-55˚C(30 min.) ~ + 25˚C(2~3 min.)
+125˚C(30 min.) ~ + 25˚C(2~3 min.) for 0201
-55˚C(30 min.) ~ + 25˚C(2~3 min.)
+155˚C(30 min.) ~ + 25˚C(2~3 min.) for others
IEC 60115-1 4.6.1.1 / JIS C 5202 5.6
Test voltage: 100±15V
IEC 60115-1 4.33
Resistance change after bended on the 90mm PCB.
Bend: 3mm for 0201 , 0402 , 0603 , 0805
2mm for 1206 , 2010 , 1225 , 2512
Load Life
J,G:
△
R≦± (3% + 0.1Ω)
F,D:
△
R≦± (1% + 0.05Ω)
C,B:
△
R≦± (0.5% + 0.05Ω)
Intermittent
Overload
△
R≦± (5% + 0.1Ω)
No mechanical damage
Temperature
Cycle
J,G:
△
R≦± (1% + 0.1Ω)
F,D,C,B:
△
R≦± (0.5% + 0.05Ω)
No mechanical damage
Insulation
Resistance
Bending
Strength
Between termination and coating
must be over 1000MΩ
J,G:
△
R≦± (1% + 0.1Ω)
F,D,C,B:
△
R≦± (0.5% + 0.05Ω)
No mechanical damage
5
THICK FILM, LEAD FREE
LOW RESISTANCE CHIP RESISTORS(FCF)
SPECIFICATION AND TEST METHODS
ITEM
DC Resistance
SPECIFICATION
J :±5% , F:
±1%
TEST METHOD
IEC 60115-1 4.5 / JIS C 5202 5.1
Measure the resistance value.
IEC 60115-1 4.13 / JIS C 5202 5.5
2.5X Rated voltage or Max. Overload Voltage
for 5 sec. measure resistance after 30 minutes
IEC 60115-1 4.17 / JIS C 5202 6.5
After immersing flux, dip in the 245±2˚C
molten solder bath for 3±0.5 sec.
IEC 60115-1 4.18 / JIS C 5202 6.4
With 260±5˚C for 10±1 sec.
IEC 60115-1 4.8.4.2 / JIS C 5202 5.2
Test temperature : 25˚C (T1)→ -55˚C (T2)
25˚C (T1)→ -125˚C (T2)
TCR (ppm/˚C) =
R2-R1
R1
x
1
x 10
6
Short time
Overload
J:
△
R≦± (2% + 0.5mΩ)
F:
△
R≦± (1% + 0.5mΩ)
Solderability
Over 95% of termination
must be covered with solder
Resistance to
Solder Heat
J:
△
R≦± (1% + 0.5mΩ)
F:
△
R≦± (0.5% + 0.5mΩ)
No mechanical damage
Size : 0603 , 0805
100mΩ ~ 910mΩ:±300ppm/˚C
Size : 1206 , 2010 , 2512
50mΩ ~ 910mΩ:±200ppm/˚C
Size : 1225
20mΩ ~ 910mΩ:±100ppm/˚C
referance for other resistance
range in page 4
J:
△
R≦± (3% + 0.5mΩ)
F:
△
R≦± (1% + 0.5mΩ)
Temperature
Coefficient of
Resistance
(TCR)
T2-T1
T1: 25˚C T2: Test temperature
R1: Resistance at reference temperature (T1)
R2: Resistance at test temperature (T2)
IEC 60115-1 4.24.2 / JIS C 5202 7.9
Maintain the temperature of the resistor at 40±2˚C
and 90~95% R.H. with the rated voltage
applied.Cycle ON for 1.5 hours and OFF for 0.5 hour
for 1000+48/-0 hours. After 1~4 hour, measure the
resistance value.
IEC 60115-1 4.25.1 / JIS C 5202 7.10
Permanent resistance change after 1000+48/-0
hours (1.5 hours ON , 0.5 hour OFF) at RCWV
or Max.Keep the resistor at 70±2˚C ambient
IEC 60115-1 4.19 / JIS C 5202 7.4
Repeat 5 cycles as follows
-55˚C(30 min.) ~ + 25˚C(2~3 min.)
+125˚C(30 min.) ~ + 25˚C(2~3 min.) for 0201
-55˚C(30 min.) ~ + 25˚C(2~3 min.)
+155˚C(30 min.) ~ + 25˚C(2~3 min.) for others
IEC 60115-1 4.6.1.1 / JIS C 5202 5.6
Test voltage: 100±15V
IEC 60115-1 4.33
Resistance change after bended on the 90mm PCB.
Bend: 3mm for 0201 , 0402 , 0603 , 0805
2mm for 1206 , 2010 , 1225 , 2512
Load Life
Humidity
Load Life
J:
△
R≦± (3% + 0.5mΩ)
F:
△
R≦± (1% + 0.5mΩ)
Temperature
Cycle
J:
△
R≦± (1% + 1mΩ)
F:
△
R≦± (0.5% +1mΩ)
No mechanical damage
Insulation
Resistance
Bending
Strength
Between termination and coating
must be over 1000MΩ
J:
△
R≦± (1% + 1mΩ)
F:
△
R≦± (0.5% +1mΩ)
No mechanical damage
6
FPGA/CPLD
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