Storage Temperature Range...............................-65°C to +150°C
Lead Temperature (soldering, 10s)...................................+300°C
Soldering Temperature (reflow)........................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Note 1:
Self protected against transient voltages exceeding these limits for ≤ 50ns under normal operation and loads up to the maxi-
mum rated output current.
Package Information
PACKAGE TYPE: 10 TDFN
Package Code
Outline Number
Land Pattern Number
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
PACKAGE TYPE: 16 TSSOP
Package Code
Outline Number
Land Pattern Number
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
38.3°C/W
3°C/W
U16E+3
21-0108
90-0120
41°C/W
9°C/W
T1033+1
21-0137
90-0003
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages.
Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
www.maximintegrated.com
Maxim Integrated
│
3
MAX16904
2.1MHz, High-Voltage,
600mA Mini-Buck Converter
Electrical Characteristics
PARAMETER
Supply Voltage Range
(V
SUP
= +14V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C, unless otherwise noted.)
SYMBOL
V
SUP
(Note 2)
t < 1s
EN = low
Supply Current
I
SUP
V
UVLO
V
BIAS
I
BIAS
V
OUT
= 5V, fixed frequency
V
OUT
= 5V, SKIP mode (Note 3)
V
OUT
= 3.3V, fixed frequency
V
OUT
= 3.3V, SKIP mode (Note 3)
V
OUT
= 5V, fixed frequency
V
OUT
= 5V, SKIP mode (Note 3)
V
OUT
= 5.1V, fixed frequency
V
OUT
= 5.1V, SKIP mode (Note 3)
V
OUT
= 5.5V, fixed frequency
V
OUT
= 5.5V, SKIP mode (Note 3)
V
OUT
= 6.0V, fixed frequency
V
OUT
= 6.0V, SKIP mode (Note 3)
V
OUT
= 8.0V, fixed frequency
V
OUT
= 8.0V, SKIP mode (Note 3)
V
BIAS
= 5V
6V ≤ V
SUP
≤ 18V,
I
LOAD
= 0 to
600mA, T
A
=
-40°C to +125°C
EN = high, no load, 3V < V
OUT
< 5.5V
EN = high, continuous, no switching
UV Lockout
Bias Voltage
Bias Current Limit
BUCK CONVERTER
V
OUT
V
OUT,3.3V
V
OUT,5V
Voltage Accuracy
V
OUT,5.1V
V
OUT,5.5V
V
OUT,6.0V
V
OUT,8.0V
SKIP-Mode Peak Current
High-Side DMOS R
DS(ON)
Low-Side DMOS R
DS(ON)
DMOS Peak Current-Limit
Threshold
Soft-Start Ramp Time
LX Rise Time
Minimum On-Time
PWM Switching Frequency
SYNC Input Frequency
Range
Spread-Spectrum Range
I
SKIP
R
ON,HS
R
ON,LS
I
MAX
t
SS
t
RISE,LX
t
ON
f
SW
f
SYNC
SS
Spread-spectrum option only
Internally generated
1.925
1.8
+6
0.85
7
-2.0%
-2.0%
-2.0%
-2.0%
-2.0%
-2.0%
-2.0%
-2.0%
-2.0%
-2.0%
-2.0%
-2.0%
-2.0%
-2.0%
3.3
3.3
5
5
5.1
5.1
5.5
5.5
6.0
6.0
8.0
8.0
350
400
250
1.05
8
5
80
2.1
2.275
2.6
800
450
1.22
9
+2.5%
+4.0%
+2.5%
+4.0%
+2.5%
+4.0%
+2.5%
+4.0%
+2.5%
+4.0%
+2.5%
+4.0%
+2.5%
+4.0%
mA
mΩ
mΩ
A
ms
ns
ns
MHz
MHz
%
V
Bias rising
+5.5V ≤ V
SUP
≤ +42V
10
2.8
V
UVLO,HYS
Hysteresis
4
25
1
3
0.4
5
3.2
CONDITIONS
MIN
3.5
TYP
MAX
28
42
8
35
UNITS
V
µA
mA
V
V
mA
www.maximintegrated.com
Maxim Integrated
│
4
MAX16904
2.1MHz, High-Voltage,
600mA Mini-Buck Converter
Electrical Characteristics (continued)
PARAMETER
PGOOD
PGOOD Threshold
PGOOD Debounce
PGOOD High Leakage
Current
PGOOD Output Low Level
LOGIC LEVELS
EN Level
EN Input Current
SYNC Switching Threshold
SYNC Internal Pulldown
THERMAL PROTECTION
Thermal Shutdown
Thermal Shutdown
Hysteresis
T
SHDN
T
SHDN,HYS
V
IH,EN
V
IL,EN
I
IN,EN
V
IH,SYNC
V
IL,SYNC
R
PD,SYNC
V
THR,PGD
V
THF,PGD
t
DEB
I
LEAK,PGD
V
OUT,PGD
V
OUT
rising
V
OUT
falling
SYMBOL
(V
SUP
= +14V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C, unless otherwise noted.)
CONDITIONS
MIN
88
88
TYP
93
91
10
T
A
= +25°C, V
PGD
≤ V
OUT
Sinking 1mA
2.4
0.6
V
EN
= V
SUP
= +42V, T
A
= +25°C
1.4
0.4
200
175
15
1
1
0.4
MAX
98
94
UNITS
%
µs
µA
V
V
µA
V
kΩ
°C
°C
Note 2:
When the typical minimum on-time of 80ns is violated, the device skips pulses.
As time goes by, people are increasingly concerned about their own and their families' health. However, existing monitoring devices for individual vital signs have struggled to gain market share du...[详细]
SMT贴片机是表面贴装技术（Surface Mount Technology）中的重要设备，它的性能状态对电子制造的质量和效率有着决定性的影响。因此，对SMT贴片机的主要指标性能进行定期检测非常重要。以下是一些主要的检测项目： 定位精度：定位精度是SMT贴片机的核心性能指标，它直接影响到贴片的准确性。通常，我们通过重复测量贴片机在X、Y轴上的移动误差来检测其定位精度。 贴片速度：贴片速度...[详细]
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