Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
16 TSSOP
Junction-to-Ambient Thermal Resistance (θ
JA
)...............+38.3°C/W
Junction-to-Case Thermal Resistance (θ
JC
)......................+3°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
IN
= 12V, C
REG
= 1µF to GND, I
REG
= 0, R
CS_
= 2Ω from CS_ to GND, T
J
= T
A
= -40°C to +125°C, unless otherwise noted. Typical
values are at T
J
= T
A
= +25°C.) (Note 2)
PARAMETER
Supply Voltage Range
GND Current
LED Current-Sense Accuracy
(Note 3)
Dropout Voltage (Note 4)
Output Current Slew Rate
Output Current Leakage
CURRENT SENSE
Regulated CS_ Voltage
OVERTEMPERATURE PROTECTION
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
+5V REGULATOR (REG)
Output Voltage
REG Output Current
REG Short-Circuit Current
PWM_ Input Bias Current
PWM_ Input-Voltage High
PWM_ Input-Voltage Low
PWM_ Turn-On Delay
PWM_ Turn-Off Delay
2
SYMBOL
V
IN
I
GND
CONDITIONS
I
OUT1
= I
OUT2
= I
OUT3
=100mA
10mA < I
OUT_
< 100mA
10mA < I
OUT_
< 150mA
I
OUT_
= 100mA (current pulsed)
I
OUT_
= 150mA (current pulsed)
Current rising, V
OUT_
= 4V
V
PWM1
= V
PWM2
= V
PWM3
= 0V
V
CS1
= V
CS2
= V
CS3
MIN
6.5
TYP
5
MAX
28.0
10
5
7
UNITS
V
mA
%
V
mA/µs
∆V
DO
0.75
1.2
100
1.5
2.25
1
I
LEAK
V
CS_
µA
mV
°C
°C
190
200
165
23
210
V
REG
I
REG
I
REGSC
I
PWM
V
IH
V
IL
I
REG
= 0mA (Note 5)
4.75V < V
REG
V
REG
= 0V (Note 6)
V
PWM1
= V
PWM2
= V
PWM3
= 5V
4.75
4
15
5
40
5.25
90
1
V
mA
mA
µA
V
V
ns
ns
LOGIC INPUT (PWM1, PWM2, PWM3)
4
0.6
50% of V
PWM_
to 50% of
∆V
OUT_
50% of V
PWM_
to 50% of
∆V
OUT_
475
150
Maxim Integrated
MAX16824/MAX16825
High-Voltage, Three-Channel Linear
High-Brightness LED Drivers
ELECTRICAL CHARACTERISTICS (continued)
(V
IN
= 12V, C
REG
= 1µF to GND, I
REG
= 0, R
CS_
= 2Ω from CS_ to GND, T
J
= T
A
= -40°C to +125°C, unless otherwise noted. Typical
values are at T
J
= T
A
= +25°C.) (Note 2)
PARAMETER
OUTPUTS (OUT1, OUT2, OUT3)
Turn-On Time
Turn-Off Time
t
R
t
F
PWM_ rising time, t
R
, is measured from 20%
to 80% of I
OUT_
PWM_ falling time, t
F
, is measured from
80% to 20% of I
OUT_
1
1
µs
µs
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SPI INTERFACE (CLK, LE,
OE,
DIN, DOUT) (Figures 3 and 4)
DIN, CLK, LE,
OE
Input Bias
Current
DIN, CLK, LE,
OE
Input-Voltage
High
DIN, CLK, LE,
OE
Input-Voltage
Low
CLK Clock Period
CLK Pulse-Width High
CLK Pulse-Width Low
DIN Setup Time
DIN Hold Time
DOUT Propagation Delay
DOUT Rise/Fall Time
DOUT Voltage High
DOUT Voltage Low
LE Pulse-Width High
LE Setup Time
LE Rising to OUT_ Rising Delay
LE Rising to OUT_ Falling Delay
V
IH
V
IL
t
CP
t
CH
t
CL
t
DS
t
DH
t
DO
t
DR
/t
DF
V
DOH
V
DOL
t
LW
t
LS
t
LRR
t
LRF
50% of CLK rising to 50% of next CLK
rising, Figure 3
50% of CLK rising to 50% of CLK falling,
Figure 3
50% of CLK falling to 50% of CLK rising,
Figure 3
50% of DIN rising to 50% of CLK rising,
Figure 3
50% of CLK rising to 50% of DIN falling,
Figure 3
50% of CLK rising to 50% of DOUT rising/
falling, Figure 3
C
DOUT
= 10pF, 10% to 90% of DOUT
rising/falling edge (Note 7)
I
SOURCE
= 4mA
I
SINK
= 4mA
50% of LE rising to 50% of LE falling,
Figure 3
50% of CLK rising to 50% of LE rising,
Figure 3
50% of LE rising to 50% of OUT_ rising,
Figure 4
50% of LE rising to 50% of OUT_ falling,
Figure 4
20
15
150
475
4.5
0.5
50
24
24
5
10
5
15
V
DIN
= V
CLK
= V
LE
= V
OE
= 0 or 5V
2.2
0.5
1
µA
V
V
ns
ns
ns
ns
ns
ns
ns
V
V
ns
ns
ns
ns
Maxim Integrated
3
MAX16824/MAX16825
High-Voltage, Three-Channel Linear
High-Brightness LED Drivers
ELECTRICAL CHARACTERISTICS (continued)
(V
IN
= 12V, C
REG
= 1µF to GND, I
REG
= 0, R
CS_
= 2Ω from CS_ to GND, T
J
= T
A
= -40°C to +125°C, unless otherwise noted. Typical
values are at T
J
= T
A
= +25°C.) (Note 2)
PARAMETER
CLK Rising to OUT_ Rising Delay
CLK Rising to OUT_ Falling Delay
OE
Rising to OUT_ Rising Delay
OE
Falling to OUT_ Falling Delay
SYMBOL
t
CRR
t
CRF
t
OEH
t
OEL
CONDITIONS
50% of CLK rising to 50% of OUT_ rising,
Figure 4
50% of CLK rising to 50% of OUT_ falling,
Figure 4
50% of
OE
rising to 50% of OUT_ rising,
Figure 3
50% of
OE
falling to 50% of OUT_ falling,
Figure 3
MIN
TYP
MAX
150
475
150
475
UNITS
ns
ns
ns
ns
Note 2:
All devices are 100% production tested at T
J
= +25°C and T
J
= +125°C. Limits to -40°C are guaranteed by design.
Note 3:
This specification does not include sense resistor tolerance and ground error.
Note 4:
Dropout is measured as follows: R
CS_
= 1.21Ω from CS_ to GND. Force 100mA into OUT_ and measure the dropout voltage
from OUT_ to CS_. DVDO = (∆OUT_ - V
CS_
).
Note 5:
OUT’s current regulation varies with load across REG (see the
Typical Operating Characteristics).
Note 6:
Overtemperature protection does not function if the output of the 5V reference (REG) is shorted to ground.
Note 7:
Guaranteed by design, not production tested.
Typical Operating Characteristics
(V
IN
= 12V, C
REG
= 1µF to GND, I
REG
= 0, R
CS_
= 2Ω from CS_ to GND, T
A
= +25°C, unless otherwise noted. Typical values are at
T
A
= +25°C.)
DROPOUT VOLTAGE vs. TEMPERATURE
MAX16824toc01
CS_ VOLTAGE vs. OUTPUT CURRENT
MAX16824 toc02
OUTPUT CURRENT vs. INPUT VOLTAGE
190
170
OUTPUT CURRENT (mA)
150
130
110
90
70
50
30
10
-10
I
LOAD
= 100mA
I
LOAD
= 150mA
MAX16824 toc03
1.0
0.9
0.8
DROPOUT VOLTAGE (V)
0.7
0.207
0.202
V
CS_
(V)
0.197
0.192
0.187
0.6
0.5
0.4
0.3
0.2
0.1
0
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
I
LOAD
= 100mA
0.182
0
15 30 45 60 75 90 105 120 135 150
OUTPUT CURRENT (mA)
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28
V
IN
(V)
4
Maxim Integrated
MAX16824/MAX16825
High-Voltage, Three-Channel Linear
High-Brightness LED Drivers
Typical Operating Characteristics (continued)
(V
IN
= 12V, C
REG
= 1µF to GND, I
REG
= 0, R
CS_
= 2Ω from CS_ to GND, T
A
= +25°C, unless otherwise noted. Typical values are at
主题：自备终端(BYOD)发展趋势;用员工自己的移动设备来控制对工作设施及设备的使用，会对信息安全产生怎样的影响;在不使公司有安全风险或不损害员工隐私的前提下，有哪些方式能安全地实现这样的设施及设备使用。 自备终端(Bring Your Own Device，简称BYOD)，即企业允许员工离职时保留自己的手机，这种做法正日益流行。如今智能手机功能也越来越多，我们不仅能用自己的手机访问电脑、网...[详细]
与云数据库相比，小型计算机是专门为网络边缘的去中心化坚固计算而构建的。通过将应用程序、分析和处理服务移动到更靠近数据生成源的位置，业务运营可以获得改进的实时计算应用程序性能。 l 从奔腾到酷睿i5的可扩展CPU性能 l 智能电源点火管理和CAN总线网络支持 l 无线局域网和广域网LTE连接 l 丰富的I/O可扩展性，包括PoE、PCI、PCIe、COM l 适用于宽工作温度和宽电压输入的坚固...[详细]
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
