Datasheet> 器件分类 > 无源元件> 电阻器> WBC-T0303AG-07-1931-DB

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WBC-T0303AG-07-1931-DB: 产品描述Array/Network Resistor, Center Tap, Thin Film, 0.25W, 1930ohm, 100V, 0.5% +/-Tol, -25,25ppm/Cel, 0303,; 产品类别无源元件电阻器; 文件大小376KB，共3页; 制造商TT Electronics plc; 官网地址http://www.ttelectronics.com/; 标准

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WBC-T0303AG-07-1931-DB概述

Array/Network Resistor, Center Tap, Thin Film, 0.25W, 1930ohm, 100V, 0.5% +/-Tol, -25,25ppm/Cel, 0303,

WBC-T0303AG-07-1931-DB规格参数

参数名称	属性值
是否Rohs认证	符合
Objectid	802630743
Reach Compliance Code	compliant
ECCN代码	EAR99
构造	Chip
网络类型	Center Tap
端子数量	6
最高工作温度	150 °C
最低工作温度	-55 °C
封装长度	0.762 mm
封装形式	SMT
封装宽度	0.762 mm
包装方法	Tray
额定功率耗散 (P)	0.25 W
参考标准	MIL-PRF-38534
电阻	1930 Ω
电阻器类型	ARRAY/NETWORK RESISTOR
系列	WBC(TAPPED)
尺寸代码	0303
技术	THIN FILM
温度系数	25 ppm/°C
容差	0.5%
工作电压	100 V

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Wire Bondable

Chip Resistors

WBC Series

•

Discrete or tapped schematics

•

MIL inspection available

•

High resistor density

IRC Advanced Film Division

IRC’s WBC series wire bondable chip resistors are ideally suited for

the most demanding hybrid application. The WBC combines IRC’s

TaNSil

tantalum nitride thin ﬁlm technology with silicon substrate processing to produce an extremely small

footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil

resistor ﬁlm.

Available in a wide range of tolerances and temperature coefﬁcients to ﬁt a variety of hybrid circuit applica-

tions. Custom resistance values, sizes and schematics are available on request from the factory.

Physical Data

R0202 - Discrete

(0.508mm ±0.025)

0.020˝ ±0.001

Electrical Data

Absolute Tolerance

Absolute TCR

Package Power Rating

(@ 70°C)

Rated Operating Voltage

(not to exceed

√

P x R )

Operating Temperature

Back contact

Noise

Substrate Material

Top contact

Substrate Thickness

Aluminum

Gold

R0202 and

T0303

B0202

Passivation

to ±0.1%

to ±25ppm/°C

250mW

100V

-55°C to +150°C

<-30dB

Oxidized Silicon

(10KÅ SiO

min)

0.010˝ ±0.001

(0.254mm ±0.025)

10KÅ minimum

15KÅ minimum

Silicon

(Gold available)

Gold

3KÅ minimum

Silicon Dioxide or

Silicon Nitride

0.004˝ min bond pad size

0.020˝ ±0.001

(0.508mm ±0.025)

B0202 - Discrete back contact

(0.508mm ±0.025)

0.020˝ ±0.001

Top contact

pad chamfered

0.004˝ min bond pad size

0.020˝ ±0.001

(0.508mm ±0.025)

T0303 - Tapped network ½R + ½R

Bond Pad

Metallization

(0.762mm ±0.025)

0.030˝ ±0.001

Backside

½R

0.030˝ ±0.001

(0.762mm ±0.025)

0.004˝ min bond pad size

General Note

IRC reserves the right to make changes in product speciﬁcation without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

• Corpus Christi Texas 78411 USA

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com

A subsidiary of

TT electronics plc

WBC Series Issue April 2006

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